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AMD A75 Motherboards Economically Priced

July 15, 2011 by  
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It appears that AMD’s A75 motherboards have finally started to hit the streets. Furthermore, we were truly shocked to see these MB’s economically priced for about $60.00.

Do not get too over excited in reference to the pricing because this gets you a decent A75 micro-ATX motherboard with up to four USB 3.0 ports and six SATA 6Gbps ports matched with a FM1 socket. It’s also worth pointing out that you will not get these same features like USB 3.0 and SATA 6Gbps on a comparable Intel platform in the same price range; you’d pay more.

We noticed that online retailer Newegg.com has an AMD motherboard selling for $59.99 after the rebate; otherwise it will cost $72.99. We expect the more serious computer geeks to opt for more muscle in regards to their motherboards; so they can whet their appetite for a good A75 for about $150.00.

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Gigabyte Debuts New Motherboards

July 14, 2011 by  
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Gigabyte just announced their new slate of motherboards that will support AMD’s A75 series chipsets and the latest AMD A-Series APUs or Llano. The new A75 based motherboards are said to offer DIY PC builders and developers a higher level of 3D and multimedia performance that is scalable and said to offer the best value upgrade path imaginable.

Gigabyte’s VP of Service and Marketing Henry Kao is quoted as saying that the new boards were new and exciting as AMD new APU’s were “ground breaking” APU technology. As well as bringing AMD A-Series technology to DIY users who demand excellent gaming and multimedia performance on a budget, these motherboards also offer a compelling upgrade path that includes Dual Graphics configurations.

The A75 motherboards from Gigabyte feature an AMD A75 ‘Hudson’ chipset supporting the latest 32 nanometer AMD A-Series APUs. That said, these chips are the first ever to combine a DX11-capable, high performance graphics processor with the option of a dual or quad core CPU on one silicon die, offering a 3D gaming and multimedia experience which is similar to a discrete graphics configuration.

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New MacBook Includes Faster NAND Chip

July 12, 2011 by  
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The soon to be released new version of Apple’s MacBook Air, will feature NAND flash memory with up to 400Mbps performance, about one and a half times faster than its current technology, according to a recent report.

Unlike many notebooks, the MacBook Air has no hard drive or optical drive and instead uses a slim flash board for its internal mass storage device.

Citing an “Asian electronics component company person,” the blog site Macotakara stated that Apple will use flash memory chips that includes the new Double Data Rate (DDR) 2.0 interface. While the rumors could not be confirmed, the upgrade would come as no surprise, since Apple’s next MacBook Air, which originally used Toshiba’s Blade X-gale NAND flash board, has moved to using Samsung’s flash memory. The MacBook Air’s current Samsung flash sports read rates of 261Mbps and write rates of up to 209Mbps and is based on DDR 1.0 technology.

DDR 2.0 provides a tenfold increase over the 40Mbps Single Data Rate (SDR) NAND flash in widespread use today.

In May, Samsung announced that it was producing DDR 2.0 multilevel cell flash chips. Samsung’s flash chips are made using its smallest circuitry, only 20 nanometers wide. The chips boast a performance improvement of three times over its previous technology.

DDR NAND flash comes in two forms: Toggle Mode from Samsung and Toshiba; and ONFI NAND, from the Open NAND Flash Interface (ONFI) working group. The ONFI protocol is used by flash manufacturers, including Intel, Micron, SanDisk, Hynix and Spansion. In March, the ONFI working group announced its 3.0 specification for the DDR 2.0 interface, which also has up to 400Mbps throughput but with only half the number of pins, for a significant reduction in size.

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TSMC May Beat Intel To Market With 3D Chip

June 20, 2011 by  
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.

TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.

The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.

With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.

“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”

3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.

“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”

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The Netbook Lives On

June 7, 2011 by  
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Tablets may be the hottest mobile devices on display at this year’s Computex. But netbooks still have a presence at the trade show, and vendors are coming out with several new models that will hit the market this year. Their low cost will continue to drive sales, analysts said.

PC maker Asus, a pioneer of the netbook concept, unveiled two new models at Computex. The Asus Eee PC 1025 C and 1025 CE are Windows netbooks that will launch worldwide in the fourth quarter of this year. Priced at $299, the devices are built with an “instant on” feature that allow users to resume Windows in two seconds from sleep mode.

The other Asus netbook that has caught some attention is the Eee PC X101, which runs Intel’s MeeGo mobile operating system. The device will launch worldwide in July and cost $199. Asus will also be releasing a Windows 7 version of the netbook that will cost between $240 and $250.

Asus’ rival Acer is also showing a low-cost netbook priced at $199. The Aspire One Happy has both Windows and Android 2.3 installed. Users can toggle between operating systems by rebooting the system. Acer launched a version of the device worldwide last month.

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Intel Is Still The Market Leader

May 26, 2011 by  
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Reports now show that Intel shipped 44 percent more Microprocessors than Samsung and Intel’s overall shipments grew 25 percent year-over-year. Meanwhile Samsung’s first quarter microprocessor grew by 15 percent.  The report also noted that Toshiba and TSMC came in a respectful 3rd and 4t with 10 and 18 percent of year over year growth respectively. Texas Instruments came in 5th barely edging out Renesas which appears to be closing the gap on TI.

Super mobile chipmaker Qualcomm was 10th and showed a 22 percent growth year-over-year; while AMD ranked 12th, with 2 percent growth.  One would have thought that AMD would have been one of the top five manufacturers.

Unfortunately Nvidia and Sony ended up at the bottom with ended up at the bottom with six and 14 percent drop in sales, respectively.

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Is Intel Facing The Heat?

May 25, 2011 by  
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Analysts at Goldman Sachs are saying that chip maker Intel may be in a pickle as microprocessor shipments slow and it faces stiff competition. That said, analysts have advised stockholders to sell Intel as they downgraded the stock.

James Covello and Simon Schafer of GS said that there will be a surplus in chips due to plant expansion. Meanwhile the rest of the gang on Wall Street is forecasting a six percent year-over-year rise in Intel’s sales, amid expanding gross margins, Goldman says otherwise and that sales will be flat due to excess capacity.

Furthermore, Intel is expected to face problems dealing with better chips from their main rival AMD: while tablets are cannibalising notebooks with ARM kicking its tail in the mobile space.

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Can Intel Tablets Take Business Away From iPads?

May 17, 2011 by  
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Tablets based on Intel’s first dedicated tablet processor may not be a smash hit among consumers like Apple’s iPad, but they could find much better acceptance within enterprises, analysts said this week.

Apple’s iPad is the ‘Golden Child’, but Intel’s Oak Trail processor could bring a fresh crop of tablets that are more closely aligned to security, software and hardware needs of businesses, analysts said. By supporting the Windows 7 OS, Oak Trail tablets will integrate better than the iPad into IT environments relying on Windows.

Tablets with Intel’s 1.5GHz Atom Z670 processor from Fujitsu and Motion Computing went on sale this month and will start shipping in June. Fujitsu is taking orders for the Stylistic Q550 Slate PC tablet, which is priced starting at US$729. Motion Computing is taking orders for the CL900 Tablet PC, which is priced starting at $899. The business tablets come with Microsoft’s Windows 7 OS and include solid-state drive storage. Intel has said 35 devices based on the Oak Trail chip will become available starting in May.

Apple may be spurring consumer tablet innovation, but computing needs are very different in the corporate world, said Stephen Baker, vice president of industry analysis at NPD. Outside the Apple ecosystem, there is a whole world of corporate applications and computing needs driven by Windows, Baker said.

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New Atom Architecture In The Making

May 16, 2011 by  
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Word on the street is that Intel is in the process of developing an entirely new Atom architecture based on its 3D transistor technology they announced last week.  This new architecture should enable more power efficiency on the chip.

The new processor is being called Silvermont and the Atom will encompass a system-on-chip design, similar to Intel’s Z760 Atom or ARM’s processors.  Silvermont is being designed on Intel’s 22nm process and harness the power of Intel’s 3D transistor technology that has yet to be tested.

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AMD Outs Phenom II X4 980

May 5, 2011 by  
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AMD just let the world see the glory of its processor prowess with the introduction of its fastest quad-core processor; which is called the Phenom II X4 980 Black Edition.

The chip is said to run at a lightning fast 3.7GHz.  The processor is also features a 6MB of L3 cache and a 125W TDP. Like previous Black Edition processors, the new Phenom is unlocked, which will also those techies to freely overclock the Phenom over 4GHz with no issues.

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