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Intel Shows Off The Xeon SoC
Intel has announced details of its first Xeon system on chip (SoC) which will become the new the Xeon D 1500 processor family.
Although it is being touted as a server, storage and compute applications chip at the “network edge”, word on the street is that it could be under the bonnet of robots during the next apocalypse.
The Xeon D SoCs use the more useful bits of the E3 and Atom SoCs along with 14nm Broadwell core architecture. The Xeon D chip is expected to bring 3.4x better performance per watt than previous Xeon chips.
Lisa Spelman, Intel’s general manager for the Data Centre Products Group, lifted the kimono on the eight-core 2GHz Xeon D 1540 and the four-core 2.2GHz Xeon D 1520, both running at 45W. It also features integrated I/O and networking to slot into microservers and appliances for networking and storage, the firm said.
The chips are also being touted for industrial automation and may see life powering robots on factory floors. Since simple robots can run on basic, low-power processors, there’s no reason why faster chips can’t be plugged into advanced robots for more complex tasks, according to Intel.
AMD Goes Virtual With Liquid VR
AMD Liquid VR is not a retail product – it is an initiative to develop and deliver the best Virtual Reality (VR) experience in the industry.
AMD Liquid VR was announced at the Game Developers Conference in San Francisco, and the company describes it is a “set of innovative technologies focused on enabling exceptional VR content development” for hardware based on AMD silicon.
Developers will soon get access to the LiquidVR SDK, which will help them address numerous issues associated with VR development.
Platform and software rather than hardware
If you were expecting to see a sexy AMD VR headset with a killer spec, the announcement may be disappointing. However, if you are a “what’s under the bonnet” kind of geek, there are a few interesting highlights.
AMD has put a lot of effort into minimising motion-to-photon latency, which should not only help improve the experience, but also keep you from experiencing motion sickness, or hurling over that new carpet that really ties the room together.
Headline features of LiquidVR SDK 1.0 include:
Async Shaders for smooth head-tracking enabling Hardware-Accelerated Time Warp, a technology that uses updated information on a user’s head position after a frame has been rendered and then warps the image to reflect the new viewpoint just before sending it to a VR headset, effectively minimizing latency between when a user turns their head and what appears on screen.
Affinity Multi-GPU for scalable rendering, a technology that allows multiple GPUs to work together to improve frame rates in VR applications by allowing them to assign work to run on specific GPUs. Each GPU renders the viewpoint from one eye, and then composites the outputs into a single stereo 3D image. With this technology, multi-GPU configurations become ideal for high performance VR rendering, delivering high frame rates for a smoother experience.
Latest data latch for smooth head-tracking, a programming mechanism that helps get head tracking data from the head-mounted display to the GPU as quickly as possible by binding data as close to real-time as possible, practically eliminating any API overhead and removing latency.
Direct-to-display for intuitively attaching VR headsets, to deliver a seamless plug-and-play virtual reality experience from an AMD Radeon™ graphics card to a connected VR headset, while enabling features such as booting directly to the display or using extended display features within Windows.
You can grab the full AMD LiquidVR presentation here. (pdf)
What’s next for LiquidVR?
It all depends on what you were expecting, and what the rest of the industry does. AMD hopes LiquidVR will be compatible with a broad range of VR devices. LiquidVR will allow hardware makers to implement AMD technology in their products with relative ease, enabling 100Hz refresh rates, the use of individual GPUs per each eye and so on.
To a certain extent, you can think of LiquidVR as FreeSync for VR kit.
Oculus CEO Brendan Irbe said achieving presence in a virtual world is one of the most important elements needed to deliver a good user experience.
He explained where AMD comes in:
“We’re excited to have AMD working with us on their part of the latency equation, introducing support for new features like asynchronous timewarp and late latching, and compatibility improvements that ensure that Oculus’ users have a great experience on AMD hardware.”
Raja Koduri, corporate vice president, Visual Computing, AMD, said content, comfort and compatibility are the cornerstones of AMD’s focus on VR.
AMD’s resident graphics guru said:
“With LiquidVR we’re collaborating with the ecosystem to unlock solutions to some of the toughest challenges in VR and giving the keys to developers of VR content so that they can bring exceptional new experiences to life.”
A picture is worth a thousand words, so here’s 3300 frames of AMD’s virtual reality vision.
Can MediaTek Take On Qualcomm?
While Qualcomm’s 20nm Snapdragon 810 SoC might be the star of upcoming flagship smartphones, it appears that MediaTek has its own horse for the race, the octa-core MT6795.
Spotted by GforGames site, in a GeekBench test results and running inside an unknown smartphone, MediaTek’s MT6795 managed to score 886 points in the single-core test and 4536 points in the multi-core test. These results were enough to put it neck to neck with the mighty Qualcomm Snapdragon 810 SoC tested in the LG G Flex 2, which scored 1144 points in the single-core and 4345 in the multi-core test. While it did outrun the MT6795 in the single-core test, the multi-core test was clearly not kind on the Snapdragon 810.
The unknown device was running on Android Lollipop OS and packed 3GB of RAM, which might gave the MT6795 an edge over the LG G Flex 2.
MediaTek’s octa-core MT6795 was announced last year and while we are yet to see some of the first design wins, recent rumors suggested that it could be powering Meizu’s MX5, HTC’s Desire A55 and some other high-end smartphones. The MediaTek MT6795 is a 64-bit octa-core SoC clocked at up to 2.2GHz, with four Cortex-A57 cores and four Cortex-A53 cores. It packs PowerVR G6200 graphics, supports LPDDR3 memory and can handle 2K displays at up to 120Hz.
As we are just a few days from Mobile World Congress (MWC) 2015 which will kick off in Barcelona on March 2nd, we are quite sure that we will see more info as well as more benchmarks as a single benchmark running on an unknown smartphone might not be the best representation of performance, it does show that MediaTek certainly has a good chip and can compete with Qualcomm and Samsung.
AMD Headed To The Facial Recognition Space
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AMD has developed facial recognition technology to enable users to organize and search video clips based on the people featured in them.
AMD executive Richard Gayle demonstrated to Tom’s Guide how AMD Content Manager, uses facial recognition to browse through a group of local videos to find specific faces.
There is an index that displays the people’s faces that have been detected throughout the video clips.
The user can edit the names of the people as well as add keyword tags to help improve future searches for specific people.
For instance, if you are searching for videos that feature one person, you can click on his or her respective face to pull up the corresponding videos.
Additionally, if you want to narrow a search to a specific person combined with a keyword tag, you can drag the face icon and click on the desired keyword.
Once you click on the video you wish to view, a player appears in the right windowpane, along with a timeline displayed at the bottom with a list of all the people who appear in the video.
The timeline is separated into various coloured boxes to mark the exact moment in the video when each person first appears on screen, so you do not have to watch the entire video to see the bit you want.
The application also has facial recognition capabilities that allow users to do some basic editing, such as compiling a single montage video of any individual or individuals.
While this is pretty good technology, it probably does not have any major use yet on its own.
Gayle said it is unlikely that AMD will release Content Manager in its current form but will license it to OEMs that are able to rebrand the application before offering it on their respective systems.
He claimed that only AMD processors have sufficient power to operate the application, because of the processor’s ability to have the CPU, GPU and memory controller work closely together.
AMD’s Fiji GPU Goes High Bandwidth
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.
Nvidia Unveils New Tegra X1 Chip
Chipmaker Nvidia debuted a new processor aimed at powering high-end graphics on car dashboards as well as sophisticated auto-pilot systems.
At an event in Las Vegas ahead of the Consumer Electronics Show, Nvidia Chief Executive Jen-Hsun Huang said the Tegra X1 chip would provide enough computing horsepower for automobiles with displays built into mirrors, dashboard, navigation systems and passenger seating.
“The future car is going to have an enormous amount of computational ability,” Huang said. “We imagine the number of displays in your car will grow very rapidly.”
The Tegra X1 has twice the performance of its predecessor, the Tegra K1, and will come out in early 2015, Nvidia said.
An upcoming platform combining two of the X1 chips can process data collected from up to 12 high-definition cameras monitoring traffic, blind spots and other safety conditions in driver assistance systems, Huang said.
Combined with next-generation software, the chips can help detect and read road signs, recognize pedestrians and detect braking vehicles, he said.
Santa Clara, California-based Nvidia in recent years has been expanding beyond its core business of designing high-end graphics chips for personal computers.
After struggling to compete against larger chipmakers like Qualcomm in smartphones and tablets, Nvidia is now increasing its focus on using its Tegra mobile chips in cars and is already supplying companies including Audi, BMW and Tesla.
Amazon Web Services Goes Zocalo
Amazon Web Services (AWS) has announced two much-needed boosts to its fledgling Zocalo productivity platform, making the service mobile and allowing for file capacities of up to 5TB.
The service, which is designed to do what Drive does for Google and what Office 365 does for software rental, has gained mobile apps for the first time as Zocalo appears on the Google Play store and Apple App Store.
Amazon also mentions availability on the Kindle store, but we’re not sure about that bit. We assume it means the Amazon App Store for Fire tablet users.
The AWS blog says that the apps allow the user to “work offline, make comments, and securely share documents while you are in the air or on the go.”
A second announcement brings Zocalo into line with the AWS S3 storage on which it is built. Users will receive an update to their Zocalo sync client which will enable file capacities up to 5TB, the same maximum allowed by the Amazon S3 cloud.
To facilitate this, multi-part uploads will allow users to carry on an upload from where it was after a break, deliberate or accidental.
Zocalo was launched in July as the fight for enterprise storage productivity hots up. The service can be trialled for 30 days free of charge, offering 200GB each for up to 50 users.
Rival services from companies including the aforementioned Microsoft and Google, as well as Dropbox and Box, coupled with aggressive price cuts across the sector, have led to burgeoning wars for the hearts and minds of IT managers as Microsoft’s Office monopoly begins to wane.
Amazon Intel Zeon Inside
Amazon has become the latest vendor to commission a customized Xeon chip from Intel to meet its exact compute requirements, in this case powering new high-performance C4 virtual machine instances on the AWS cloud computing platform.
Amazon announced at the firm’s AWS re:Invent conference in Las Vegas that the latest generation of compute-optimized Amazon Elastic Compute Cloud (EC2) virtual machine instances offer up to 36 virtual CPUs and 60GB of memory.
“These instances are designed to deliver the highest level of processor performance on EC2. If you’ve got the workload, we’ve got the instance,” said AWS chief evangelist Jeff Barr, detailing the new instances on the AWS blog.
The instances are powered by a custom version of Intel’s latest Xeon E5 v3 processor family, identified by Amazon as the Xeon E5-2666 v3. This runs at a base speed of 2.9GHz, and can achieve clock speeds as high as 3.5GHz with Turbo boost.
Amazon is not the first company to commission a customized processor from Intel. Earlier this year, Oracle unveiled new Sun Server X4-4 and Sun Server X4-8 systems with a custom Xeon E7 v2 processor.
The processor is capable of dynamically switching core count, clock frequency and power consumption without the need for a system level reboot, in order to deliver an elastic compute capability that adapts to the demands of the workload.
However, these are just the vendors that have gone public; Intel claims it is delivering over 35 customized versions of the Intel Xeon E5 v3 processor family to various customers.
This is an area the chipmaker seems to be keen on pursuing, especially with companies like cloud service providers that purchase a great many chips.
“We’re really excited to be working with Amazon. Amazon’s platform is the landing zone for a lot of new software development and it’s really exciting to partner with those guys on a SKU that really meets their needs,” said Dave Hill, senior systems engineer in Intel’s Datacenter Group.
Also at AWS re:Invent, Amazon announced the Amazon EC2 Container Service, adding support for Docker on its cloud platform.
Currently available as a preview, the EC2 Container Service is designed to make it easy to run and manage distributed applications on AWS using containers.
Customers will be able to start, stop and manage thousands of containers in seconds, scaling from one container to hundreds of thousands across a managed cluster of Amazon EC2 instances, the firm said.
Intel Sampling Xeon D 14nm
Intel has announced that it is sampling its Xeon D 14nm processor family, a system on chip (SoC) optimized to deliver Intel Xeon processor performance for hyperscale workloads.
Announcing the news on stage during a keynote at IDF in San Francisco, Intel SVP and GM of the Data Centre Group, Diane Bryant, said that the Intel Xeon processor D, which initially was announced in June, will be based on 14nm process technology and be aimed at mid-range communications.
“We’re pleased to announce that we’re sampling the third generation of the high density [data center system on a chip] product line, but this one is actually based on the Xeon processor, called Xeon D,” Bryant announced. “It’s 14nm and the power levels go down to as low as 15 Watts, so very high density and high performance.”
Intel believes that its Xeon D will serve the needs of high density, optimized servers as that market develops, and for networking it will serve mid-range routers as well as other network appliances, while it will also serve entry and mid-range storage. So, Intel claimed, you will get all of the benefits of Xeon-class reliability and performance, but you will also get a very small footprint and high integration of SoC capability.
This first generation Xeon D chip will also showcase high levels of I/O integrations, including 10Gb Ethernet, and will scale Intel Xeon processor performance, features and reliability to lower power design points, according to Intel.
The Intel Xeon processor D product family will also include data centre processor features such as error correcting code (ECC).
“With high levels of I/O integration and energy efficiency, we expect the Intel Xeon processor D product family to deliver very competitive TCO to our customers,” Bryant said. “The Intel Xeon processor D product family will also be targeted toward hyperscale storage for cloud and mid-range communications market.”
Bryant said that the product is not yet available, but it is being sampled, and the firm will release more details later this year.
This announcement comes just days after Intel launched its Xeon E5 v2 processor family for servers and workstations.
Vendors Testing New Xeon Processors
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Intel is cooking up a hot batch of Xeon processors for servers and workstations, and system vendors have already designed systems that are ready and raring to go as soon as the chips become available.
Boston is one of the companies doing just that, and we know this because it gave us an exclusive peek into its labs to show off what these upgraded systems will look like. While we can’t share any details about the new chips involved yet, we can preview the systems they will appear in, which are awaiting shipment as soon as Intel gives the nod.
Based on chassis designs from Supermicro, with which Boston has a close relationship, the systems comprise custom-built solutions for specific user requirements.
On the workstation side, Boston is readying a mid-range and a high-end system with the new Intel Xeon chips, both based on two-socket Xeon E5-2600v3 rather than the single socket E5-1600v3 versions.
There’s also the mid-range Venom 2301-12T, which comes in a mid-tower chassis and ships with an Nvidia Quadro K4000 card for graphics acceleration. It comes with 64GB of memory and a 240GB SSD as a boot device, plus two 1TB Sata drives configured as a Raid array for data storage.
For extra performance, Boston has also prepared the Venom 2401-12T, which will ship with faster Xeon processors, 128GB of memory and an Nvidia Quadro K6000 graphics card. This also has a 240GB SSD as a boot drive, with two 2TB drives configured as a Raid array for data storage.
Interestingly, Intel’s new Xeon E5-2600v3 processors are designed to work with 2133MHz DDR4 memory instead of the more usual DDR3 RAM, and as you can see in the picture below, DDR4 DIMM modules have slightly longer connectors towards the middle.
For servers, Boston has prepared a 1U rack-mount “pizza box” system, the Boston Value 360p. This is a two-socket server with twin 10Gbps Ethernet ports, support for 64GB of memory and 12Gbps SAS Raid. It can also be configured with NVM Express (NVMe) SSDs connected to the PCI Express bus rather than a standard drive interface.
Boston also previewed a multi-node rack server, the Quattro 12128-6, which is made up of four separate two-socket servers inside a 2U chassis. Each node has up to 64GB of memory, with 12Gbps SAS Raid storage plus a pair of 400GB SSDs.