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AMD’s Carrizo Coming In The Second Quarter
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
AMD Headed To The Facial Recognition Space
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AMD has developed facial recognition technology to enable users to organize and search video clips based on the people featured in them.
AMD executive Richard Gayle demonstrated to Tom’s Guide how AMD Content Manager, uses facial recognition to browse through a group of local videos to find specific faces.
There is an index that displays the people’s faces that have been detected throughout the video clips.
The user can edit the names of the people as well as add keyword tags to help improve future searches for specific people.
For instance, if you are searching for videos that feature one person, you can click on his or her respective face to pull up the corresponding videos.
Additionally, if you want to narrow a search to a specific person combined with a keyword tag, you can drag the face icon and click on the desired keyword.
Once you click on the video you wish to view, a player appears in the right windowpane, along with a timeline displayed at the bottom with a list of all the people who appear in the video.
The timeline is separated into various coloured boxes to mark the exact moment in the video when each person first appears on screen, so you do not have to watch the entire video to see the bit you want.
The application also has facial recognition capabilities that allow users to do some basic editing, such as compiling a single montage video of any individual or individuals.
While this is pretty good technology, it probably does not have any major use yet on its own.
Gayle said it is unlikely that AMD will release Content Manager in its current form but will license it to OEMs that are able to rebrand the application before offering it on their respective systems.
He claimed that only AMD processors have sufficient power to operate the application, because of the processor’s ability to have the CPU, GPU and memory controller work closely together.
AMD’s Fiji GPU Goes High Bandwidth
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.
MediaTek Cuts Xiaomi
The dark satanic rumour mill manufactured a hell on earth rumour that MediaTek has stopped supplying chips to Xiaomi.
MediaTek is apparently cross that Xiaomi has been investing in SoC supplier Leadcore Technology. Xiaomi has reportedly reached a deal with Leadcore allowing the phone maker to get access to the chip designer’s technology patents. DigiTimes however suggests that MediaTek has been trying to expand its presence in the mid-range and high-end market segments, but finds Xiaomi’s pricing strategy is disrupting its plans.
MediaTek’s MT6589T, a quad-core 1.5GHz chip, was originally designed to target mid-range and high-end mobile devices. The solution was introduced in Xiaomi’s Redmi smartphone in August 2013. However, prices for the Redmi series have been cut to as low as $114.
Xiaomi is ranked as the third largest smartphone vendor worldwide in the third quarter of 2014. Xiaomi’s shipments for the quarter registered a 211.3 per cent on-year jump boosting its market share to 5.3 per cent from 2.1 per cent during the same period of 2013.
Will The Chip Industry Take Fall?
Microchip Technology has managed to scare Wall Street by warning of an industry downturn. This follows rumours that a number of US semiconductor makers with global operations are reducing demand for chips in regions ranging from Asia to Europe.
Microchip Chief Executive Steve Sanghi warned that the correction will spread more broadly across the industry in the near future. Microchip expects to report sales of $546.2 million for its fiscal second quarter ending in September. The company had earlier forecast revenue in a range of $560 million to $575.9 million. Semiconductor companies’ shares are volatile at the best of times and news like this is the sort of thing that investors do not want to hear.
Trading in Intel, whiich is due to report third quarter results tomorrow, was 2.6 times the usual volume. Micron, which makes dynamic random access memory, or DRAM, was the third-most traded name in the options market. All this seems to suggest that the market is a bit spooked and much will depend on what Chipzilla tells the world tomorrow as to whether it goes into a nosedive.
MediaTek Goes IoT
SoC designer MediaTek has launched a new push to develop technologies used in wearables and Internet-of-Things (IoT) devices.
Dubbed MediaTek Labs, the new organisation will offer tools for developers such as software and hardware development kits (SDKs and HDKs), but it will also offer other forms of support, i.e. tech support and marketing.
MediaTek LinkIt dev platform
The MediaTek LinkIt platform promises to offer a full-service approach for developers keen to enter the space. It allows developers familiar with MediaTek’s Arduino implementation to quickly migrate to the new platform
For the time being the platform is limited to the MediaTek Aster MT2502A processor. The company says it is the world’s smallest commercially available SoC. The chip can work with MediaTek’s WiFi and GPS companion chipsets.
The company is calling on developers to join the MediaTek Labs initiative and in case you are interested you can check out the details on the new MediaTek Labs website.
MediaTek Aster spec
Now for some juicy hardware. The Aster MT2502A is an ARM7 EJ-S part clocked at 260MHz. The dev board features 4MB of RAM and 16MB of flash. GPS and WiFi capability can be added using the MT3332 and MT5931 chips. The platform supports microSD, Bluetooth (including BLE), along with GSM and GPRS communications.
The Aster is clearly not an SoC for feature packed wearables with high resolution screens, but it could be used in more down to earth applications such as fitness trackers.
MediaTek says it will offer three platforms based on two wearable solutions. The One Application Use (OAU) platform is for fitness trackers and simple Bluetooth devices. The Simple Application Platform (SAU) is intended for smart watches, wristbands and more elaborate fitness trackers.
SAU is the focus segment for the Aster chipset and it should offer 5 to 7 days of battery life.
MediaTek Rich Application Platform
The Rich Application Platform (RAU) is for Android Wear and it will offer a lot more functionality out of the box, including camera support, 3D graphics, as well as Bluetooth, WiFi and GPS in the same package.
This platform sounds a bit more interesting, but details are sketchy. For some reason many media outlets erroneously described the first Aster chip as MediaTek’s only smartwatch chip, but it is clearly not intended for the Rich Application Platform.
We have yet to see what sort of silicon MediaTek can conjure up for high-end wearables, but this is what it has in mind. The platform is designed for high-end smartwatches and glasses. It will feature multicore processors clocked at 1GHz or more. The platform also includes Bluetooth, GSM/GPRS, GPS, WiFi, sensors and a proper TFT screen. Battery life is described as short, two to three days, which sounds a bit better than what the current generation of smartwatches can deliver.
nVidia Finally Goes 20nm
For much of the year we were under the impression that the second generation Maxwell will end up as a 20nm chip.
First-generation Maxwell ended up being branded as Geforce GTX 750 and GTX 750 TI and the second generation Maxwell launched a few days ago as the GTX 980 and Geforce GTX 970, with both cards based on the 28nm GM204 GPU.
This is actually quite good news as it turns out that Nvidia managed to optimize power and performance of the chip and make it one of the most efficient chips manufactured in 28nm.
Nvidia 20nm chips coming in 2015
Still, people keep asking about the transition to 20nm and it turns out that the first 20nm chip from Nvidia in 20nm will be a mobile SoC.
The first Nvidia 20nm chip will be a mobile part, most likely Erista a successor of Parker (Tegra K1).
Our sources didn’t mention the exact codename, but it turns out that Nvidia wants to launch a mobile chip first and then it plans to expand into 20nm with graphics.
Unfortunately we don’t have any specifics to report.
AMD 20nm SoC in 2015
AMD is doing the same thing as its first 20nm chip, codenamed Nolan, is an entry level APU targeting tablet and detachable markets.
There is a strong possibility that Apple and Qualcomm simply bought a lot of 20nm capacity for their mobile modem chips and what was left was simply too expensive to make economic sense for big GPUs.
20nm will drive the voltage down while it will allow higher clocks, more transistors per square millimeter and it will overall enable better chips.
Just remember Nvidia world’s first quad-core Tegra 3 in 40nm was rather hot and making a quad core in 28nm enabled higher performance and significantly better battery life. The same was true of other mobile chips of the era.
We expect similar leap from going down to 20nm in 2015 and Erista might be the first chip to make it to 20nm. A Maxwell derived architecture 20nm will deliver even more efficiency. Needless to say AMD plans to launch 20nm GPUs next year as well.
It looks like Nvidia’s 16nm FinFET Parker processor, based on the Denver CPU architecture and Maxwell graphics won’t appear before 2016.
Applied Materials Makes A Profit
Chip-equipment maker Applied Materials has surprised most of the cocaine nose jobs of Wall Street with a better-than-expected third-quarter profit. It appears that contract manufacturers are spending more on technology used to make smartphone and memory chips.
The company also forecast current-quarter adjusted profit largely above analysts’ average estimate. Chief Executive Gary Dickerson said that demand for DRAM chips is expected to grow in the current quarter.
Applied Materials, which also provides equipment to make flat panel displays and solar cells, forecast an adjusted profit of 25-29 cents per share for the fourth quarter. Wall Street was expecting a profit of 26 cents per share.
Applied Materials expects revenue growth of about 10 to 17 percent, implying revenue of $2.19 billion to $2.33 billion for the quarter. Analysts on average were expecting $2.28 billion. Applied Materials’ net income rose to $301 millionin the third quarter ended July 27, from $168 milliona year earlier. Revenue rose 14.7 percent to $2.27 billion.
Revenue in the company’s silicon systems business, which brings in about two-thirds of total sales, rose 16 percent to $1.48 billion.
Intel Discusses SoFIA
Intel has shed more light on its upcoming SoFIA SoC, which stands for Smart of Feature Phone with Intel Architecture. For SEO purposes we’ll just call it Sophie.
The SoFIA project is being spearheaded by Intel’s Singapore office and CNET had a chance to catch up with recent developments. The chip was announced back in December, but details were sketchy and to some extent they still are.
SoFIA is going after MediaTek and Qualcomm in the mainstream and entry level segments. It features a dual-core Silvermont processor on a 28nm die. This is where it gets interesting, as Intel simply doesn’t do 28nm. SoFIA will be manufactured by TSMC instead, but Intel is planning to build SoFIA chips in-house in the future. The company has already made it clear that it is moving to 14nm, so there is a good chance the next generation chip will be a 14nm design churned out by Intel fabs.
SoFIA has an integrated 3G modem, but a 4G version is coming later. Bluetooth and WiFi are on other chips. Lack of 4G connectivity might not be a big deal for potential SoFIA customers, as the chip is supposed to go after entry level smartphone designs. Intel told CNET that SoFIA could pave the way to $50 smartphones in Asian markets and realistically nobody expects a $50 phone to feature 4G connectivity.
It is hard to say anything about SoFIA’s real-world performance. Quad-core tablet processors based on the Silvermont architecture can still hold their ground against many high-end ARM SoCs, so a dual-core version optimised for smartphones should have no trouble keeping up with lesser ARM parts.
AMD’s Carrizo Goes Mobile Only
AMD’s upcoming Carrizo APU might not make it to the desktop market at all.
According to Italian tech site bitsandchips.it, citing industry sources, AMD plans to limit Carrizo to mobile parts. Furthermore the source claims Carrizo will not support DDR4 memory. We cannot confirm or deny the report at this time.
If the rumours turn out to be true, AMD will not have a new desktop platform next year. Bear in mind that Intel is doing the exact same thing by bringing 14nm silicon to mobile rather than desktop. AMD’s roadmap previously pointed to a desktop Carrizo launch in 2015.
AMD’s FM2+ socket and Kaveri derivatives would have to hold the line until 2016. The same goes for the AM3+ platform, which should also last until 2016.
Not much is known about Carrizo at the moment, hence we are not in a position to say much about the latest rumours. AMD’s first 20nm APU will be Nolan, but Carrizo will be the first 20nm big core. AMD confirmed a number of delays in a roadmap leaked last August.
The company recently confirmed its first 20nm products are coming next year. In all likelihood AMD will be selling 32nm, 28nm and 20nm parts next year.