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TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
Samsung Goes HSA
It seems that the IFA 2012 show in Berlin was a good show for AMD as well, or to be precise, it was good for the HSA (Heterogeneous System Architecture) Foundation founded by AMD, ARM, Texas Instruments, Imagination and Mediatek. Samsung has joined up alongside six new members.
The HSA Foundation was created back in June at AMD’s Fusion Developer Summit as a foundation that will deliver new user experiences through advances in computing architectures in order to improve power efficiency, performance, programmability, portability across computing devices and general support of software across a broad spectrum of devices in order to remove the need for code rewriting for various different platforms.
Senior Manager of Technology Marketing at AMD, Sasa Marinkovic, noted on the AMD blog that there is no doubt that the HSA Foundation is off to a good start and in addition to Samsung, they are more than happy to welcome six additional companies including Apical, Arteris, MulticoreWare, Sonics, Symbio and Vivante.
Will Qualcomm Buy AMD?
This wild rumor is not completely without merit, as Qualcomm did acquire a piece of AMD, or AMD’s handheld graphics business to be precise, and it would not be too surprising to see Qualcomm after the whole company sometime in the future.
Samsung on the other hand is not an entirely impossible choice, but at this point it won’t be acquiring AMD either.
It looks like market players want to see the acceptance of Windows RT that will finally prove how important ARM processors really are and knowing AMD, the worst is behind them, as 2012 was the year of many chances, cancelation and anything but good execution for them.
Meanwhile Qualcomm is doing great in the ARM market, although its Snapdragon S4 line suffers from insufficient 28nm production, but due to its on-chip LTE implementation the chips are sought after, especially in the United States market.
Will Chipmakers Make Cuts This Year?
Gartner is warning that worldwide wafer fab equipment spending is on pace to total $33 billion in 2012 which is a decline of 8.9 percent from 2011.
Gartner analysts warned that this is a sign of an industry in downturn and said the market will return to growth in 2013 with WFE spending projected to surpass $35.4 billion, a 7.4 percent increase from 2012. Bob Johnson, research vice president at Gartner said 2012 spending was strong at the beginning of the year, as foundries and other logic manufacturers ramped up sub-30-nm production.
AMD, ARM And Others Form HSA Chip Foundation
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AMD, ARM, Imagination Technologies, Mediatek and Texas Instruments have signed up to create the Heterogeneous System Architecture Foundation (HSAF).
AMD has been pushing its vision for heterogeneous computing, where CPUs and GPUs can share system resources such as memory allowing developers to treat any processing core as a black box. Now the firm has managed to rope in ARM, Imagination Technologies, Mediatek and Texas Instruments to create the non-profit HSAF.
According to AMD, HSAF will try to define a hardware specification for developers to standardise upon, which should make development quicker and easier.
Phil Rogers, HSAF president and AMD corporate fellow said, “HSA [heterogeneous system architecture] moves the industry beyond the constraints of the legacy system architecture of the past 25-plus years that is now stifling software innovations. By aiming HSA squarely at the needs of the software developer, we have designed a common hardware platform for high performance, energy efficient solutions. HSA is unlocking a new realm of possibilities across PCs, smartphones, tablets and ultrathin notebooks, as well as the innovative supercomputers and cloud services that define the modern computing experience.”
AMD has scored something of a coup by getting big names such as ARM, Imagination and Texas Instruments to back its vision of a heterogeneous system architecture. Although the company has been struggling in outright performance terms against Intel, the idea of a combining CPU and GPU resources and making them appear as one to the application is something that will help it leverage its GPU compute capability against Intel.
Qualcomm Chip Issues Should End By December
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Qualcomm said it believes TSMC’s 28nm supply issues will continue until year end.
Qualcomm, which relies solely on TSMC for its 28nm chips, said it believes the supply of chips will improve, but the firm expects its 28nm supply not to be back to normal until the end of 2012.
Previously Qualcomm had poured scorn on TSMC by telling investors it is looking at rival wafer fabs to avoid supply issues in the future. Qualcomm’s CEO Paul Jacobs told Reuters once again that the firm is looking to other foundries for extra capacity, adding, “The goal is to get enough supply for everyone.”
TSMC’s 28nm process node has been tapped by a number of big name customers including AMD, Nvidia and Qualcomm, with the chip fab unable to meet demand. Since Qualcomm made the rare public admission that it wasn’t happy with the state of TSMC’s 28nm chip supply, the smart money has been on Globalfoundries picking up the slack, however nothing specific has been announced by either firm.
Qualcomm Updates The S4 Series
Qualcomm’s Snapdragon S4 chips are proving to be quite a coup for the company. They are faster than anything the competition has to offer, more power efficient and some versions include integrated LTE. The only problem is that Qualcomm is having trouble meeting demand.
Qualcomm announced four new S4 chip series aimed at wildly different market segments, all based on the very successful Krait architecture.
Snapdragon S4 Prime chips will target smart TVs and similar applications. The first Prime part is the MPQ8054, a 1.5GHz quad-core with Adreno 320 graphics. Qualcomm promises “leading” audio/video capabilities and low power consumption, although we are not sure efficiency very important in TVs.
Meanwhile Snapdragon S4 Pro parts sound like all-rounders. They also feature Adreno 320 graphics and the S4 Pro tier includes the APQ8064 quad-core and MSM8960T, the Pro version of MSM8960. Pro parts are likely to end up in tablets, hybrids and other “ultra-thin and sleek” devices.
S4 Plus parts are geared towards the traditional mobile market, smartphones and tablets, ranging from the low-end to the high-end. Processors in the S4 Plus tier include MSM8960, APQ8060A, MSM8660A, MSM8260A, APQ8030, MSM8930, MSM8630, MSM8230, MSM8627 and MSM8227.
Is Qualcomm A Threat To Intel?
Intel tried to do gaming graphics cards and it failed, but when it comes to CPUs for desktop and notebooks, it is currently dominating the market. Even the graphics used in Intel’s latest integrated CPUs these days are quite decent for multimedia and even some basic gaming.
Still, Intel is now shifting its focus and it sees Qualcomm as its main competitor in years to come. We heard this from high ranked sources from within Intel who believe that Qualcomm is the only ARM company that has it all, and Intel wants to take it on.
Intel is carefully watching Nvidia and Texas Instruments, again two strong ARM players, but it still thinks Qualcomm has better time to market, more customers and a much stronger portfolio.
Intel should start shipping Medfield just in time for Windows 8, and in case you’ve missed it, Medfield is a SoC (System on Chip) platform that should find its place to a few tablets and probably even some phones next year. Since Intel is trying to speed development up and put as much pressure on ARM players as possible, its next generation SoC will also come before the end of 2012, and it will use the advanced 22nm process, something we won’t see in ARM chips next year.
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China’s Supercomputer Uses Homegrown Chips
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China has built its latest supercomputer based entirely on homegrown microprocessors, a major move towards breaking the country’s reliance on Western technology for high-performance computing.
China’s National Supercomputer Center in Jinan debuted the computer last Thursday, according to a report from the country’s state-run press. The supercomputer uses 8,704 “Shenwei 1600″ microprocessors, which were developed by a design center in Shanghai, called the National High Performance Integrated Circuit Design Center.
Details of the microprocessors and the design center were not immediately available.
The supercomputer has a theoretical peak speed of 1.07 petaflops (quadrillion floating-point calculations per second), and a sustained performance of 0.79 petaflops when measured with the Linpack benchmark. This could place it at number 13 in the world’s top 500 supercomputing list. Photos of the chips used and the supercomputer’s data center can be found here.
China’s Shandong Academy of Sciences built the computer. Officials of the academy could not be immediately reached for comment on Monday.
A report from The New York Times said the supercomputer’s name in English was the Sunway BlueLight MPP.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”