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IBM Goes Linux
IBM reportedly will invest $1bn in Linux and other open source technologies for its Power system servers.
The firm is expected to announce the news at the Linuxcon 2013 conference in New Orleans, pledging to spend $1bn over five years on Linux and related open source technologies.
The software technology will be used on IBM’s Power line of servers, which are based on the chip technology of the same name and used for running large scale systems in data centres.
Previously IBM Power systems have mostly run IBM’s proprietary AIX version of Unix, though some used in high performance computing (HPC) configurations have run Linux.
If true, this will make the second time IBM coughs up a $1bn investment in Linux. IBM gave the open source OS the same vote of confidence around 13 years ago.
According to the Wall Street Journal, IBM isn’t investing in Linux to convert its existing AIX customers, but instead Linux will help support data centre applications driving big data, cloud computing and analytics.
“We continue to take share in Unix, but it’s just not growing as fast as Linux,” said IBM VP of Power development Brad McCredie.
The $1bn is expected to go mainly for facilities and staffing to help Power system users move to Linux, with a new centre being opened in France especially to help manage that transition.
Full details are planned to be announced at Linuxcon later today.
Last month, IBM swallowed Israeli security firm Trusteer to boost its customers’ cyber defences with the company’s anti-hacking technology.
Announcing that it had signed a definitive agreement with Trusteer to create a security lab in Israel, IBM said it planned to focus on mobile and application security, counter-fraud and malware detection staffed by 200 Trusteer and IBM researchers.
Dell Promises ExaScale By 2015
Dell has claimed it will make exascale computing available by 2015, as the firm enters the high performance computing (HPC) market.
Speaking at the firm’s Enterprise Forum in San Jose, Sam Greenblatt, chief architect of Dell’s Enterprise Solutions Group, said the firm will have exascale systems by 2015, ahead of rival vendors. However, he added that development will not be boosted by a doubling in processor performance, saying Moore’s Law is no longer valid and is actually presenting a barrier for vendors.
“It’s not doubling every two years any more, it has flattened out significantly,” he said. According to Greenblatt, the only way firms can achieve exascale computing is through clustering. “We have to design servers that can actually get us to exascale. The only way you can do it is to use a form of clustering, which is getting multiple parallel processes going,” he said.
Not only did Greenblatt warn that hardware will have to be packaged differently to reach exascale performance, he said that programmers will also need to change. “This is going to be an area that’s really great, but the problem is you never programmed for this area, you programmed to that old Von Neumann machine.”
According to Greenblatt, shifting of data will also be cut down, a move that he said will lead to network latency being less of a performance issue.”Things are going to change very dramatically, your data is going to get bigger, processing power is going to get bigger and network latency is going to start to diminish, because we can’t move all this [data] through the pipe,” he said.
Greenblatt’s reference to data being closer to the processor is a nod to the increasing volume of data that is being handled. While HPC networking firms such as Mellanox and Emulex are increasing bandwidths on their respective switch gear, bandwidth increases are being outpaced by the growth in the size of datasets used by firms deploying analytics workloads or academic research.
That Dell is projecting 2015 for the arrival of exascale clusters is at least a few years sooner than firms such as Intel, Cray and HP, all of which have put a “by 2020″ timeframe on the challenge. However what Greenblatt did not mention is the projected power efficiency of Dell’s 2015 exascale cluster, something that will be critical to its usability.
Will Qualcomm Be First?
We could not get the right timeframe for the launch of Qualcomm’s successor to the high-end Snapdragon 800, but there is no doubt that Qualcomm, Samsung, Nvidia and other ARM supporters are thinking about 20nm products where some of them will be based on Cortex A57.
Qualcomm has its own Krait core that can be adapted to 20nm and follow up the success of Snapdragon 600 and the soon to come Snapdragon 800. It turns out that it traditionally takes 18 to 24 months for the mobile industry to shift from one process to another and Qualcomm had its first 28nm part in April 2012, with the Snapdragon S4, used in the HTC One S. The first ever 28nm part from Qualcomm was the Snapdragon S4 MSM8260A that is now more than a year old and a relatively obsolete product.
Less than a year after the first 28nm product Qualcomm followed up with the Snapdragon 600 that is shipping in millions of high end devices right now. In a month or two it plans to release Snapdragon 800 based on new Krait 400 core and add a new core and get even better performance.
The next step is the 20nm core that should start shipping before the end of 1H 2014. We would not be surprised to see 20nm Krait demoed at CES 2014 already in January, see more of it at the Mobile World Congress in February and the volume shipment to follow in early Q2 2014. This is the expected schedule and not something we got from Qualcomm.
The only official world we got is that the new generation traditionally comes 18 to 24 months after the first iteration of a current one. This can give you an idea that Tegra 5, codenamed Logan, should show up at a similar time, along with Samsung’s 20nm Exynos.
Qualcomm surpasses AMD
May 30, 2013 by admin
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It’s no secret that the mobile boom is taking a toll on makers of PC components and AMD is one of them. According to data from IC Insights, Qualcomm and Samsung have managed to pass AMD in microprocessor sales last year.
Intel still dominates the market, with $36.9 billion sales and a 65.3 percent market share. However, Qualcomm has managed to squeeze into second spot, with $5.3 billion in sales and a 9.4 percent share. Samsung ranked third, with $4.66 in sales and an 8.2 percent market share. Qualcomm and Samsung also recorded plenty of growth, 28 and 78 percent respectively.
However, AMD slumped 21 percent to take 6.4 percent of the market, with $3.6 billion in sales. It was still ahead of Freescale and Nvidia, as well as Texas Instruments and ST Ericsson.
It should be noted that about 83 percent of Samsung’s revenue came from chips churned out for Apple. In other words, had Apple built the chips on its own, it would have tied with AMD for the third spot.
TSMC And Imagination Team Up
TSMC and Imagination Technologies announced the next step in their tech collaboration in an effort to develop Imagination’s next generation PowerVR 6-series GPUs.
The new GPUs are still not ready for prime time, but they should be used in future SoC designs, including those stamped out using TSMC’s 16nm FinFET process. The two companies will work to create new reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology.
As GPU muscle becomes more important for next generation SoCs, designers need more advanced and more complex processes, such as TSMC’s 16FinFET.
“Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products,” said Hossein Yassaie, CEO of Imagination.
TSMC VP Cliff Hou argued that the need for high performance mobile GPUs will drive silicon processes in the future, much in the same way CPU development pushed new processes in the nineties.
Samsung Goes Star-ups
Samsung will put $1.1 billion towards venture capital funding of semiconductor firms.
The company said that it will commit the research and development funding through its Samsung Venture Americas branch and Catalyst Fund investment operations, according to multiple reports.
The investment is set to target semiconductor design and manufacturing. The company will look to fund startups that can assist its hardware units and will open a new R&D facility in Silicon Valley.
The announcement comes as Samsung is seeing its revenues hit record levels. The company reported quarterly profits of 7.5 billion to close out 2012 and sales from Samsung’s handset unit reached record levels.
Analysts believe that the company now controls nearly 23 percent of the smartphone market. The jump in hardware sales has brought with it a healthy appetite for components. Earlier this month Samsung passed Apple to become the world’s largest single user of semiconductor chips.
Samsung has recently stepped up its investment activities, with the firm buying storage vendor Nvelo and last week buying a small stake in Wacom, best known for its touchpad and stylus input technology. With the firm looking to invest in startups, it is perhaps looking to follow in Apple’s footsteps, which kickstarted its chip design efforts by buying PA Semiconductor and later Intrinsity, and invested in Imagination Technologies.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
Toshiba To Offer A 20-megapixel Image Chip
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Toshiba is gearing up for to offer a 20-megapixel image sensor for digital cameras that it says will be the highest resolution of its kind.
The Tokyo-based firm said the new chips will be able to support capturing 30 frames per second at full resolution. They will also be able to shoot video at 60 frames per second at 1080P or 100 frames at 720P.
Toshiba said it will begin shipping samples of the new CMOS chips in January, with mass production to begin in August of 300,000 units monthly. Toshiba is best known in components for its NAND flash memory, which it develops with partner SanDisk, but is also a major manufacturer of LSI and other semiconductors.
Digital point-and-shoot cameras are steadily falling in price, squeezed between brutal competition among manufacturers and the increasing threat of smartphones and mobile devices. While the number of pixels a camera can capture is not always a direct measure of the overall quality of its images, it is a key selling point to consumers.
The image resolution of top-end smartphones now often meets or exceed that of digital cameras. The Nokia 808 PureView launched earlier this year has a 41-megapixel image sensor.
The Japanese manufacturer said it has increased the amount of information pixels in the new chip can store compared to its previous generation of CMOS, producing better overall images. It has also reduces the size of pixels – the new 20-megapixel version has individual pixels that measure 1.2 micrometers, down from 1.34 micrometers in its 16-megapixel product.
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
Tegra 3 No Match For Adreno 320
Qualcomm’s new Snapdragon S4 Pro quad-cores are slowly starting to show up in new phone and tablet designs, and in case you’ve been following the market, you know they will be the fastest thing around until A15 parts appear.
But aside from the custom Krait core, Qualcomm’s new chips feature new Adreno 3 series graphics and judging by some early benchmarks, this is a match made in heaven.
Tom’s Hardware put the new graphics core to the test, with some very impressive results. Basically Adreno 320 blows the competition out of the water. However, it does not manage to surpass the huge SGX543MP4, used on the third generation iPad.
In GLBenchmark 2.1 the SGX543MP4 ranks first, with 251 and 139 points in Pro and Egypt tests. Adreno 320 comes in second, with 191/137, the SGX543MP2 scores 147/90, while the Tegra 3 TL30 scores 82/63. However, in fill rate tests Adreno 320 trails both the SGX543MP4 and SGX543MP2, but it is still miles ahead of the Tegra 3, SGX540 and Adreno 225.
However, in off-screen GLBench 2.5 Adreno 320 manages to squeeze ahead of SGX543 parts and the rest of the competition, but once again it loses in fill rate tests.