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Artificial Photosynthesis Developed
August 6, 2012 by admin
Filed under Around The Net
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Panasonic said on Monday it has created a new system for artificial photosynthesis that can remove carbon dioxide from the air almost as well as plants do, as part of the company’s entry into an industry-wide trend toward greener tech.
The company said its system uses nitride semiconductors, which are widely used in LEDs (light-emitting diodes) to convert light to energy, and a metal catalyst to convert carbon dioxide and water to formic acid, which is widely used in dyes, leather production and as a preservative.
Carbon dioxide is a major pollutant and considered to be a main cause of the “greenhouse effect,” which most climate scientists believe causes global warming.
Panasonic has struggled with its traditional electronics business and has made eco-friendly products and practices the key element in its turnaround plan. The company is hoping to leverage its large rechargeable battery and solar businesses, while joining the industry in embracing technologies that are friendlier to the environment. The issue is an important one with customers, as demonstrated by the the outcry earlier this month when Apple was forced to rejoin a green standards program when clients complained about its earlier withdrawal.
Panasonic said the system can convert carbon dioxide and water to formic acid with an efficiency of 0.2 percent in laboratory conditions, which is similar to the conversion rate for green plants. The efficiency refers to the portion of the incoming light energy stored in materials produced during the process.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”