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Intel Sends Braswell SoC To Partners
Intel announced that it is now shipping the Bay Trail system on a chip (SoC) successor codenamed Braswell to OEM partners.
Announced almost exactly a year ago at Intel’s Developer Forum in Beijing, Braswell is a more powerful version of Bay Trail running on the 14nm fab process, designed to power low-cost devices like Chromebooks and budget PCs.
The chip maker said that devices will hit the market sometime in late summer or autumn.
“We expect Braswell-based systems to be available in the market for the back to school 2015 selling season,” an Intel representative told The INQUIRER. “Specific dates and options will be announced by our OEM partners.”
That’s all Intel will give us for now, but we were told that full details regarding the upcoming chip will be revealed at IDF in Shenzhen next week.
Braswell was expected to arrive at the end of 2014 when it was originally unveiled last year.
Kirk Skaugen, general manager of Intel’s PC Client group, said that it will replace Bay Trail as part of the Atom line, and will feature in over 20 Chromebook designs.
“Last year, we had only four designs on Chrome. Today I can announce that we will have over 20 designs on Chrome,” said Skaugen at the time.
Intel recently announced another 14nm chip, the Atom x range, previously codenamed Cherry Trail, although this will be focused on tablets rather than the value PC market segment and Chromebooks like Braswell.
In terms of power, Braswell is likely to fit snuggly above the Atom x5 and x7 Cherry Trail SoCs and beneath the firm’s recently announced 5th-generation Core products, previously codenamed Broadwell.
Unveiled at Mobile World Congress earlier this year, Intel’s Atom x5 and x7 chips, previously codenamed Cherry Trail, are also updates to the previous Bay Trail Atom line-up, being the first Intel Atom SoCs on 14nm.
These higher-powered SoCs are designed to bring improved 3D performance to mainstream premium handheld devices running full versions of Windows and Android, such as 7in to 10.1in tablets and 2-in-1 hybrid laptops priced at around $119 to $499.
For example, Microsoft quietly announced on Tuesday that the upcoming Surface 3 tablet-laptop hybrid will be powered by an Intel Atom x7. The device is priced at $500.
Intel Debuts The N3000 Series SoC
Intel has launched Intel N3000 series systems on a chip (SoCs), which will kill off Bay Trail-M and Bay Trail-D SoCs on the desktop and mobile PCs.
CPU World also has spotted some other chips which have been revealed to the world.
Intel has also launched desktop and mobile Core i3 and Pentium microprocessors. New mobile models are Pentium 3825U, Core i3-5015U and i3-5020U. These ones are based on Broadwell 14nm.
Core i3-5015U and i3-5020U are dual-cores with Hyper-Threading technology, HD 5500 graphics and ultra low 15 Watt TDP. The processors run at 2.1 GHz and 2.2 GHz. This is 100 MHz higher than the i3-5005U and i3-5010U models, that were launched three months ago.
The i3-5015U and i3-5020U chips offer a 50 MHz higher graphics boost. Official prices of these SKUs are $275 and $281.
The Pentium 3825U incorporates a couple of enhancements on the older Pentium 3805U. It supports Hyper-Threading that allows it to process twice as many threads. It also has base and maximum graphics frequencies increased to 300 MHz and 850 MHz.
The 3805U and 3825U operate at 1.9 GHz and have 2 MB L2 cache. The 3825U processor is rated at 15 Watt TDP, and priced at $161.
Toshiba And SanDisk Launch 3D Flash Chip
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Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.
The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.
Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.
24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.
“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.
“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”
Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.
Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.
The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.
All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.
Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.
Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.
This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.
The Toshiba and Sandisk BiCS chips are available for sampling from today.
Intel Shows Off The Xeon SoC
Intel has announced details of its first Xeon system on chip (SoC) which will become the new the Xeon D 1500 processor family.
Although it is being touted as a server, storage and compute applications chip at the “network edge”, word on the street is that it could be under the bonnet of robots during the next apocalypse.
The Xeon D SoCs use the more useful bits of the E3 and Atom SoCs along with 14nm Broadwell core architecture. The Xeon D chip is expected to bring 3.4x better performance per watt than previous Xeon chips.
Lisa Spelman, Intel’s general manager for the Data Centre Products Group, lifted the kimono on the eight-core 2GHz Xeon D 1540 and the four-core 2.2GHz Xeon D 1520, both running at 45W. It also features integrated I/O and networking to slot into microservers and appliances for networking and storage, the firm said.
The chips are also being touted for industrial automation and may see life powering robots on factory floors. Since simple robots can run on basic, low-power processors, there’s no reason why faster chips can’t be plugged into advanced robots for more complex tasks, according to Intel.
Will Intel Release Skylake This Year?
Intel has confirmed that it will release Core M processors this year based on its new Skylake chip design.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
Intel Gives Exascale A Boost
Intel’s exascale computing efforts have received a boost with the extension of the company’s research collaboration with the Barcelona Supercomputing Center.
Begun in 2011 and now extended to September 2017, the Intel-BSC work is currently looking at scalability issues with parallel applications.
Karl Solchenbach, Intel’s director, Innovation Pathfinding Architecture Group in Europe said it was important to improve scalability of threaded applications on many core nodes through the OmpSs programming model.
The collaboration has developed a methodology to measure these effects separately. “An automatic tool not only provides a detailed analysis of performance inhibitors, but also it allows a projection to a higher number of nodes,” says Solchenbach.
BSC has been making HPC tools and given Intel an instrumentation package (Extrae), a performance data browser (Paraver), and a simulator (Dimemas) to play with.
Charlie Wuischpard, VP & GM High Performance Computing at Intel said that the Barcelona work is pretty big scale for Chipzilla.
“A major part of what we’re proposing going forward is work on many core architecture. Our roadmap is to continue to add more and more cores all the time.”
“Our Knights Landing product that is coming out will have 60 or more cores running at a slightly slower clock speed but give you vastly better performance,” he said.
Slack Acquires Screen Hero
February 11, 2015 by admin
Filed under Around The Net
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Slack, the IRC-for-businesses company, has acquired screen-sharing collaboration startup Screenhero with an eye toward adding valuable new communications capabilities to its software.
The deal, which was for an undisclosed sum of cash and stocks, sees Screenhero’s six-person team joining Slack to add screensharing, video chat and voice conferencing to the company’s core enterprise chat room service.
Screenhero is designed to let big teams work together like small teams and has found a dedicated customer base with developers, help desk workers and anybody else who has to work together.
That’s a smart alignment with Slack’s own sales pitch. In fact, Screenhero CEO and co-founder Jahanzeb Sherwani said that 50% of Screenhero’s own customers are also Slack customers, even as both companies made use of each others’ products interally. He added that the company was “under no pressure to sell,” but decided that cozying up with Slack would allow Screenhero to do more with its core concept faster.
It sounds like a match made in “in a Reese’s factory,” quipped Slack CEO and co-founder Stewart Butterfield.
Under this deal, Screenhero will continue to operate as a separate entity, and people can use it as they always have been. But eventually, Sherwani said, all of its features will make it into Slack and the standalone product will be discontinued.
Butterfield said that it’s just a natural progression for Slackas it goes after “bigger and weirder” companies. You can still use whatever external services you’d like for video, voice and screen sharing, per Slack’s emphasis on supporting as many services as a customer might want to use with slick native integrations. But Butterfield wants to ensure that out of the box, Slack customers get something broadly useful for collaboration without having to go through the effort.
Microsoft Unveils Hologram Visor
February 4, 2015 by admin
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Microsoft Corp surprised the tech world with the unveiling of a prototype hologram visor that can bring the Minecraft video game, Skype calls and even the landscape of Mars to three-dimensional life.
The veteran tech pioneer, which long ago lost the mantle of the world’s most inventive company, is making a bold play to regain that title in the face of stiff competition from Google Inc and Apple Inc.
Virtual or enhanced reality is the next frontier in computing interaction, with Facebook Inc focusing on its Oculus virtual reality headset and Google working on its Glass project.
Microsoft said its wire-free Microsoft HoloLens device will be available around the same time as Windows 10 this autumn. Industry analysts were broadly excited at the prospect, but skeptical that it could produce a working model at a mass-market price that soon.
“That was kind of a ‘Oh wow!’ moment,” said Mike Silver, an analyst at Gartner who tried out the prototype on Wednesday. “You would expect to see a relatively high-priced model this year or next year, then maybe it’ll take another couple of years to bring it down to a more affordable level.”
Microsoft does not have a stellar record of bringing ground-breaking technology to life. Its Kinect motion-sensing game device caused an initial stir but never gripped the popular imagination.
The company showed off a crude test version of the visor – essentially jerry-rigged wires and cameras pulled over the head – to reporters and industry analysts at a gathering at its headquarters near Seattle.
It did not allow any photographs or video of the experience, but put some images on its website.
HP Has Two More Tablets In Route
HP is about to put out two tablets later this year.
The names are expected to be the HP Pro Slate 10 EE G1 and HP Pro Tablet 10 EE G1 and they were found on the world wide wibble by Notebook Italia,.
Both tablets are powered by an Intel quad-core Bay Trail Atom Z3735F processor. Accompanying the processor package is 2GB of RAM, as well as 32GB of internal storage. Both the Pro Slate and Pro Tablet come with 10.1-inch displays, as well as 802.11n Wi-Fi, Bluetooth, and NFC.
The Pro Slate sticks with Android, while the Pro Tablet opts for Windows 8.1. The tablets mean they will each come with a stylus, but it would appear that the stylus is just a stand in for your finger, rather than doing anything useful.
Pro Slate will set you back $400.00 and Pro Tablet cost $499.
HP has yet to officially announce either device.
Will Intel Assist Apple?
Apple is apparently having problems getting its partners to make 3-D transistors that go.
Drexel Hamilton’s chip analyst Rick Whittington [no really] made a comment that Intel might be getting ready to bail Apple out while he was having a chat about Micron. In passing, Whittington noted problems had by Taiwan Semiconductor and Samsung Electronics trying to produce 3-D transistors in any useful yield.
He noted that Intel has mastered 3-D transistors, and said that it would be very good for Intel if neither Samsung or TSM can do FinFET this next year; puts them in line to supply Apple’s internal foundry needs.
However he admitted that it was more that TSM/Samsung would operate FinFET under very low yield output and keep capacity tight.
Of course if Jobs’ Mob don’t want that they can always rush into the loving arms of Chipzilla – again. As happened with Saphire glass Apple has shown that it can dump a partner quickly if it does not move fast enough.