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TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”