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Intel Talks More About Skylake
A new Intel roadmap suggests the first Broadwell LGA parts will launch in Q2, while Skylake-S parts will come in Q3.
The roadmap was published by PC Online and points to two Broadwell LGA launches this quarter – the Core i7-5775C and Core i5-5675C. These two parts will be joined by a total of four Skylake-S products in Q3, the Core i7-6700K, Core i7-6700, Core i5-6600K, Core i5-6600 and the Core i5-6500.
Both Skylake-S and Broadwell LGA will replace the current crop of Haswell parts, including Devil’s Canyon products. However, Broadwell LGA sits one tier above Skylake-S and Haswell-based products.
Starting in Q4, we should see more Broadwell LGA parts, but we don’t have any names yet. In the first quarter of 2016, we can also expect new Skylake-S parts.
Speaking of 2016, Intel plans to unleash the Broadwell-E in the first quarter of 2016. Little is known about Broadwell-E, but the new 14nm flagship is expected to sport eight cores. Clocks remain unknown, although the 14nm node promises substantial gains.
AMD To Power Samsung’s Digital Media
AMD’s Embedded R-Series accelerated processing unit, previously codenamed “Bald Eagle,” is powering Samsung’s latest set-back-box digital media players.
Bald Eagle was designed for high performance at low power with broad connectivity but mostly for digital signage.
It seems that new Samsung SBB-B64DV4 is intended for demanding signage applications that transform Samsung SMART Signage Displays into digital tools for a wide range of business needs.
The chipmaker claimed that by using its Embedded R-Series APUs, Samsung SBB media players for digital signage can manage HD graphics performance and support multivideo stream capabilities up to two displays, in a power efficient and ultra-compact form factor.
Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that digital signage is a key vertical for the AMD Embedded business.
“The AMD Embedded R-Series APU enables leading digital signage providers to harness high levels of compute and graphics performance within a low-power design envelope. AMD Embedded Solutions help designers at Samsung achieve aggressive form factor goals and drive down system costs while providing the rich multimedia their digital signage customers’ demand,” he said.
The AMD Embedded RX-425BB APU combines an x86 CPU with an integrated, discrete-class AMD Radeon R6 graphics processing unit in a low-power configuration to minimize heat dissipation constraints and meet energy efficiency requirements.
The processor uses AMD’s latest Graphics Core Next architecture, created for advanced graphics applications and parallel processing capabilities.
Intel Sends Braswell SoC To Partners
Intel announced that it is now shipping the Bay Trail system on a chip (SoC) successor codenamed Braswell to OEM partners.
Announced almost exactly a year ago at Intel’s Developer Forum in Beijing, Braswell is a more powerful version of Bay Trail running on the 14nm fab process, designed to power low-cost devices like Chromebooks and budget PCs.
The chip maker said that devices will hit the market sometime in late summer or autumn.
“We expect Braswell-based systems to be available in the market for the back to school 2015 selling season,” an Intel representative told The INQUIRER. “Specific dates and options will be announced by our OEM partners.”
That’s all Intel will give us for now, but we were told that full details regarding the upcoming chip will be revealed at IDF in Shenzhen next week.
Braswell was expected to arrive at the end of 2014 when it was originally unveiled last year.
Kirk Skaugen, general manager of Intel’s PC Client group, said that it will replace Bay Trail as part of the Atom line, and will feature in over 20 Chromebook designs.
“Last year, we had only four designs on Chrome. Today I can announce that we will have over 20 designs on Chrome,” said Skaugen at the time.
Intel recently announced another 14nm chip, the Atom x range, previously codenamed Cherry Trail, although this will be focused on tablets rather than the value PC market segment and Chromebooks like Braswell.
In terms of power, Braswell is likely to fit snuggly above the Atom x5 and x7 Cherry Trail SoCs and beneath the firm’s recently announced 5th-generation Core products, previously codenamed Broadwell.
Unveiled at Mobile World Congress earlier this year, Intel’s Atom x5 and x7 chips, previously codenamed Cherry Trail, are also updates to the previous Bay Trail Atom line-up, being the first Intel Atom SoCs on 14nm.
These higher-powered SoCs are designed to bring improved 3D performance to mainstream premium handheld devices running full versions of Windows and Android, such as 7in to 10.1in tablets and 2-in-1 hybrid laptops priced at around $119 to $499.
For example, Microsoft quietly announced on Tuesday that the upcoming Surface 3 tablet-laptop hybrid will be powered by an Intel Atom x7. The device is priced at $500.
Intel Debuts The N3000 Series SoC
Intel has launched Intel N3000 series systems on a chip (SoCs), which will kill off Bay Trail-M and Bay Trail-D SoCs on the desktop and mobile PCs.
CPU World also has spotted some other chips which have been revealed to the world.
Intel has also launched desktop and mobile Core i3 and Pentium microprocessors. New mobile models are Pentium 3825U, Core i3-5015U and i3-5020U. These ones are based on Broadwell 14nm.
Core i3-5015U and i3-5020U are dual-cores with Hyper-Threading technology, HD 5500 graphics and ultra low 15 Watt TDP. The processors run at 2.1 GHz and 2.2 GHz. This is 100 MHz higher than the i3-5005U and i3-5010U models, that were launched three months ago.
The i3-5015U and i3-5020U chips offer a 50 MHz higher graphics boost. Official prices of these SKUs are $275 and $281.
The Pentium 3825U incorporates a couple of enhancements on the older Pentium 3805U. It supports Hyper-Threading that allows it to process twice as many threads. It also has base and maximum graphics frequencies increased to 300 MHz and 850 MHz.
The 3805U and 3825U operate at 1.9 GHz and have 2 MB L2 cache. The 3825U processor is rated at 15 Watt TDP, and priced at $161.
Toshiba And SanDisk Launch 3D Flash Chip
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Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.
The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.
Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.
24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.
“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.
“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”
Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.
Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.
The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.
All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.
Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.
Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.
This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.
The Toshiba and Sandisk BiCS chips are available for sampling from today.
Will Intel Release Skylake This Year?
Intel has confirmed that it will release Core M processors this year based on its new Skylake chip design.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
Will AMD’s Kaveri Launch As Godavari?
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The new desktop refresh according to SweClockers is going to end up with A10-8850K branding. The new processor will get a 100MHz faster turbo clock and is based on the same 28nm manufacturing process. The base CPU clock for the A10-8850K is 3.7GHz, the same speed as the AMD A10-7850K, but the Turbo clock will jump to 4.1GHz with the new one. The A10-7850K has 4.0 GHz top turbo clock and 720 MHz GPU speed for its GCN Sea Island GPU.
The new A10-8850K will get the GPU to 856MHz. The memory speed supported stays at 2133MHz and the socket of choice remains FM2+. The TDP stays at 95W.
As you can see this is a small evolution and you can expect some cool parts for AMD on the desktop side in the latter part of 2016, some eighteen months from now, in 14nm.
Will Intel Assist Apple?
Apple is apparently having problems getting its partners to make 3-D transistors that go.
Drexel Hamilton’s chip analyst Rick Whittington [no really] made a comment that Intel might be getting ready to bail Apple out while he was having a chat about Micron. In passing, Whittington noted problems had by Taiwan Semiconductor and Samsung Electronics trying to produce 3-D transistors in any useful yield.
He noted that Intel has mastered 3-D transistors, and said that it would be very good for Intel if neither Samsung or TSM can do FinFET this next year; puts them in line to supply Apple’s internal foundry needs.
However he admitted that it was more that TSM/Samsung would operate FinFET under very low yield output and keep capacity tight.
Of course if Jobs’ Mob don’t want that they can always rush into the loving arms of Chipzilla – again. As happened with Saphire glass Apple has shown that it can dump a partner quickly if it does not move fast enough.
Intel Investing Big In Isreal
Intel is investing a further $550 million in Israel, more specifically in the upgrade of its Fab 28 in Kiryat Gat.
According to Israel21c, this will bring the total scope of Intel investments in Israel to over $6 billion since 2006. The Kiryat Gat facility is likely to be one of the first Intel 10nm fabs.
Israeli Ministry of Economy official Ziva Eger said the investment will help create thousands of jobs and reinforce the country’s standing as a world leader in technology.
“The agreement signed today between the Industrial Cooperation Authority and Intel is another expression of Intel’s contribution by way of its purchase of equipment, new technologies and Israeli products developed together with Intel,” said CEO of Intel Israel Maxine Fassberg.
Fab 28 currently churns out 22nm silicon for Intel. The fab was passed over for the 14nm upgrade. A source familiar with the matter told us that Israel competes with Ireland for every node upgrade.
“We lost 14nm to Ireland and won 10nm,” the source said.
Israel is currently in a better position to offer incentives and subsidies for such investments, as Ireland’s ‘business-friendly’ tax policies are being scrutinized by the European Union.
Intel is expected to launch the first 10nm CPU in 2016, followed by 7nm parts a couple of years later.
Intel To Add Broadwell To NUC Series
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Intel is planning to update its rather successful NUC (Next Unit of Computing) series and as you can expect, they will come with Broadwell CPUs inside.
Intel isn’t hiding the external design of the new cases and there is a dominant yellow connector at the front of the new NUC, and this one should be providing charging power even when the device is turned off.
The board comes with either M2 storage or single SATA and there will be two different designs one exclusively for M2 drive and the second taller that will be able to take 2.5 inch SSD or HDD as well.
We will probably learn more details at CES 2015 that is about to start in less than three weeks from now, but the Broadwell in this small form factor will get a speed boost and some future prove technologies such as M2 SSD support.
We are running Core i5 4200 powered NUC with Windows 10 and it really works great powered by 240GB Kingston mS200 mSata SSD and Impact SO DIMM memory. These machines takes less than half an hour to assemble and boot into windows, including Windows 10 and make a perfect choice for the lovers of quiet computing.
The new version will obviously run at least slightly faster than the one we are testing and the marketing is excluding about “the one with the yellow USB connector”.