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Intel Rewards RealSense Developers
Intel has awarded $1m to a number of developers as part of its RealSense 3D App Challenge, which was launched last year.
Announced by Intel president Renee James at Computex 2014, the RealSense App Challenge was part of Intel’s efforts to boost RealSense globally and generate software innovation around the ecosystem.
More than 7,000 software creators in 37 countries applied to compete, and 400 were selected to develop new applications for entertainment, learning and collaboration.
Several hundred developers of creative app ideas in these categories received the latest edition of the RealSense 3D Camera and RealSense software development kit, which included free tools, examples and application programing interfaces with which to develop their ideas.
Intel announced on Thursday that the grand prize winner, who picks up $100,000, is Brazilian developer Alexandre Ribeiro da Silva of Anima Games.
His Seed app requires gamers to use reflexes and rational thinking to solve puzzles. The goal of the game is to guide a little floating seed through its journey to reforest a devastated land.
The second prize of $50,000 was awarded to Canadian developer David Schnare of Kinetisense. His OrthoSense app uses RealSense to help medical professionals remotely rehabilitate a patient who has suffered a hand injury by tracking their range of movement over time.
“This practical application of human-computer interaction is an impressive example of how technology can make our lives better,” Intel said.
Another notable winner was Lee Bamber from the UK, who received recognition for his virtual 3D video maker. The app allows a user to record themselves as a 3D hologram and then transport to a variety of scenes.
Once recorded, they can then change the camera position over the course of the playback to add an extra dimension to a video blogs, storybook or v-mails, for instance.
“The idea of the app is that you can choose the backdrop then set the lighting as you would in a studio then do the acting,” Bamber explained in his video.
Doug Fisher, SVP and general manager of Intel’s Software and Services Group, said in a blog post that now the app challenge is complete “the real work begins”, as Intel Software will continue to encourage all finalists to bring products to market.
“We also will continue mobilising our resources to inspire, educate and advance innovation through programmes such as the Intel Developer Zone, where developers can engage to find new software tools and build industry relationships,” he said.
“Human-computer interactions will no longer be defined by mice, keyboards and 2D displays. Our physical and digital worlds are coming together. When they do, the opportunities for us as consumers and businesses will explode.”
Can MediaTek Bring The Cortex-A72 To Market?
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MediaTek became the first chipmaker to publicly demo a SoC based on ARM’s latest Cortex-A72 CPU core, but the company’s upcoming chip still relies on the old 28nm manufacturing process.
We had a chance to see the upcoming MT8173 in action at the Mobile World Congress a couple of weeks ago.
The next step is to bring the new Cortex-A72 core to a new node and into mobiles. This is what MediaTek is planning to do by the end of the year.
Cortex-A72 smartphone parts coming in Q4
It should be noted that MediaTek’s 8000-series parts are designed for tablets, and the MT8173 is no exception. However, the new core will make its way to smartphone SoCs later this year, as part of the MT679x series.
According to Digitimes Research, MediaTek’s upcoming MT679x chips will utilize a combination of Cortex-A53 and Cortex-A57 cores. It is unclear whether MediaTek will use the planar 20nm node or 16nm FinFET for the new part.
By the looks of it, this chip will replace 32-bit MT6595, which is MediaTek’s most successful high performance part yet, with a few relatively big design wins, including Alcatel, Meizu, Lenovo and Zopo. The new chip will also supplement, and possibly replace the recently introduced MT6795, a 64-bit Cortex-A53/Cortex-A72 part used in the HTC Desire 826.
More questions than answers
Digitimes also claims the MT679x Cortex-A72 parts may be the first MediaTek products to benefit from AMD technology, but details are scarce. We can’t say whether or not the part will use AMD GPU technology, or some HSA voodoo magic. Earlier this month we learned that MediaTek is working with AMD and the latest report appears to confirm our scoop.
The other big question is the node. The chip should launch toward the end of the year, so we probably won’t see any devices prior to Q1 2016. While 28nm is still alive and kicking, by 2016 it will be off the table, at least in this market segment. Previous MediaTek roadmap leaks suggested that the company would transition to 20nm on select parts by the end of the year.
However, we are not entirely sure 20nm will cut it for high-end parts in 2016. Huawei has already moved to 16nm with its latest Kirin 930 SoC, Samsung stunned the world with the 14nm Exynos 7420, and Qualcomm’s upcoming Snapdragon 820 will be a FinFET part as well.
It is obvious that TSMC’s and Samsung’s 20nm nodes will not be used on most, if not all, high-end SoCs next year. With that in mind, it would be logical to expect MediaTek to use a FinFET node as well. On the other hand, depending on the cost, 20nm could still make sense for MediaTek – provided it ends up significantly cheaper than FinFET. While a 20nm chip wouldn’t deliver the same level of power efficiency and performance, with the right price it could find its way to more affordable mid-range devices, or flagships designed by smaller, value-oriented brands (especially those focusing on Chinese and Indian markets).
ARM Buys Offspark For IoT
ARM has snaffled up Dutch Internet of Things (IoT) company Offspark.
The move is designed to improve ARM’s security credentials for IoT offerings.
Offspark is the creator of PolarSSL, a widely used protocol for IoT security products, and ARM hopes that the combined companies can offer a one-stop shop for IoT developers.
Krisztian Flautner, ARM’s IoT manager, said: “PolarSSL technology is already deployed by the leading IoT players.
“The fact that those same companies also use ARM Cortex processor and software technologies means we are now able to provide a complete bedrock solution for the industry to innovate from.”
The product will be renamed ARM Mbed TLS, but will remain open source, reports Tech Week Europe.
Paul Bakker, CEO of Offspark, added: “Security is the most fundamental aspect in ensuring people trust IoT technology and that is only possible with a truly tailored solution.
“Together, ARM and Offspark can provide security to the edge of any system and we look forward to working with our partners to help them deliver some exciting new projects.”
Developers will be able to license the technology for commercial use as well as embedding it into future ARM products.
Last week the company released the ARM Cortex-A72 processor, a 64-bit effort offering support for Android 5.x Lollipop and incorporating the big.LITTLE architecture that prioritises jobs to different processor cores based on their computational requirements.
A message on the Offspark website indicates that it has been taken down and redirects to ARM.
MediaTek Shows Off New IoT Platform
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MediaTek had announced a new development platform, as part of its MediaTek Labs initiative.
The LinkIt Connect MT7681 platform is based on the MT7681 SoC, designed for simple and affordable WiFi-enabled Internet of Things (IoT) devices. The company also released a software development kit (SDK) and hardware development kit (HDK) for the new platform.
The HDK includes the LinkIt Connect 7681 development board, which features the MT7681 chipset, micro-USB port and pins for various I/O interfaces. The chipset can be used in WiFi station or access point modes.
In station mode, the chip connects to a wireless access point and communicates with web services or cloud servers, which means it could be used to control smart thermostats. However, in access point mode, the chipset can communicate with devices directly, for example to control smart plugs or light bulbs using a smartphone.
“The world is rapidly moving towards connecting every imaginable device in the home, yet developers often have to spend too much effort on making their products Wi-Fi enabled,” said Marc Naddell, VP, MediaTek Labs. “The MediaTek LinkIt Connect 7681 platform simplifies and accelerates this process so that developers can focus on making innovative home IoT products, whatever their skill level.”
MediaTek Labs was launched in September 2014 and its goal is to promote a range of innovative MediaTek platforms, namely frugal devices such as wearables, IoT and home automation hardware.
ARM Develops IoT For Students
ARM has created a course to teach IoT skills to students at University College London (UCL)
The course is designed to encourage graduates in science, technology, engineering and maths (Stem) to seek careers in IT.
The IoT Education Kit will teach students how to use the Mbed IoT operating system to create smartphone apps that control mini-robots or wearable devices.
Students are expected to be interested in building their own IoT business, or joining IoT-focused enterprises like ARM. The course will also try to limit the number of Stem graduates pursuing non-technology careers.
ARM reported statistics from a 2012 study by Oxford Policy and Research revealing how many engineering graduates (36 percent of males, 51 percent of females), technology graduates (44 percent, 53 percent) and computer scientists (64 percent, 66 percent) end up with non-Stem jobs.
The IoT Education Kit will be rolled out by UCL’s Department of Electronics from September 2015, with a week-long module for full-time and continuing professional development students.
The Kit comprises a complete set of teaching materials, Mbed-enabled hardware boards made by Nordic Semiconductor, and software licensed from ARM. A second teaching module for engineering graduates is being developed for 2016.
“Students with strong science and mathematical skills are in demand and we need to make sure they stay in engineering,” said ARM CTO Mike Muller.
“The growth of the IoT gives us a great opportunity to prove to students why our profession is more exciting and sustainable than others.”
UCL professor Izzat Darwazeh also highlighted the importance of Stem skills, saying that “many students are not following through to an engineering career and that is a real risk to our long-term success as a nation of innovators”.
Intel Shows New IoT Platform
Intel showed off a new platform which it claims makes it easier for companies to create Internet-connected smart products using its chips, security and software.
Intel’s platform is like Lego and based on the chipmaker’s components and software for companies to create smart, connected devices. The only difference is that you can’t enact your own Doctor Who scene from it.
Doug Davis, head of Intel’s Internet of Things business, said at a launch event in San Francisco it will make it a doddle to connect to data centres in order analyse data collected from devices’ sensors.
Intel’s chips should compute capability in end-point devices that scale from its highest performance Xeon processor to the Quark family of products.
Intel’s Internet of Things Group had $530 million in revenue in the September quarter. That accounted for just 4 percent of Intel’s total revenue in the quarter, but it grew 14 percent over the previous year, which was faster than the company’s PC business.
Dell, SAP, Tata Consultancy, Accenture and other companies are working with the new reference model, Davis said.
MediaTek Cuts Xiaomi
The dark satanic rumour mill manufactured a hell on earth rumour that MediaTek has stopped supplying chips to Xiaomi.
MediaTek is apparently cross that Xiaomi has been investing in SoC supplier Leadcore Technology. Xiaomi has reportedly reached a deal with Leadcore allowing the phone maker to get access to the chip designer’s technology patents. DigiTimes however suggests that MediaTek has been trying to expand its presence in the mid-range and high-end market segments, but finds Xiaomi’s pricing strategy is disrupting its plans.
MediaTek’s MT6589T, a quad-core 1.5GHz chip, was originally designed to target mid-range and high-end mobile devices. The solution was introduced in Xiaomi’s Redmi smartphone in August 2013. However, prices for the Redmi series have been cut to as low as $114.
Xiaomi is ranked as the third largest smartphone vendor worldwide in the third quarter of 2014. Xiaomi’s shipments for the quarter registered a 211.3 per cent on-year jump boosting its market share to 5.3 per cent from 2.1 per cent during the same period of 2013.
Will ARM’s Mbed OS Help The IoT?
October 13, 2014 by admin
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ARM has announced a software tool to make Internet of Things (IoT) deployment faster and easier and thus speed up the creation of IoT devices.
Called the Mbed IoT Device Platform, the software is primarily an operating system (OS) built around open standards that claims to “bring Internet protocols, security and standards-based manageability into one integrated tool” in order to save money and energy in making IoT devices.
The Mbed IoT Device Platform is made up chiefly of the Mbed OS, a free operating system for Cortex-M processor based devices that “consolidates the building blocks of the IoT in one integrated set of software components” and contains security, communication and device management features to enable the development of lower power IoT devices.
The OS will be available to Mbed partners in the fourth quarter for early development, with the first production devices due in 2015 to allow companies to focus on innovation, reducing development costs and time to market.
It will also support standards such as Bluetooth Smart, 2G, 3G, LTE and CDMA cellular technologies, Thread, WiFi, and 802.15.4/6LoWPAN along with TLS/DTLS, CoAP, HTTP, MQTT and Lightweight M2M, ARM said.
The Mbed OS will also feature the Mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a more secure way. It also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers.
“This simplifies the integration of IoT devices that provide ‘little data’ into cloud frameworks that deploy big data analytics on the aggregated information,” said ARM. “Built around open standards, the product scales to handle the connections and management of millions of devices.”
Mbed Device Server is available now, with an aim to improve efficiency, security and manageability for devices using a “standards-based and IoT approach”, ARM said.
The software also comes with its own community, Mbed.org, which is the focus point for a more than 70,000 developers around the platform. The website provides a database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools. It is already up and running, ARM said.
“Deploying IoT-enabled products and services requires a diverse set of technologies and skills to be coordinated across an organization,” said ARM CEO Simon Segars. “ARM Mbed will make this easier by offering the necessary building blocks to enable our expanding set of ecosystem partners to focus on the problems they need to solve to differentiate their products, instead of common infrastructure technologies. This will accelerate the growth and adoption of the IoT in all sectors of the global economy.”
ARM is launching Mbed with a number of partners, including Atmel, CSR, Ericsson, Farnell, Freescale, IBM, KDDI, Marvell, Megachips, Multitech, Nordic Semiconductor, NXP, Renesas, Seecontrol, Semtech, Silicon Labs, Stream Technologies, ST, Telenor Connexion, Telefonica, Thundersoft, u-blox, wot.io and Zebra.
MediaTek Goes IoT
SoC designer MediaTek has launched a new push to develop technologies used in wearables and Internet-of-Things (IoT) devices.
Dubbed MediaTek Labs, the new organisation will offer tools for developers such as software and hardware development kits (SDKs and HDKs), but it will also offer other forms of support, i.e. tech support and marketing.
MediaTek LinkIt dev platform
The MediaTek LinkIt platform promises to offer a full-service approach for developers keen to enter the space. It allows developers familiar with MediaTek’s Arduino implementation to quickly migrate to the new platform
For the time being the platform is limited to the MediaTek Aster MT2502A processor. The company says it is the world’s smallest commercially available SoC. The chip can work with MediaTek’s WiFi and GPS companion chipsets.
The company is calling on developers to join the MediaTek Labs initiative and in case you are interested you can check out the details on the new MediaTek Labs website.
MediaTek Aster spec
Now for some juicy hardware. The Aster MT2502A is an ARM7 EJ-S part clocked at 260MHz. The dev board features 4MB of RAM and 16MB of flash. GPS and WiFi capability can be added using the MT3332 and MT5931 chips. The platform supports microSD, Bluetooth (including BLE), along with GSM and GPRS communications.
The Aster is clearly not an SoC for feature packed wearables with high resolution screens, but it could be used in more down to earth applications such as fitness trackers.
MediaTek says it will offer three platforms based on two wearable solutions. The One Application Use (OAU) platform is for fitness trackers and simple Bluetooth devices. The Simple Application Platform (SAU) is intended for smart watches, wristbands and more elaborate fitness trackers.
SAU is the focus segment for the Aster chipset and it should offer 5 to 7 days of battery life.
MediaTek Rich Application Platform
The Rich Application Platform (RAU) is for Android Wear and it will offer a lot more functionality out of the box, including camera support, 3D graphics, as well as Bluetooth, WiFi and GPS in the same package.
This platform sounds a bit more interesting, but details are sketchy. For some reason many media outlets erroneously described the first Aster chip as MediaTek’s only smartwatch chip, but it is clearly not intended for the Rich Application Platform.
We have yet to see what sort of silicon MediaTek can conjure up for high-end wearables, but this is what it has in mind. The platform is designed for high-end smartwatches and glasses. It will feature multicore processors clocked at 1GHz or more. The platform also includes Bluetooth, GSM/GPRS, GPS, WiFi, sensors and a proper TFT screen. Battery life is described as short, two to three days, which sounds a bit better than what the current generation of smartwatches can deliver.
Can Intel Go Wireless?
July 17, 2014 by admin
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Intel wants to lead the drive into a less wired world by pushing standards, drive down the cost, and make these technologies ubiquitous.
At Computex, Intel demonstrated WiGig wireless docking and simultaneous wireless charging of a laptop, smartphone, headset and tablet with a pad placed under a tabletop. The company said that it would deliver reference designs for systems that use the technology in 2016 as part of a future Core processor family known as Skylake.
WiGig trades range for speed and operates in the 60GHz spectrum, compared with 2.4- and 5.0GHz for WiFi. It can transfer data at speeds of up to 7Gbps, compared to a maximum speed of a little more than 1Gbps for 802.11ac.
WiGig can be used to stream video from a mobile device to a TV or monitor, replacing HDMI and DisplayPort cables, but is being seen as a way of carrying out networking and wireless docking. It means that you can put your laptop on your desk and it automatically connects with your monitor, keyboard and mouse, printer and other peripherals without cables.
Intel plans to make its own WiGig chips. The outfit said it will have silicon for both transmitters and receivers in production by the end of this year, and available in products in the first half of 2015. Intel also wants to push Rezence for wireless charging.
Chipzilla has added that it will contribute some of its own IP to expand the standard to support wireless charging of laptops (which requires at least 20 watts) and that Rezence will be part of a Skylake reference design by 2016. This means that the world could be wirelessly networked soon after that.