The slide appeared on the anandtech forums and shows the chip will be branded under the Xeon E5-2600 V4 series and will have at least “20 per cent more cores and last-level cache” than Haswell-EP.  It should be shipping on March 31st.

This CPU is started for an HP workstation, called the HP Z640, which succeeds the Z620.

The Xeon Broadwell-E uses Intel’ s14nm process which means 10-core chips will be available at the price of an 8-core chip from the previous generation.

The slide said that the Broadwell-E will deliver 18 per cent average performance increase over Haswell-EP, as well as support up to 2400MHz DDR4 memory for greater I/O throughput.

This slide follows the news that an 18-core Xeon Broadwell-EP CPU was spotted on eBay, carrying a price tag of $999 US. Dubbed Xeon E5-2600 v4, the chip was listed to feature a base clock speed of 2.2GHz and Turbo frequency of 3GHz, as well as a TDP of 145W, 2.5MB of L3 cache per core, with 45MB LLC cache in total.

Courtesy-Fud

Hexus spotted Yu Zheng, an R&D Manager at AMD Shanghai had listed the work on Project Greenland as a work experience highlight on his LinkedIn profile page. Greenland is described as “A leading chip of the first graphics IP v9.0 generation, it has full capacity of 4096 shader processor along with whole new SOC v15 architecture.”

The Graphics IP v9.0 designation is thought to signify a Vega GPU in the making. Zheng mentions this is an SOC, but then Hawaii and Fiji chips were described the same. Fiji is part of the graphics IP v8.0 family, as will be Polaris.

Vega following after Polaris, and designated as a ‘HMB2′ GPU by AMD, it looks like Vega based graphics cards will be the successors to the HBM equipped Fiji range such as the Radeon Fury and Nano. Fiju can manage 4096 stream processors,  but with an upgrade to HBM2, 14nm process and other optimisation it is estimated that a Greenland/Vega GPU based graphics cards will offer 20 to 30 per cent better performance.

So with Greenland/Vega sporting HBM2 memory Hexus thinks that Polaris packing graphics cards will therefore feature GDDR5/X memory.

Courtesy-Fud

The tear downs will start happening soon but our sources very close to the matter said with high certainly that all iPhone SE come with an updated Qualcomm modem.

Intel is still in the run but apparently Apple still felt confident to continue using Qualcomm even for this generation of the phone. A few analysts did suggested that iPhone 7 and beyond might get Intel LTE hardware, but not with iPhone SE.

Back in December, when we originally wrote that Intel got the iPhone SE deal, our sources did suggest that Apple can still change its mind if it doesn’t feel that Intel modem is ready. This might be the case, but in the future, we are quite confident that Apple will get a second LTE supplier at some point, just as it did with different manufacturing fabs.

Having two suppliers will drive the cost down, and for Apple every dollar or cent they save of components means millions more in its pocket. Apple claims “LTE up to 50 percent faster than iPhone 5s,” but it doesn’t give a real number. The iPhone 5S uses MDM9615 that was first introduced in 2011. This modem is at the technology range of Cat 4, X5 modem that Qualcomm ships in its entry level SoCs or as an external component.

We will have to wait for the first teardowns to appear as it is not easy to get to “ LTE up to 50 percent faster than iPhone 5s.” You would need a modem that is capable of 225 Mbps  and the next of potential candidates for the iPhone SE is the MDM 20nm 9×35. Qualcomm calls this modem X7 these days, it use to call it Gobi back in late 2014 and this is a Cat 6, 300 Mbit per second download and 50 Mbit per second upload capable chip.

The fact that Apple continues the exclusive deal with Qualcomm is bad news for Intel, but we are sure that the team blue will keep working on getting inside of iPhone.

Courtesy-Fud

RealSense is a mix of infrared, laser and optical cameras to measure depth and track motion. It can be used on a drone that can navigate its own way through a city block, but it is also good at detecting changes in facial expressions, and Intel wanted to give RealSense the ability to read human emotions by combining it with an emotion recognition technology developed by Emotient.

Plugging in Emotient allowed RealSense to detect whether people are happy or sad by analyzing movement in their lips, eyes and cheeks. Intel said that it could detect “anger, contempt, disgust, fear,” and other sentiments.

A few months ago the fruity cargo cult Apple acquired Emotient. Intel has removed the Emotient plug-in from the latest version of the RealSense software development kit.

It is not clear at this point if Apple told Intel that it invented the plug in and so it had to sling its hook, or if Intel did not want Jobs’ Mob anywhere near its technology.

The RealSense SDK has features that allow it to recognize some facial expressions, but it’s unclear if they’ll be as effective as the Emotient technology.

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According to Intel the drivers provide beta support for the Vulkan 1.0 API for 6th Generation Intel Core and related processors.

Vulkan 1.0 was introduced last month by industry consortium Khronos Group and is supposed to replace the OpenGL, which was first introduced in 1991 by Silicon Graphics. Vulkan is supposed to exploit powerful GPUs and multicore CPUs, but it is still a long way behind Direct X 12 – at least in its beta condition.

With Intel’s drivers developers will be able to exploit features on Intel GPUs, like the Iris Pro, that are integrated in chips alongside CPUs. Intel’s rival AMD has already released Vulkan drivers for Radeon graphics processors.

Vulkan 1.0 APIs will also work with Linux-based PCs like Steam Machines. Intel has made available open-source Vulkan drivers for Linux PCs running on chips code-named Broadwell and Skylake.

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According to Digitimes it fell to less than 30 million units in 2015 and the outfit suffering most was  AMD. The largest graphics card player Palit Microsystems, which has several brands including Palit and Galaxy, shipped 6.9-7.1 million graphics cards in 2015, down 10 per cent  on year. Asustek Computer shipped 4.5-4.7 million units in 2015, while Colorful shipped 3.9-4.1 million units, and is aiming to raise its shipments by 10 per cent  on year in 2016.

Micro-Star International (MSI) enjoyed healthy graphics card shipments at 3.45-3.55 million in 2015, up 15 per cent  on year, and EVGA, which has tight partnerships with Nvidia, also saw a significant shipment growth, while Gigabyte suffered from a slight drop on year. Sapphire and PowerColor suffered dramatic drops in shipments in 2015.

There are fears that several of the smaller GPU makers could be forced out of the market after AMD gets its act together with the arrival of Zen and Nvidia’s next-generation GPU architectures launch later in 2016.

Courtesy-Fud

The SDK gives developers access to advanced VR features, according to Qualcomm, allowing them to simplify development and attain improved performance and power efficiency with Qualcomm’s Snapdragon 820 processor, found in Android smartphones such as the Galaxy S7 and tipped to feature in upcoming VR headsets.

In terms of features, the development kit offers tools such as digital signal processing (DSP) sensor fusion, which allows devs to use the “full breadth” of technologies built into the Snapdragon 820 chip to create more responsive and immersive experiences.

It will help developers combine high-frequency inertial data from gyroscopes and accelerometers, and there’s what the company calls “predictive head position processing” based on its Hexagon DSP, while Qualcomm’s Symphony System Manager makes easier access to power and performance management for more stable frame rates in VR applications running on less-powerful devices.

Fast motion to photon will offer single buffer rendering to reduce latency by up to 50 percent, while stereoscopic rendering with lens correction offers support for 3D binocular vision with color correction and barrel distortion for improved visual quality of graphics and video, enhancing the overall VR experience.

Stereoscopic rendering with lens correction supports 3D binocular vision with color correction and barrel distortion for improved visual quality of graphics and video, enhancing the overall VR experience.

Rounding off the features is VR layering, which improves overlays in a virtual world to reduce distortion.

David Durnil, senior director of engineering at Qualcomm, said: “We’re providing advanced tools and technologies to help developers significantly improve the virtual reality experience for applications like games, 360 degree VR videos and a variety of interactive education and entertainment applications.

“VR represents a new paradigm for how we interact with the world, and we’re excited to help mobile VR developers more efficiently deliver compelling and high-quality experiences on upcoming Snapdragon 820 VR-capable Android smartphones and headsets.”

The Snapdragon VR SDK will be available to developers in the second quarter through the Qualcomm Developer Network.

The launch of Qualcomm’s VR SDK comes just moments after AMD also entered the VR arena with the launch of the Sulon Q, a VR-ready wearable Windows 10 PC.

Courtesy-TheInq

The plan is not official yet but appears to have been leaked to the Wall Street Journal. Achin Bhowmik, who oversees RealSense as vice president and general manager of Intel’s perceptual computing group, declined to discuss unannounced development efforts.

But he said Intel has a tradition of creating prototypes for products like laptop computers to help persuade customers to use its components. We have to build the entire experience ourselves before we can convince the ecosystem,” Bhowmik said.

Intel appears to be working on an augmented-reality headset when it teamed up with IonVR to to work on an augmented-reality headset that could work with a variety of operating systems, including Android and iOS. Naturally, it had a front-facing RealSense camera.

RealSense depth camera has been in development for several years and was shown as a viable product technology at the Consumer Electronics Show in 2014. Since then, nothing has happened and Microsoft’s Kinect sensor technology for use with Windows Hello in the Surface Pro 4 and Surface Book knocked it aside.

Intel’s biggest issue is that it is talking about making a consumer product which is something that it never got the hang of.

RealSense technology is really good at translating real-world objects into virtual space. In fact a lot better than the HoloLens because it can scan the user’s hands and translate them into virtual objects that can manipulate other virtual objects.

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While there have been cut-down Linux implementations before the increase in numbers of smart, connected devices has made something a little more specialized more important.

Zephyr is all about minimizing the power, space, and cost budgets of IoT hardware.
For example a cut down Linux needs 200KB of RAM and 1MB of flash, IoT end points, which will often be controlled by tiny microcontrollers.

Zephyr has a small footpoint “microkernel” and an even tinier “nanokernel.” All this enables it to be CPU architecture independent, run on as little as 10KB while being scalable.

It can still support a broad range of wireless and wired technologies and of course is entirely open saucy released under the Apache v2.0 License.

It works on Bluetooth, Bluetooth Low Energy, and IEEE 802.15.4 (6LoWPAN) at the moment and supports x86, ARM, and ARC architectures.

Courtesy-Fud

The new Toshiba SG5 SSD series will be available in 128GB, 256GB, 512GB and 1TB capacities as well as a couple of different form-factors, standard 2.5-inch and two different M.2 form-factors.

As noted, the Toshiba SG5 SSD series is based on 15nm TLC NAND with yet to be details controller and will offer sequential performance of up to 545MB/s for read and up to 388MB/s for write.

The 2.5-inch version of the Toshiba SG5 SSD series will be available in all aforementioned capacities, the M.2 2280-S2 (single side) form-factor version will be available in 128GB, 256GB and 512GB capacities and the M.2 2280-D2 (double side) version will only come in 1TB capacity.

The rest of the features are pretty standard for a consumer-grade SSD so you are looking at a power consumption 4.5W to 5.6W under load and 0.65W in idle and it includes Toshiba’s QSBC (Quadruple Swing-By Code) error correction technology.

Unfortunately, Toshiba did not unveil any details regarding the actual price of the new SG5 series SSDs but did say that it should be available sometime during this quarter.

Courtesy-Fud