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No LTE On IBM’s SoC Until 2014
Intel is working on integrated LTE modems for its upcoming SoC designs, but CEO Paul Otellini claims they will not be ready for prime time until 2014.
In a recent conference call Otellini was directly asked about Intel’s plans for LTE integration and said “higher levels of integration” are expected next year. He went on to say that the first Intel-based phones with LTE should launch in early 2014, in time for the Mobile World Congress.
Otellini said Intel’s wireless team, formerly a business unit of Infineon, is making good progress in LTE.
“We believe we have a very competitive solution. The Infineon team is known for not necessarily being first to market, but being really good at engineering a very solid solution and being cost effective and cost competitive and I think that they are doing a very good job with respect to this product,” said Otellini.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
Intel Makes Changes To Haswell
Intel has started dividing its mobile market segments into processors lines, where the Y processor line goes up to 11.5W TDP, U line covers chips in the 15W to 25W range, while the M line covers 37W, 47W as well as 57W TDP space, with two to four cores and graphics up to GT2.
The high performance H processor line is yet another BGA package processor line that also aims for 37W, 47W and 57W TDPs, with quad-core processors and up to GT3 graphics with on-package cache memory.
Intel expects that high performing gaming and workstation PCs will go use these processors and they fit some thick clamshell designs, no Ultrabooks with 57W unless you would want to use one for welding.
Intel currently doesn’t detail the processor number and the number of SKUs but it is obvious that they will end up with quad-core Core i7 branding for QC1+ and QC2+ market segments.
Broadcom Goes UltraHD
January 16, 2013 by admin
Filed under Consumer Electronics
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As TV manufacturers show off UltraHD TVs at CES, communications chip maker Broadcom is introducing the guts of future gateways that will be able to deliver video for those sets into viewers’ homes.
Broadcom’s BCM7445 silicon platform, announced just hours before the show opened on Tuesday morning, will be able to process incoming video from cable, carrier and satellite services that has four times the resolution of typical 1080p video offered today, according to the company.
Like the eye-catching but expensive TVs on the show floor in Las Vegas, the BCM7445 is just one of the first of many steps to consumers watching UltraHD shows at home. New content, displays and delivery technologies will all be required for the new resolution, which is also known as 4K.
Broadcom expects its chip to be in volume production by the middle of next year, in time for mainstream UltraHD TVs that will probably hit the market for the late 2014 holiday season, said Joe Del Rio, associate product line manager at Broadcom. However, service providers, which will probably be the distributors of most of the gateways built with the BCM7445, may take longer to start sending UltraHD video to their subscribers, Del Rio said.
Intel’s Haswell Goes 13W
Intel’s Haswell Y-series processors as we said a few weeks ago have yet launch. The current plan is to launch two Ivy SKUs in Q1 2013, both dual-cores, and later in 2013 Intel plans to replace them with Haswell Y series parts, with even lower TDP.
The faster one is called Core i7 3689Y and has two cores and two threads, as well as a base clock of 1.5GHz. With the help of Intel Turbo Boost 2.0, the top single-core turbo clock is an impressive 2.6GHz, while the maximum dual-core turbo clock stops at 2.4GHz, which is still impressive. This core comes with Intel HD graphics 4000 clocked between 350MHz and 860MHz with turbo.
This new core supports both DDR3 and DDR3L at 1600MHz, has 4MB of cache and impressively low 13W TDP. We have explained that SDP stands for Standard Dissipation Power and Intel expect it to be at 7W for this part.
The runner up is called Core i5 3439Y and has the same two cores and two threads with 1.5GHz base clock, but the single core turbo clock stops at 2.3GHz, while the dual-core top clock is 2.10GHz. The graphics speed, TDP and memory support remain the same, but there is a difference in cache size. Core i5 3439Y comes with 3MB instead of 4MB for Core i7 Y series 3689Y part.
Toyota Goes Wireless Charging
January 2, 2013 by admin
Filed under Around The Net
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Toyota is taking the smartphone boom quite seriously and the car-maker hopes to offer the first wireless charging systems in select models as early as next year.
Toyota’s wireless system will be compatible with the Qi standard and it will be introduced in the new Avalon sedan next year. Of course, it will be optional and it will be part of Toyota’s $1,950 “technology package” which includes other geeky goodies as well.
According to the BBC, Chrysler is also planning to offer a similar system in the Dodge Dart. Other car-makers will no doubt offer wireless charging functionality sooner rather than later.
The number of Qi compatible phones is limited for the time being. Just 34 phones support it, including the Lumia 920, Nexus 4 and HTC Windows Phone 8X. However, some very popular devices like Apple’s iPhone and Sammy’s Galaxy S series phones don’t support wireless charging just yet.
Raspberry Pi Gets A Store
Raspberry Pi Foundation has opened a store to enable users to easily download applications that run on the credit-card sized computer.
The Raspberry Pi Foundation said it partnered with Indiecity and Velocix to create a store for applications that run on the Raspberry Pi computer. The Foundation said that the store itself is an application that runs under its Raspbian Linux distribution and at launch has 23 applications available for download.
The Raspberry Pi Store contains games such as Freeciv alongside applications such as Libreoffice and Asterisk. The Raspberry Pi Foundation said its store accepts compiled binaries, Python code, images, audio and video.
The Raspberry Pi Store will allow developers to charge for applications, with the Foundation saying that it hopes to see a mix of hobbyist and commercial software. The Foundation also asked users that download applications to review them in order to improve the results put out by its recommendations system.
While the Raspberry Pi was initially intended to help teach people how to program, the device has gained wider popularity due to the fact that its hardware can run many typical PC desktop applications. The Foundation’s Raspberry Pi Store will make it easier for users to find and install applications on the device, which can only be a good thing for the Raspberry Pi Foundation and Linux adoption.
Intel Details 22nm SoC
Thanks to a long spate of bad luck over at AMD, Intel now finds itself in a rather safe market lead, at least in high-end and server markets. However, in the low-end and mobile, Intel has a lot of catching up to do.
ARM still dominates the mobile market and Intel is looking to take on the British chip designer with new 22nm SoCs of its own. Intel outlined its SoC strategy at the 2012 International Electron Devices Meeting in San Francisco the other day.
The cunning plan involves 3D tri gate transistors and Intel’s 22nm fabrication process, or in other words it is a brute force approach. Intel can afford to integrate the latest tech in cheep and cheerful 22nm Atoms, thus making them more competitive in terms of power efficiency.
Since Intel leads the way with new manufacturing processes it already has roughly a year of experience with 22nm chips, while ARM partners rely on 28nm, 32nm and more often than not, 40nm processes. Intel’s next generation SoCs will also benefit from other off-the-shelf Intel tech, such as 3D tri-gate transistors.
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
Qualcomm Throws $$ At Sharp
December 12, 2012 by admin
Filed under Consumer Electronics
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Qualcomm is set to make a $120m investment in troubled Japanese display maker Sharp.
Rumours had been floating around that Qualcomm was looking to make an investment in Sharp, and the display maker has confirmed the investment. Qualcomm initially will invest $60m in Sharp through its Pixtronix subsidiary by the end of 2012 to help develop Sharp’s IGZO display technology.
Qualcomm will make a further $60m investment in Sharp should the initial work on its IGZO displays seem promising. Should Qualcomm complete the $120m investment in Sharp, that will make it the single largest shareholder with around five percent of the firm, primarily due to the fact that Sharp’s share price has fallen by almost 75 percent in 2012.
While Sharp said it will work with Qualcomm on further developing its display technology, the two firms will also look at working together on developing chip fabrication technologies.
It had been reported that Intel and Dell were also sniffing around Sharp, while Hon Hai is known to be looking to make a stake in the firm, though its demand for a seat on Sharp’s board is likely the main sticking point in negotiations. Sharp has warned that its future is in doubt if it cannot secure investment to repay large debts it amassed as part of its LCD manufacturing push back in 2006 and 2007.