It has taken Amazon some time to fall into line on this. Two-factor authentication has become increasingly popular and common in the past couple of years, and it is perhaps overdue for a firm that deals so heavily in trade.

Amazon is treating it like it’s new, and is offering to hold punters’ hands as they embrace the security provision.

“Amazon Two-Step Verification adds an additional layer of security to your account. Instead of simply entering your password, Two-Step Verification requires you to enter a unique security code in addition to your password during sign in,” the firm said.

The way that the code is served depends on the user, who can choose to get the extra prompt in one of three ways. They may not appeal to those who do not like to over-share, but they will require a personal phone number.

As is frequently the case, Amazon will offer to send supplementary log-in information to a phone via text message or voice call, and even through a special authenticating app.

It’s an option, and you do not have to enable it. Amazon said that users could select trusted sign-on computers that spare them from the mobile phone contact.

“Afterward, that computer or device will only ask for your password when you sign in,” explained the Amazon introduction, helpfully.

There are a number of other outfits that offer the two-factor system and you might be advised to take their trade and do your business through them. Apple, Microsoft, Google, Twitter, Dropbox, Facebook and many others offer the feature.

A website called TwoFactorAuth will let you check your standing and the position of your providers.

Source- http://www.thegurureview.net/technology-2/amazon-finally-goes-two-factor.html

VR-World says that stage one results are finished and where shown off this week at SC15. This included a Heterogeneous Compute Compiler (HCC); a headless Linux driver and HSA runtime infrastructure for cluster-class, High Performance Computing (HPC); and the Heterogeneous-compute Interface for Portability (HIP) tool for porting CUDA-based applications to C++ programming.

AMD hopes the tools will drive application performance from machine learning to molecular dynamics, and from oil and gas to visual effects and computer-generated imaging.

Jim Belak, co-lead of the US Department of Energy’s Exascale Co-design Center in Extreme Materials and senior computational materials scientist at Lawrence Livermore National Laboratory said that AMD’s Heterogeneous-compute Interface for Portability enables performance portability for the HPC community.

“The ability to take code that was written for one architecture and transfer it to another architecture without a negative impact on performance is extremely powerful. The work AMD is doing to produce a high-performance compiler that sits below high-level programming models enables researchers to concentrate on solving problems and publishing groundbreaking research rather than worrying about hardware-specific optimizations.”

The new AMD Boltzmann Initiative suite includes an HCC compiler for C++ development, greatly expanding the field of programmers who can leverage HSA.

The new HCC C++ compiler is a key tool in enabling developers to easily and efficiently apply the hardware resources in heterogeneous systems. The compiler offers more simplified development via single source execution, with both the CPU and GPU code in the same file.

The compiler automates the placement code that executes on both processing elements for maximum execution efficiency.

Source- http://www.thegurureview.net/computing-category/amd-appears-to-be-pushing-its-boltzmann-plan.html

Over the last few months both have been busy with new releases. Nvidia has its GeForce GTX 950 and GTX 980 Ti, while AMD put its first HBM-powered cards in the Radeon R9 Fury X, Fury and the super-small R9 Nano into the shops.

According to JPR, overall GPU shipments are up quarter-over-quarter – with AMD’s overall GPU shipments up 15.8 per cent. But before AMD fanboys get all excited by a surprise return to form from AMD, JPR said that that NVIDIA “had an exceptionally strong quarter”. Nvidia saw an uptick of 21.3 per cent.

The PC market as a whole increased by 7.5 per cent quarter-over-quarter but decreased 9 per cent year-over-year. Nivida’s discrete GPU shipments were up 26.3 per cent according to JPR, while AMD’s discrete GPUs spiked by 33 per cent.

AMD’s mobile GPU shipments for notebooks increased by 17 per cent, while NVIDIA had 14 per cent.

Revenues for the last part of the year will be adversely affected by an about one per cent drop in wafer ASPs and capacity at its plants will slide to 81-83 per cent in the fourth quarter from 89% in the third.

UMC’s had already lowered capacity in the third quarter. At the beginning of the year it was running at 94 percent.

The company’s revenues decreased 7.1 per cent to $1.07 billion in the third quarter, with gross margin slipping below 20 per cent.

UMC net profits were down 62.9 per cent on quarter, as both operating and non-operating income eroded. This is bad news because in the first three quarters of 2015, UMC’s net profits increased 35.8 per cent from a year earlier.

However UMC is continuing to invest in new capital and will spend $1.8 billion.

CEO Po-Wen Yen said that the continuing IC inventory adjustment will dampen fourth quarter wafer shipments, but UMC continues on the path towards long-term growth.

“Throughout 2015, UMC engineers and Fab12A have worked tirelessly to bring several new 28nm product tape-outs into volume production. “UMC is working to bring a timely conversion of new 28nm requirements into production, which will strengthen our business.”
Courtesy-http://www.thegurureview.net/computing-category/will-umc-chip-shipments-drop-in-the-fall.html

But they are being resisted by the banking industry, which sees no need to invest further in PIN technology, already used with debit cards, resulting in halting adoption and widespread confusion.

A small band of retailers with the clout to call the shots on their branded credit cards is leading the charge. Target Corp is moving ahead with a chip-and-PIN rollout, and Wal-Mart Stores Inc plans to do the same.

But Wal-Mart said it faces obstacles because its credit card partner, Synchrony Financial, is not yet able to handle PINs on credit cards. Synchrony declined comment.

Broadly, U.S. banks are unprepared or resisting the change.

The impasse comes after many consumers got their hands on new credit cards embedded with so-called EMV chips in advance of an Oct. 1 deadline that required retailers to accept chip cards or be liable for fraud losses. EMV stands for EuroPay, MasterCard and Visa.

But only about a third of merchants are actually using the chip technology, according to analyst estimates. The number may not pick up until early next year, if at all, because the retail industry typically halts upgrades during the crucial holiday shopping season.

“PIN issuance will remain a niche,” said Julie Conroy, credit-card analyst with Aite Group.

Banks favor using chip cards verified by old-school signatures, even though chip-and-PIN usage has led to lower fraud over the decade they have been used in Europe and elsewhere.

“The PIN is definitely a must,” said Lance James, chief scientist with cyber intelligence firm Flashpoint. “It’s one extra step that provides true two-factor authentication.”

But bankers say PINs provide little benefit beyond the advantage of using chips in combating the estimated $7 billion-plus in annual U.S. card fraud.

EMV chips thwart criminals who use stolen data to create counterfeit cards, a category that Aite estimates accounts for 37 percent of that fraud. Banks say that PINs only provide additional fraud protection when criminals seek to use lost or stolen cards, a situation that Aite estimates accounts for only 14 percent of fraud.

Banking groups say there are better approaches than PINs for verifying customers and have asked retailers to embrace tokenization and encryption to prevent theft of credit card numbers.

“PIN is a static data element that would not have a meaningful impact on overall payments fraud,” said Electronic Payments Coalition spokesman Sam Fabens.

Courtesy-http://www.thegurureview.net/aroundnet-category/confusion-continues-to-reign-with-u-s-chip-pin.html

The carrier also announced it is creating a new dedicated network core for IoT connections that can scale far beyond the ability of its existing networks with the intent to reach billions of sensors and devices.

“Continued innovation in smart cities, connected cars and wearables demonstrates that IoT is the future for how we will live and work,” said Mike Lanman, senior vice president of enterprise products at Verizon during an event held at Verizon’s San Francisco Innovation Center. He said Verizon is taking a “holistic approach” to help expand the IoT market from millions of connections to billions. The event was webcast.

Other major wireless carriers, including AT&T, are developing programs to offer a range of services to industries and cities for connecting IoT sensors to wireless networks and then to cloud services for data analysis.

At Verizon, Lanman said the company is working to lower the cost of connecting billions of existing devices that companies have used for years to Verizon’s network. Holding up a new computer chip made by Sequans Communications, an LTE chip maker, he said the chip will provide a “significant reduction in cost…that changes the game.” It will provide 4G LTE connectivity in modules connected to IoT devices to “make the wide-area network more accessible to developers.”

Also, next year Verizon will launch a new IoT core network within its LTE network to provide a “much lower cost” than with Verizon’s existing wired and wireless networks.

“The cost for an IoT module and the cost to connect will both drop dramatically,” Lanman added. “Whether you are connecting your dog or water meters and any other low-payload devices, we’ll handle it through a new IoT core.”

Source-http://www.thegurureview.net/consumer-category/verizon-launches-thingspace-for-iot-development.html

Designed for demanding embedded needs, the processors incorporate the newest AMD 64-bit x86 CPU core (“Excavator”), plus third-generation Graphics Core Next GPU architecture, and better power management for reduced energy consumption.

AMD tells us that combined, these chips provide industry-leading graphics performance and key embedded features for next-generation designs. The SOC architecture enables simplified, small form factor board and system designs from AMD customers and a number of third party development platform providers.

What AMD brings to the party is its graphics and multimedia performance, including capability for hardware-accelerated decode of 4K video playback and support for the latest DDR4 memory.
Jim McGregor, principal analyst, TIRIAS Research said that AMDs push into x86 embedded platforms is paying off with an increasing number of customers and applications.

“There is a need for immersive graphics, high-quality visualization, and parallel computing in an increasing number of embedded applications. Across these fronts, the AMD Embedded R-Series SOC is a very compelling solution.”

Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that his outfit’s AMD Embedded R-Series SOC is a strong match for these needs in a variety of industries including digital signage, retail signage, medical imaging, electronic gaming machines, media storage, and communications and networking.

“The platform offers a strong value proposition for this next generation of high-performance, low-power embedded designs.”

The new AMD Embedded R-Series SOCs offer 22 percent improved GPU performance when compared to the 2nd Generation AMD Embedded R-Series APU2 and a 58 percent advantage against the Intel Broadwell Core i7 when running graphics-intensive benchmarks.

AMD released some of the specs for its integrated AMD Radeon graphics including:

Up to eight compute units4 and two rendering blocks

GPU clock speeds up to 800MHz resulting in 819 GFLOPS

•DirectX 12 support

Fully HSA Enabled

The AMD Embedded R-Series SOC was architected with embedded customers in mind and includes features such as industrial temperature support, dual-channel DDR3 or DDR4 support with ECC (Error Correction Code), Secure Boot, and a broad range of processor options.

It has a configurable thermal design power (cTDP) allows designers to adjust the TDPs from 12W to 35W in 1W increments for greater flexibility.

The SOC also has a 35 percent reduced footprint when compared to the 2nd Generation AMD Embedded R-Series APU, making it an excellent choice for small form factor applications.

AMD said that the range is the first embedded processor with dual-channel 64-bit DDR4 or DDR3 with Error-Correction Code (ECC), with speeds up to DDR4-2400 and DDR3-2133, and support for 1.2V DDR4 and 1.5V/1.35V DDR3.

Its dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB) and initiates trusted boot environment before starting x86 cores
It has a high-performance Integrated FCH featuring PCIe Gen3 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, and UART

The AMD Embedded R-Series SOC provides industry-leading ten-year longevity of supply. The processors support Microsoft Windows 7, Windows Embedded 7 and 8 Standard, Windows 8.1, Windows 10, and AMD’s all-open Linux driver including Mentor Embedded Linux from Mentor Graphics and their Sourcery CodeBench IDE development tools.

It will be interesting to see if AMD can make up the ground it has lost on PCs and higher ticket items. Most of the company still appears to be in a holding pattern until Zen arrives.

Courtesy-http://www.thegurureview.net/computing-category/will-amds-newest-soc-save-the-company.html

The new Mali-470 GPU has half the power consumption and two times the energy efficiency of the Mali-400, and is designed for next-generation wearables and IoT devices such as industrial control panels and healthcare monitors that rely on low-cost and low-power chips.

The Mali-470 supports OpenGL ES 2.0, used by Android and Android Wear, hinting that the GPU could also find its way into low-cost smartphones. If not, ARM promises that the chip will bring smartphone-quality visuals to wearable and IoT devices, supporting screen resolutions of up to 640×640 on single-core devices, and higher resolutions for multi-core configurations.

ARM envisions the new GPU paired with its efficient Cortex-A7 or A53 CPU designs for a low-power SoC.

“ARM scrutinises every milliwatt across the entire SoC to enable OEMs to optimize energy efficiency and open up new opportunities,” said Mark Dickinson, vice president and general manager of ARM’s multimedia processing group.

“Tuning efficiency is particularly relevant for devices requiring sophisticated graphics on a low power budget such as wearables, entry-level smartphones and IoT devices. The Mali-470 has been designed to meet this demand by enabling a highly capable user interface while being extremely energy efficient.”

ARM expects the first SoCs using the GPU be ready by the end of 2016, meaning that the chip will start showing up in devices the following year.

The launch of the Mali-470 GPU comes just hours after ARM announced plans to pick up the product portfolio and other business assets of Carbon Design Systems, a supplier of cycle-accurate virtual prototyping solutions.

The deal will see Carbon’s staff transfer to ARM, where the chip firm will make use of the Massachusetts-based outfit’s expertise in virtual prototypes. This will enable ARM to iron out any bugs and make improvements to chips before they move to foundries for production.

ARM also said that Carbon will help the firm enhance its capability in SoC architectural exploration, system analysis and software bring-up.

Courtesy-TheInq

Chief executive Lisa Su admitted that ARM-based server chips have experienced slower-than-expected reception from the owners of data centres and server farms.

AMD delayed its own ARM-based Opteron microprocessor, code-named Seattle, until the fourth quarter of this year. ARM was having a harder time proving itself to the multibillion-dollar market for high-end server chips.

An engineering sample of AMD’s long awaited 8 core server SOC code named “Hierofalcon” has been spotted and tested and according to WCCTech it looked pretty good. Itis based around 8 ARM-64bit A57 cores running at 2.0Ghz. And although Hierofalcon maxes out at frugal TDP of 30W.

So even the promising reviews aren’t enough for AMD to be optimistic about the ARM based gear.

Su said in an analyst conference call that the company expects to see “modest production shipments” of Seattle in the fourth quarter. Meanwhile, AMD’s Intel-compatible “x86″ server chips will be the company’s mainstay product offering for data centres.

She said that AMD was continuing its ARM efforts and is seeing them as a longer term bet.

Source-http://www.thegurureview.net/computing-category/amds-bet-on-arm-does-not-appear-to-be-helping.html