Acer Shifts Focus To IoT

Acer is still churning out PCs, but the Taiwanese vendor is far more bullish about the Internet of Things (IoT), a market the company doesn’t want to miss out on.

Acer held a news conference not for a new consumer product, but to promote an upcoming miniature PC that will be sold to developers.

The PC, called the aBeing One, will arrive in the third quarter, and is aimed at developers working in the IoT area. It’s designed to connect to smart home and wearable products, and act as a hub that can analyze incoming data from the devices.

The PC vendor has spoken to many IoT companies looking for an affordable hardware system they can develop on, said Robert Wang, a general manager with Acer.

“Fast-moving IoT developers keep running into this issue,” he said after Acer’s news conference. “Now they can buy from us.”

It’s a big change for the vendor, given that it once focused on selling consumer notebooks. However, with PC sales sagging and competition rife in the mobile devices area, the company has been shifting toward enterprise products.

That emphasis was apparent at this week’s Computex show in Taipei. Acer notebooks and tablets were still on display, but equal billing was given to itscloud computing business, which is starting to power IoT devices, not only from Acer, but also its clients.

In addition, Acer is hoping to pave the way for more third-party IoT devices. It has partnered with Canonical to install a version of Ubuntu on its aBeing product, so that the hardware can serve Ubuntu developers working on smart connected gadgets.

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Toshiba And SanDisk Launch 3D Flash Chip

Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.

The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.

Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.

24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.

“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.

“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”

Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.

Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.

The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.

All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.

Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.

Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.

This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.

The Toshiba and Sandisk BiCS chips are available for sampling from today.

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Panasonic Appears To Be On The Hunt

Japanese electronics giant Panasonic Corp said it is gearing up to spend 1 trillion yen ($8.4 billion) on acquisitions over the next four years, bolstered by a stronger profit outlook for its automotive and housing technology businesses.

Chief Executive Kazuhiro Tsuga said at a briefing on Thursday that Panasonic doesn’t have specific acquisition targets in mind for now. But he said the firm will spend around 200 billion yen on M&A in the fiscal year that kicks off in April alone, and pledged to improve on Panasonic’s patchy track record on big deals.

“With strategic investments, if there’s an opportunity to accelerate growth, you need funds. That’s the idea behind the 1 trillion yen figure,” he said. Tsuga has spearheaded a radical restructuring at the Osaka-based company that has made it one of the strongest turnaround stories in Japan’s embattled technology sector.

Tsuga previously told Reuters that company was interested in M&A deals in the European white goods market, a sector where Panasonic has comparatively low brand recognition.

The firm said on Thursday it’s targeting operating profit of 430 billion yen in the next fiscal year, up nearly 25 percent from the 350 billion yen it expects for the year ending March 31.

Panasonic’s earnings have been bolstered by moving faster than peers like Sony Corp and Sharp Corp to overhaul business models squeezed by competition from cheaper Asian rivals and caught flat-footed in a smartphone race led by Apple Inc and Samsung Electronics. Out has gone reliance on mass consumer goods like TVs and smartphones, and in has come a focus on areas like automotive technology and energy-efficient home appliances.

Tsuga also sought to ease concerns that an expensive acquisition could set back its finances, which took years to recover from the deal agreed in 2008 to buy cross-town rival Sanyo for a sum equal to about $9 billion at the time.

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Intel Opens Up Core M

Intel has extended its Core M range of fanless mobile chips by adding four models to the three initial Core M processors launched at the IFA trade show in September.

Like those first fanless models, Intel’s new Core M processors are dual-core chips that support Hyperthreading in up to four threads and have thermal design power (TDP) ratings of 4.5W.

They’re faster than the initial Core M chips, with base clock speeds ranging from 800MHz to 1.2GHz and Turbo Boost speeds from 2GHz to 2.9GHz.

The firm’s initial Core M chips were also rated at 4.5W TDP but topped out at 1.1GHz and 2.6GHz under Turbo Boost.

These additional fanless mobile chips are configurable by system designers, in that OEMs can scale the chip speeds and power consumption up or down depending on the purpose and configuration of the device.

A compact tablet or notebook can conserve power by limiting processor speed, while a larger device can offer higher speed at the cost of higher power draw and heat.

Thus, these new Core M chips can be configured from 600MHz base clock speed and 3.5W TDP to 1.4GHz base clock speed and 6W TDP in the fastest model.

Intel has also boosted the integrated graphics processors in these latest Core M chips, offering GPU base clock speeds ranging from 300MHz to 900MHz, whereas the initial models supported 100MHz to 850MHz.

The detailed specifications of all of Intel’s Core M mobile processors are available on the firm’s website.

Intel said that these new fanless Core M processors will start hitting the market early next year.

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Adobe Eases Privacy Concerns

Tests on the latest version of Adobe System’s e-reader software reveals the company is now collecting less data following a privacy-related row last month, according to the Electronic Frontier Foundation.

Digital Editions version 4.0.1 appears to only collect data on e-books that have DRM (Digital Rights Management), wrote Cooper Quintin, a staff technologist with the EFF. DRM places restrictions on how content can be used with the intent of thwarting piracy.

Adobe was criticized in early October after it was discovered Digital Editions collected metadata about e-books on a device, even if the e-books did not have DRM. Those logs were also sent to Adobe in plain text.

Since that data was not encrypted, critics including the EFF contended it posed major privacy risks for users. For example, plain text content could be intercepted by an interloper from a user who is on the same public Wi-Fi network.

Adobe said on Oct. 23 it fixed the issues in 4.0.1, saying it would not collect data on e-books without DRM and encrypt data that is transmitted back to the company.

Quintin wrote the EFF’s latest test showed the “only time we saw data going back to an Adobe server was when an e-book with DRM was opened for the first time. This data is most likely being sent back for DRM verification purposes, and it is being sent over HTTPS.”

If an e-book has DRM, Adobe may record how long a person reads it or the percentage of the content that is read, which is used for “metered” pricing models.

Other technical metrics are also collected, such as the IP address of the device downloading a book, a unique ID assigned to the specific applications being used at the time and a unique ID for the device, according to Adobe.

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HTC To Make the Next Google Nexus Tablet

Google Inc has chosen HTC Corp to develop and deliver its upcoming 9-inch Nexus tablet, the Wall Street Journal reported, citing people familiar with the matter.

Google had been mulling HTC as a potential Nexus tablet partner since last year and HTC engineers have been flying to the Googleplex in Mountain View in recent months to work on the project, the report said.

Google’s decision to pick HTC reflects its long-term strategy of building a broad base of partners from device to device to prevent any one manufacturer from gaining a monopoly, the report said.

That may also be one of the reasons why Google chose HTC over bigger rivals Samsung Electronics Co Ltd, maker of the Nexus 10 tablet.

Google and HTC declined to comment on the report.

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Intel Debuts A Slew Of Core M Chips

Intel’s new Core M chips — which bring PC-like performance to slim design tablets — will initially be in many Windows 8.1 tablets, but no Android devices are yet on the radar.

The chips will be in five to seven detachable tablets and hybrids by year end, and the number of devices could balloon to 20 next year, said Andy Cummins, mobile platform marketing manager at Intel.

Core M chips, announced at the IFA trade show in Berlin on Friday, are the first based on the new Broadwell architecture. The processors will pave the way for a new class of thin, large-screen tablets with long battery life, and also crank up performance to run full PC applications, Intel executives said in interviews.

“It’s about getting PC-type performance in this small design,” Cummins said. “[Core M] is much more optimized for thin, fanless systems.”

Tablets with Core M could be priced as low as US$699, but the initial batch of detachable tablets introduced at IFA are priced much higher. Lenovo’s 11.6-inch ThinkPad Helix 2 starts at $999, Dell’s 13.3-inch Latitude 13 7000 starts at $1,199, and Hewlett-Packard’s 13.3-inch Envy X2 starts at $1,049.99. The products are expected to ship in September or October.

Core M was also shown in paper-thin prototype tablets running Windows and Android at the Computex trade show in June. PC makers have not expressed interest in building Android tablets with Core M, but the OS can be adapted for the chips, Cummins said.

The dual-core chips draw as little as 4.5 watts, making it the lowest-power Core processor ever made by Intel. The clock speeds start at 800MHz when running in tablet mode, and scales up to 2.6GHz when running PC applications.

The power and performance characteristics make Core M relevant primarily for tablets. The chips are not designed for use in full-fledged PCs, Cummins said.

“If you are interested in the highest-performing parts, Core M probably isn’t the exact right choice. But if you are interested in that mix of tablet form factor, detachable/superthin form factor, this is where the Core M comes into play,” Cummins said.

For full-fledged laptops, users could opt for the upcoming fifth-generation Core processor, also based on Broadwell, Cummins said. Those chips are faster and will draw 15 watts of power or more, and be in laptops and desktops early next year.

New features in Core M curbed power consumption, and Intel is claiming performance gains compared to chips based on the older Haswell architecture. Tablets could offer around two more hours of battery life with Core M.

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Acers To Launh Cheap Tablets

Acer’s latest low-cost 8-inch tablets will come to market in both Android and Windows flavors.

The Iconia Tab 8 W runs Windows on an Intel Atom Z3735G quad-core processor. It offers 8 hours of battery life, weighs 370 grams and is 9.75 millimeters thick. The 8-inch screen has a resolution of 1280 by 800 pixels.

For the $149 price tag, Acer includes a one-year subscription to the Personal version of Office 365, which includes access to Word, Excel, PowerPoint, OneNote and Outlook.

Android fans will prefer the Iconia One 8, running Android 4.4. It has the same Intel processor and screen dimensions as its Windows cousin, but is slightly lighter at 340 grams and only 8.5 millimeters thick.

Buyers can choose between 10 colors, including red, green, blue, purple and pink.

Acer also took the covers off the Iconia 10, an Android-based 10-inch tablet. The device has a quad-core processor from MediaTek. The screen is protected using Gorilla glass and has Full HD resolution. Using Dolby Digital Plus, surround sound is simulated from two-channel stereo audio headphones.

Available in black or white and with a price of $199, the Iconia Tab 10 includes a micro HDMI port and Wireless Display support for showing photos and videos on a bigger TV.

The first of the new tablets to start shipping will be the Iconia 10, available this month in the Americas and Europe, Middle East and Africa (EMEA).

The Iconia Tab 8 W will go on sale in October in EMEA and in November in the Americas.

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Can Plastic Replace Silicon?

Can plastic materials morph into computers? A research breakthrough recently published brings such a possibility closer to reality.

Researchers are looking at the possibility of making low-power, flexible and inexpensive computers out of plastic materials. Plastic is not normally a good conductive material. However, researchers said this week that they have solved a problem related to reading data.

The research, which involved converting electricity from magnetic film to optics so data could be read through plastic material, was conducted by researchers at the University of Iowa and New York University. A paper on the research was published in this week’s Nature Communications journal.

More research is needed before plastic computers become practical, acknowledged Michael Flatte, professor of physics and astronomy at the University of Iowa. Problems related to writing and processing data need to be solved before plastic computers can be commercially viable.

Plastic computers, however, could conceivably be used in smartphones, sensors, wearable products, small electronics or solar cells, Flatte said.

The computers would have basic processing, data gathering and transmission capabilities but won’t replace silicon used in the fastest computers today. However, the plastic material could be cheaper to produce as it wouldn’t require silicon fab plants, and possibly could supplement faster silicon components in mobile devices or sensors.

“The initial types of inexpensive computers envisioned are things like RFID, but with much more computing power and information storage, or distributed sensors,” Flatte said. One such implementation might be a large agricultural field with independent temperature sensors made from these devices, distributed at hundreds of places around the field, he said.

The research breakthrough this week is an important step in giving plastic computers the sensor-like ability to store data, locally process the information and report data back to a central computer.

Mobile phones, which demand more computing power than sensors, will require more advances because communication requires microwave emissions usually produced by higher-speed transistors than have been made with plastic.

It’s difficult for plastic to compete in the electronics area because silicon is such an effective technology, Flatte acknowledged. But there are applications where the flexibility of plastic could be advantageous, he said, raising the possibility of plastic computers being information processors in refrigerators or other common home electronics.

“This won’t be faster or smaller, but it will be cheaper and lower power, we hope,” Flatte said.

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What Do Smaller Controllers Mean?

If you want a wearable Internet of Things, the electronics have to be as tiny and as energy efficient as possible. That’s why a new microcontroller by Freescale Semiconductor is noteworthy.

The company has produced the Kinetis KLO3 MCU, a 32-bit ARM system that is 15% smaller than its previous iteration but with a 10% power improvement.

Internet of Things is a buzzword for the trend toward network-connected sensors incorporated into devices that in the past were standalone appliances. These devices use sensors to capture things like temperatures in thermostats, pressure, accelerometers, gyroscopes and other types of MEMS sensors. A microcontroller unit gives intelligence and limited computational capability to these devices, but is not a general purpose processor. One of the roles of the microcontroller is to connect the data with more sophisticated computational power.

The Kinetis KLO3 runs a lightweight embedded operating system to connect the data to other devices, such as an app that uses a more general purpose processor.

Kathleen Jachimiak, product launch manager at Freescale, said the new microcontroller will “enable further miniaturization” in connected devices. This MCU is capable of having up to 32 KB of flash memory and 2 KB of RAM.

Consumers want devices that are light, small and smart. They also want to be able to store their information and send it to an application that’s either on a phone or a PC, Jachimiak said.

This microcontroller, at 1.6 x 2.0 mm, is smaller than the dimple on a golf ball, and uses a relatively new process in its manufacturing, called wafer level chip scale packaging. The process involves building the integrated package while the die is still part of a wafer. It’s a more efficient process and produces the smallest possible package, for a given die size.

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