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Flaw in Intel’s 320 Series SSD Confirmed

July 22, 2011 by  
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There had been talk on the Internet in reference to the nasty bug discovered and reported on Intel’s support forums regarding the data loss on its recently released 320-series SSDs and today, Intel has finally and officially confirmed it.

The users have mentioned that under power failures, the drive reverts back to 8MB capacity and thus looses all the data stored on the drive. According to preliminary reports the drive tries to reconnect with the SATA port rather than to go for a proper shutdown.

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nVidia’s Tegra 3 Coming To Smartphones

July 18, 2011 by  
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It appears as though Nvidia’s next generation quad-core Kal-El (Tegra 3) quad core SoC will also show up on smartphones too. Originally, it was believed that the SoC would only support the ever growing tablet space.

Inside sources have confirmed that projects are already underway and that Tegra 3 aka Kal-El smartphones will be make a debut as well.

Nvidia had hoped to get a lot of play out of Tegra 2, unfortunately the chip was not as embraced as Nvidia had wanted. Even though the Tegra 2 SoC did manage to get a few design wins.

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AMD A75 Motherboards Economically Priced

July 15, 2011 by  
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It appears that AMD’s A75 motherboards have finally started to hit the streets. Furthermore, we were truly shocked to see these MB’s economically priced for about $60.00.

Do not get too over excited in reference to the pricing because this gets you a decent A75 micro-ATX motherboard with up to four USB 3.0 ports and six SATA 6Gbps ports matched with a FM1 socket. It’s also worth pointing out that you will not get these same features like USB 3.0 and SATA 6Gbps on a comparable Intel platform in the same price range; you’d pay more.

We noticed that online retailer Newegg.com has an AMD motherboard selling for $59.99 after the rebate; otherwise it will cost $72.99. We expect the more serious computer geeks to opt for more muscle in regards to their motherboards; so they can whet their appetite for a good A75 for about $150.00.

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Gigabyte Debuts New Motherboards

July 14, 2011 by  
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Gigabyte just announced their new slate of motherboards that will support AMD’s A75 series chipsets and the latest AMD A-Series APUs or Llano. The new A75 based motherboards are said to offer DIY PC builders and developers a higher level of 3D and multimedia performance that is scalable and said to offer the best value upgrade path imaginable.

Gigabyte’s VP of Service and Marketing Henry Kao is quoted as saying that the new boards were new and exciting as AMD new APU’s were “ground breaking” APU technology. As well as bringing AMD A-Series technology to DIY users who demand excellent gaming and multimedia performance on a budget, these motherboards also offer a compelling upgrade path that includes Dual Graphics configurations.

The A75 motherboards from Gigabyte feature an AMD A75 ‘Hudson’ chipset supporting the latest 32 nanometer AMD A-Series APUs. That said, these chips are the first ever to combine a DX11-capable, high performance graphics processor with the option of a dual or quad core CPU on one silicon die, offering a 3D gaming and multimedia experience which is similar to a discrete graphics configuration.

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New MacBook Includes Faster NAND Chip

July 12, 2011 by  
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The soon to be released new version of Apple’s MacBook Air, will feature NAND flash memory with up to 400Mbps performance, about one and a half times faster than its current technology, according to a recent report.

Unlike many notebooks, the MacBook Air has no hard drive or optical drive and instead uses a slim flash board for its internal mass storage device.

Citing an “Asian electronics component company person,” the blog site Macotakara stated that Apple will use flash memory chips that includes the new Double Data Rate (DDR) 2.0 interface. While the rumors could not be confirmed, the upgrade would come as no surprise, since Apple’s next MacBook Air, which originally used Toshiba’s Blade X-gale NAND flash board, has moved to using Samsung’s flash memory. The MacBook Air’s current Samsung flash sports read rates of 261Mbps and write rates of up to 209Mbps and is based on DDR 1.0 technology.

DDR 2.0 provides a tenfold increase over the 40Mbps Single Data Rate (SDR) NAND flash in widespread use today.

In May, Samsung announced that it was producing DDR 2.0 multilevel cell flash chips. Samsung’s flash chips are made using its smallest circuitry, only 20 nanometers wide. The chips boast a performance improvement of three times over its previous technology.

DDR NAND flash comes in two forms: Toggle Mode from Samsung and Toshiba; and ONFI NAND, from the Open NAND Flash Interface (ONFI) working group. The ONFI protocol is used by flash manufacturers, including Intel, Micron, SanDisk, Hynix and Spansion. In March, the ONFI working group announced its 3.0 specification for the DDR 2.0 interface, which also has up to 400Mbps throughput but with only half the number of pins, for a significant reduction in size.

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Samsung Asks ITC To Ban Apple Products

July 6, 2011 by  
Filed under Consumer Electronics

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Samsung requested that the U.S. International Trade Commission ban the importation of Apple’s iPhones, iPads and iPods, ratcheting up its fight with Apple.

The filing, dated Tuesday, states Apple’s iPhone, iPod digital music player and iPad tablet infringe on five of Samsung’s patents involving telecommunications standards and user interface inventions.

Samsung also filed a fresh patent lawsuit against Apple in a Delaware federal court on Wednesday.

The complaints are the latest salvo in a growing legal battle between the two electronics giants.

In April, Apple sued Samsung in a California federal court, claiming the South Korean firm’s Galaxy line of mobile phones and tablets “slavishly” copies the iPhone and iPad.

Samsung then countersued in California, and Apple last week filed another lawsuit in South Korea. An Apple spokesman could not be immediately reached on Wednesday.

As well as its own phones and tablets, Samsung manufactures microchips for Apple’s gadgets, a business that brought in about $5.7 billion in revenue for the South Korean company last year.

Before banning the importation of Apple’s popular devices, the ITC would first have to agree to look into Samsung’s allegations, a process that could be quite lengthy.

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AMD’s Bulldozer Overclocked To 4.63 GHz

July 1, 2011 by  
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It appears that those techies toying around with samples of AMD’s FX-8130P were able to overclocked this processor to a remarkable 4.63GHz.

That said, Bulldozer appears be AMD’s fastest offering where the eight cores run at 3.8GHz, or up to 4.2GHz with AMD’s Turbo Core 2.0. The processor 8MB of L2 cache, 8MB of L3 cache, supports DDR3 1866MHz and is said to have a 125W  TDP.

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TSMC May Beat Intel To Market With 3D Chip

June 20, 2011 by  
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.

TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.

The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.

With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.

“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”

3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.

“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”

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The Netbook Lives On

June 7, 2011 by  
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Tablets may be the hottest mobile devices on display at this year’s Computex. But netbooks still have a presence at the trade show, and vendors are coming out with several new models that will hit the market this year. Their low cost will continue to drive sales, analysts said.

PC maker Asus, a pioneer of the netbook concept, unveiled two new models at Computex. The Asus Eee PC 1025 C and 1025 CE are Windows netbooks that will launch worldwide in the fourth quarter of this year. Priced at $299, the devices are built with an “instant on” feature that allow users to resume Windows in two seconds from sleep mode.

The other Asus netbook that has caught some attention is the Eee PC X101, which runs Intel’s MeeGo mobile operating system. The device will launch worldwide in July and cost $199. Asus will also be releasing a Windows 7 version of the netbook that will cost between $240 and $250.

Asus’ rival Acer is also showing a low-cost netbook priced at $199. The Aspire One Happy has both Windows and Android 2.3 installed. Users can toggle between operating systems by rebooting the system. Acer launched a version of the device worldwide last month.

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AMD’s Bulldozer Will Be Late

June 6, 2011 by  
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AMD has confirmed that their Bulldozer chip-set will be delayed until later in the summer.

The FX Series which is codenamed Zambezi is based on the Bulldozer architecture.  Unfortunately, AMD didn’t provide an official date they just said that the FX Series is coming in “late summer”, which means do not expect to the chip until probably late August.

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