Fundamental research leading towards faster wireless networks, secure low-power technologies for the Internet of Things, and even 3D displays will be the focus of Intel’s collaboration with the French Alternative Energies and Atomic Energy Commission (CEA).

Intel and the CEA already work together in the field of high-performance computing, and a new agreement signed Thursday will see Intel fund work at the CEA’s Laboratory for Electronics and Information Technology (LETI) over the next five years, according to Rajeeb Hazra, vice president of Intel’s data center group.

The CEA was founded in 1945 to develop civil and military uses of nuclear power. Its work with Intel began soon after it ceased its atmospheric and underground nuclear weapons test programs, as it turned to computer modeling to continue its weapons research, CEA managing director Daniel Verwaerde said Thursday.

That effort continues, but the organization’s research interests today are more wide-ranging, encompassing materials science, climate, health, renewable energy, security and electronics.

These last two areas will be at the heart of the new research collaboration, which will see scientists at LETI exchanging information with those at Intel.

Both parties dodged questions about who will have the commercial rights to the fruits of their research, but each said it had protected its rights. The deal took a year to negotiate.

“It’s a balanced agreement,” said Stéphane Siebert, director of CEA Technology, the division of which LETI is a part.

Who owns what from the five-year research collaboration may become a thorny issue, for French taxpayers and Intel shareholders alike, as it will be many years before it becomes clear which technologies or patents are important.

Hazra emphasized the extent to which Intel is dependent on researchers outside the U.S. The company has over 50 laboratories in Europe, four of them specifically pursuing so-called exa-scale computing, systems capable of billions of billions of calculations per second.

Source-http://www.thegurureview.net/mobile-category/intel-look-to-atomic-energy-for-mobile-technologys-future.html

The software is available to all through the Developer Mode on Windows Settings and it is not a virtual machine. Microsoft will allow native ELF binaries, written for Linux, to run under Windows through a translation layer. It is a bit like the WINE project, which runs native Windows binaries on Linux.

Normally you have to recompile Linux software under Cygwin, or run a Linux virtual machine to get it to run in Windows.

Microsoft claims the new feature offers a considerable advantage in performance and storage space. It also includes the bulk of Ubuntu’s packages, installed via the apt package manager directly from Canonical’s own repositories.

The big question is why. Redmond does not appear to be targeting the server market with this launch but desktop and laptop users. It appears to be mainly of use to developers, who need access to Linux software but for whatever reason wish to keep Windows 10 as their main OS.

Canonical’s Dustin Kirkland said the Windows Subsystem for Linux nearly has equivalent performance to running the software natively under Linux. The only downside is the software is free, but not open source.

General release is scheduled for later this year as part of the Windows 10 Anniversary Update, which will also include support for running Windows Universal Apps on the Xbox One, turning any Xbox One into a development system, the ability to disable V-sync for games installed through the Windows software storefront, ad-blocking support by default in Microsoft Edge, and improved stylus support.

Courtesy-Fud

The slide appeared on the anandtech forums and shows the chip will be branded under the Xeon E5-2600 V4 series and will have at least “20 per cent more cores and last-level cache” than Haswell-EP.  It should be shipping on March 31st.

This CPU is started for an HP workstation, called the HP Z640, which succeeds the Z620.

The Xeon Broadwell-E uses Intel’ s14nm process which means 10-core chips will be available at the price of an 8-core chip from the previous generation.

The slide said that the Broadwell-E will deliver 18 per cent average performance increase over Haswell-EP, as well as support up to 2400MHz DDR4 memory for greater I/O throughput.

This slide follows the news that an 18-core Xeon Broadwell-EP CPU was spotted on eBay, carrying a price tag of $999 US. Dubbed Xeon E5-2600 v4, the chip was listed to feature a base clock speed of 2.2GHz and Turbo frequency of 3GHz, as well as a TDP of 145W, 2.5MB of L3 cache per core, with 45MB LLC cache in total.

Courtesy-Fud

The tear downs will start happening soon but our sources very close to the matter said with high certainly that all iPhone SE come with an updated Qualcomm modem.

Intel is still in the run but apparently Apple still felt confident to continue using Qualcomm even for this generation of the phone. A few analysts did suggested that iPhone 7 and beyond might get Intel LTE hardware, but not with iPhone SE.

Back in December, when we originally wrote that Intel got the iPhone SE deal, our sources did suggest that Apple can still change its mind if it doesn’t feel that Intel modem is ready. This might be the case, but in the future, we are quite confident that Apple will get a second LTE supplier at some point, just as it did with different manufacturing fabs.

Having two suppliers will drive the cost down, and for Apple every dollar or cent they save of components means millions more in its pocket. Apple claims “LTE up to 50 percent faster than iPhone 5s,” but it doesn’t give a real number. The iPhone 5S uses MDM9615 that was first introduced in 2011. This modem is at the technology range of Cat 4, X5 modem that Qualcomm ships in its entry level SoCs or as an external component.

We will have to wait for the first teardowns to appear as it is not easy to get to “ LTE up to 50 percent faster than iPhone 5s.” You would need a modem that is capable of 225 Mbps  and the next of potential candidates for the iPhone SE is the MDM 20nm 9×35. Qualcomm calls this modem X7 these days, it use to call it Gobi back in late 2014 and this is a Cat 6, 300 Mbit per second download and 50 Mbit per second upload capable chip.

The fact that Apple continues the exclusive deal with Qualcomm is bad news for Intel, but we are sure that the team blue will keep working on getting inside of iPhone.

Courtesy-Fud

This week smartwatch maker Pebble CEO Eric Migicovsky blamed VCs for not giving him all the money he needs and laid off a quarter of its workforce.

Only a few years ago, Pebble was the darling of the crowdfunding crowd, having raised over $30 million on Kickstarter. This was when Apple was rumoured to be making one and the Tame Apple Press was claiming they were going to be the next big thing,

When Migicovsky confirmed the layoffs. He implied that VCs are now less keen on funding the dream.

Now Apple, which was said to be the market leader of smartwatches, has dropped the price of the Apple Watch by $50. It is probably not going to upgrade the next one with any serious bells and whistles. It looks like the only people who bought one were Apple’s hard core of fanboys who buy everything that Jobs’ Mob makes regardless of whether they need it.

The IDC sees wearable devices reaching 110 million by the end of 2016 which should be 38.2 percent growth. But it seems that this is not enough.

Fitbit was initially championed as an industry leader but this year saw its stock has been battered in 2016. It appears that Smartwatches haven’t set the market alight. Pebble’s rivals are Apple, Samsung, Motorola, LG and others. It also does not have any other businesses to fall back on.

Courtesy-Fud

The embedded Web server in the Cisco Cable Modem with Digital Voice models DPC2203 and EPC2203 contains a buffer overflow vulnerability that can be exploited remotely without authentication.  Apparently all you need to do is send a crafted HTTP requests to the Web server and you could see some arbitrary code execution.

Cisco said that its customers should contact their service providers to ensure that the software version installed on their devices includes the patch for this issue.

The Web-based administration interfaces of the Cisco DPC3941 Wireless Residential Gateway with Digital Voice and Cisco DPC3939B Wireless Residential Voice Gateway are affected by a vulnerability that could lead to information disclosure. An unauthenticated, remote attacker could exploit the flaw by sending a specially crafted HTTP request to an affected device in order to obtain sensitive information from it.

The Cisco Model DPQ3925 8×4 DOCSIS 3.0 Wireless Residential Gateway with EDVA is affected by a separate vulnerability, also triggered by malicious HTTP requests, that could lead to a denial-of-service attack.

Hackers have been hitting modems, routers and other gateway devices, hard lately – especially those distributed by ISPs to their customers. By compromising such devices, attackers can snoop on, hijack or disrupt network traffic or can attack other devices inside local networks.

Courtesy-Fud

While there have been cut-down Linux implementations before the increase in numbers of smart, connected devices has made something a little more specialized more important.

Zephyr is all about minimizing the power, space, and cost budgets of IoT hardware.
For example a cut down Linux needs 200KB of RAM and 1MB of flash, IoT end points, which will often be controlled by tiny microcontrollers.

Zephyr has a small footpoint “microkernel” and an even tinier “nanokernel.” All this enables it to be CPU architecture independent, run on as little as 10KB while being scalable.

It can still support a broad range of wireless and wired technologies and of course is entirely open saucy released under the Apache v2.0 License.

It works on Bluetooth, Bluetooth Low Energy, and IEEE 802.15.4 (6LoWPAN) at the moment and supports x86, ARM, and ARC architectures.

Courtesy-Fud

IBM has announced a major expansion in Europe with the establishment of a new HQ for Watson Internet of Things (IoT).

The Munich site establishes a global headquarters for the Watson IoT program which is dedicated to launching “offerings, capabilities and ecosystem partners” designed to bring the cognitive powers of the company’s game show winning supercomputer to billions of tiny devices and sensors.

Some 1,000 IBM developers, consultants, researchers and designers will join the Munich facility, which the company describes as an “innovation super center”. It is the biggest IBM investment in Europe for over 20 years.

IBM Cloud will power a series of APIs that will allow IoT developers to harness Watson within their devices.

“The IoT will soon be the largest single source of data on the planet, yet almost 90 percent of that data is never acted on,” said Harriet Green, general manager for Watson IoT and Education.

“With its unique abilities to sense, reason and learn, Watson opens the door for enterprises, governments and individuals to finally harness this real-time data, compare it with historical data sets and deep reservoirs of accumulated knowledge, and then find unexpected correlations that generate new insights to benefit business and society alike.”

The APIs were first revealed in September and new ones for the IoT were announced today.

These include the Natural Language Processing API, which contextualizes language from context and is able to respond in the same simple way; Machine Learning Watson API, which can establish patterns in order to perform a repeated task better each time or change the method to suit; Video and Image Analytics API, which can infer information from video feeds; and Text Analytics Watson API, which can glean information from unstructured text data such as Twitter feeds.

The company will also open eight regional centres across four continents to give customers in those territories the opportunity to access information and experiences.

Courtesy-TheInq

The South Korean electronics giant is only the latest tech firm to make a somewhat belated push into the carmaker industry, as vehicle computer systems and sensors become more sophisticated.

In October, General Motors announced a strategic partnership with South Korea’s LG Electronics. LG will supply a majority of the key components for GM’s upcoming electric vehicle (EV), the Chevrolet Bolt. LG has also been building computer modules for GM’s OnStar telecommunications system for years.

Apple and Google have also developed APIs that are slowly being embedded by automakers to allow smartphones to natively connect and display their infotainment screens. Those APIs led to the rollout in several vehicles this year of Apple’s CarPlay and Android Auto.

Having formerly balked at the automotive electronics market as too small, consumer computer chipmakers are now entering the space with fervor.

Dutch semiconductor maker NXP is closing an $11.8 billion deal to buy Austin-based Freescale, which makes automotive microprocessors. The combined companies would displace Japan’s Renesas as the world’s largest vehicle chipmaker.

German semiconductor maker Infineon Technology has reportedly begun talks to buy a stake in Renesas.

Adding to growth in automotive electronics are regulations mandating technology such as backup cameras in the U.S. and “eCalling” in Europe, which automatically dials emergency services in case of an accident.

According to a report published by Thomson Reuters, Samsung and its tech affiliates are ramping up research and development for auto technology, with two-thirds of their combined 1,804 U.S. patent filings since 2010 related to electric vehicles and electric components for cars.

The combined automotive software, services and components market is worth around $500 billion, according to ABI Resarch.

Source-http://www.thegurureview.net/consumer-category/samsung-announces-entry-into-auto-industry.html