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Samsung Finally Starts 14nm FinFET
A company insider has spilled the beans in Korea, claiming that Samsung has started Apple A9 production in 14nm FinFET.
The A9 is the next generation SoC for Apple iPhone and iPad products and it is manufactured on the Samsung – GlobalFoundries 14nm FinFET manufacturing process. In the other news, Samsung’s Ki-nam, president of the company’s semiconductor business and head of System LSI business has confirmed that the company started production of 14-nanometre FinFET chips.
The report mentions Austin as a possible site for Apple products but we wonder if the GlobalFoundries Fab 8 in New York State could become one of the partners for the 14nm FinFET manufacturing. Samsung didn’t officially reveal the client for the 14nm FinFET, but Apple is the most obvious candidate, while we expect to see 14 / 16nm FinFET graphics chips from AMD and Nvidia but most likely in the latter half of 2015 at best.
Qualcomm is likely to announce new LTE modem based on 14nm FinFET and the flagship SoC Snapdragon 810 is a 20nm chip. Qualcomm is manufacturing its 810 chips as we speak to meet demand for flagship Android phones coming in Q1 2015. Flagship Samsung, HTC and LG phones among others are likely to use Snapdragon 810 as a replacement for this year’s Snapdragon 801, a high end chip that ended up in millions of high-end phones.
Samsung / GlobalFoundries14nm FinFET process is 15 percent smaller, 20 percent faster, and 35 percent more power efficient compared to 20nm processors. This definitely sounds exiting and will bring more performance into phones, tablets, GPUs and will significantly decrease power consumption. The move from 28nm is long overdue.
We believe that Qualcomm’s LTE modem might be the first chip to officially come with this manufacturing process and Apple will probably take most of the 14nm production for an update in its tablets and phones scheduled for 2015.
Will The Chip Industry Take Fall?
Microchip Technology has managed to scare Wall Street by warning of an industry downturn. This follows rumours that a number of US semiconductor makers with global operations are reducing demand for chips in regions ranging from Asia to Europe.
Microchip Chief Executive Steve Sanghi warned that the correction will spread more broadly across the industry in the near future. Microchip expects to report sales of $546.2 million for its fiscal second quarter ending in September. The company had earlier forecast revenue in a range of $560 million to $575.9 million. Semiconductor companies’ shares are volatile at the best of times and news like this is the sort of thing that investors do not want to hear.
Trading in Intel, whiich is due to report third quarter results tomorrow, was 2.6 times the usual volume. Micron, which makes dynamic random access memory, or DRAM, was the third-most traded name in the options market. All this seems to suggest that the market is a bit spooked and much will depend on what Chipzilla tells the world tomorrow as to whether it goes into a nosedive.
Intel Discusses SoFIA
Intel has shed more light on its upcoming SoFIA SoC, which stands for Smart of Feature Phone with Intel Architecture. For SEO purposes we’ll just call it Sophie.
The SoFIA project is being spearheaded by Intel’s Singapore office and CNET had a chance to catch up with recent developments. The chip was announced back in December, but details were sketchy and to some extent they still are.
SoFIA is going after MediaTek and Qualcomm in the mainstream and entry level segments. It features a dual-core Silvermont processor on a 28nm die. This is where it gets interesting, as Intel simply doesn’t do 28nm. SoFIA will be manufactured by TSMC instead, but Intel is planning to build SoFIA chips in-house in the future. The company has already made it clear that it is moving to 14nm, so there is a good chance the next generation chip will be a 14nm design churned out by Intel fabs.
SoFIA has an integrated 3G modem, but a 4G version is coming later. Bluetooth and WiFi are on other chips. Lack of 4G connectivity might not be a big deal for potential SoFIA customers, as the chip is supposed to go after entry level smartphone designs. Intel told CNET that SoFIA could pave the way to $50 smartphones in Asian markets and realistically nobody expects a $50 phone to feature 4G connectivity.
It is hard to say anything about SoFIA’s real-world performance. Quad-core tablet processors based on the Silvermont architecture can still hold their ground against many high-end ARM SoCs, so a dual-core version optimised for smartphones should have no trouble keeping up with lesser ARM parts.
AMD’s Carrizo Goes Mobile Only
AMD’s upcoming Carrizo APU might not make it to the desktop market at all.
According to Italian tech site bitsandchips.it, citing industry sources, AMD plans to limit Carrizo to mobile parts. Furthermore the source claims Carrizo will not support DDR4 memory. We cannot confirm or deny the report at this time.
If the rumours turn out to be true, AMD will not have a new desktop platform next year. Bear in mind that Intel is doing the exact same thing by bringing 14nm silicon to mobile rather than desktop. AMD’s roadmap previously pointed to a desktop Carrizo launch in 2015.
AMD’s FM2+ socket and Kaveri derivatives would have to hold the line until 2016. The same goes for the AM3+ platform, which should also last until 2016.
Not much is known about Carrizo at the moment, hence we are not in a position to say much about the latest rumours. AMD’s first 20nm APU will be Nolan, but Carrizo will be the first 20nm big core. AMD confirmed a number of delays in a roadmap leaked last August.
The company recently confirmed its first 20nm products are coming next year. In all likelihood AMD will be selling 32nm, 28nm and 20nm parts next year.
ARM Launches Juno
ARM has announced two programs to assist Android’s ascent into the 64-bit architecture market.
The first of those is Linaro, a port of the Android Open Source Project to the 64-bit ARMv8-A architecture. ARM said the port was done on a development board codenamed “Juno”, which is the second initiative to help Android reach the 64-bit market.
The Juno hardware development platform includes a system on chip (SoC) powered by a quad-core ARM Cortex-A53 CPU and dual-core ARM Cortex-A57 CPU in an ARM big.little processing configuration.
Juno is said to be an “open, vendor neutral ARMv8 development platform” that will also feature an ARM Mali-T624 graphics processor.
Alongside the news of the 64-bit initiatives, ARM also announced that Actions Semiconductor of China signed a license agreement for the 64-bit ARM Cortex-A50 processor family.
“Actions provides SoC solutions for portable consumer electronics,” ARM said. “With this IP license, Actions will develop 64-bit SoC solutions targeting the tablet and over-the-counter (OTT) set top box markets.”
The announcements from ARM come at an appropriate time, as it was only last week that Google announced the latest version of its Android mobile operating system, Android L, which comes with support for 64-bit processors. ARM’s latest developments mean that Android developers are likely to take advantage of them in the push to take Android to the 64-bit market.
Despite speculation that it would launch as Android 5.0 Lollipop, Google outed its next software iteration on Wednesday last week as simply Android L, touting the oddly-named iteration as “the largest update to the operating system yet”.
Broadcom Going Smart Devices
Broadcom has come out with a new “smart” chip which it hopes will be at the cutting edge of wearable PCs, such as smartwatches, heart and blood-pressure monitor.
Dubbed Wireless Internet Connectivity for Embedded Devices (WICED) smart chip, Broadcom’s designs are supposed to support wireless charging for devices that are too small to connect via a power cord. The devices run an ARM Cortex M3 applications processor that reduces size and cost for OEMs and supports A4WP wireless charging and enhanced data security modes in addition to secure over-the-air firmware updates.
This is an integrated ARM CM3 microcontroller unit with radio frequency and Embedded Bluetooth Smart Stack, all on a single chip. Brian Bedrosian, Broadcom senior director of Embedded Wireless and Wireless Connectivity said that his outfit wanted to push the boundaries on what wearables are capable of with our new smart chip. Broadcom competes in the marketplace with companies such as Taiwan Semiconductor, Marvell and Xilinx.
The Broadcom WICED Smart chip is currently sampling with evaluation boards and SDKs. It is expected to become available sometime in 2014.
Did Intel Miss The Tablet Boat?
Intel CEO Brian Krzanich has admitted the obvious – Intel missed the boat on tablets.
Speaking at the Code Conference, Krzanich said the company was slow to react to the emergence of tablets and smartphones.
“There was a belief that tablets would be a consumption device only (and) that people would come back to the laptop and the PC. There were heavy debates within Intel and it took a while for us to accept and acknowledge that data. Companies make mistakes,” Krzanich told Walt Mossberg in an interview.
In other words at least part of Intel’s failure to tap the emerging mobile market a few years ago was internal wrangling.
The course shifted under the Krzanich regime. Last Intel President Renee James and Krzanich made it clear that the company is now treating its Atom line-up just like its big cores. For years the company treated Atoms as a sideshow, making sure that they would not eat into Core sales.
ARM had different ideas and so did AMD, they went after the tablet and essential notebook markets. As a result ARM currently dominates the mobile space, while AMD managed to carve a nice niche in the entry-level x86 segment, with Brazos and Kabini parts.
Intel is fighting back, but it is paying a heavy price. The company is on track to quadruple its tablet SoC shipments to 40 million units this year, but it has to pay through the nose to get there. As for the smartphone market, Intel is all but absent.
Krzanich insists he is not giving up on the phone and tablet space. He wants Intel to take a 15 to 20 percent market share in these segments, which sounds very ambitious. Thanks to generous subsidies it has a good chance in the tablet space. This week Intel announced a deal with Rockchip, which should also boost its presence in the booming tablet market in China.
However, so far the company has not rolled out a compelling smartphone SoC and it’s lagging behind the competition in LTE integration.
Intel Links Up With Rockchip
Intel has joined forces with Chinese chip design firm Rockchip to develop next generation processors for the tablet market based on Intel Atom core technology and integrating 3G broadband communications.
Under the terms of the agreement, Intel and Fuzhou Rockchip Electronics (Rockchip) will work together on an Intel branded mobile system on chip (SoC) processor with the intention of enabling a range of entry-level Android tablets.
The chip is expected to ship in the first half of 2015, according to Intel, and will be based on a quad-core Atom processor design integrated with Intel’s 3G modem technology, which the firm gained through its acquisition of Infineon Technologies in 2010.
Rockchip, which is expected to contribute to the integrated graphics technology, will also help Intel bring the product to market faster than might otherwise be the case. The firm is a leading fabless semiconductor design company and already develops mobile SoCs, although its present designs are largely focused around the ARM architecture.
The agreement builds on announcements Intel made at an investor relations day last year, where chief executive Brian Krzanich disclosed the Intel Sofia family, of which the latest chip will form part, and conceded that the chipmaker needed to become more agile in order to gain traction in entry-level markets.
“The strategic agreement with Rockchip is an example of Intel’s commitment to take pragmatic and different approaches to grow our presence in the global mobile market by more quickly delivering a broader portfolio of Intel architecture and communications technology solutions,” Krzanich said.
With this announcement, the Intel Sofia family comprises three products, which are not shipping yet.
A dual-core 3G version is slated for the fourth quarter this year, the quad-core 3G version is due in the first half of 2015, and a version with 4G/LTE communication is also due in the first half of next year.
GPUs Down In Q1
June 5, 2014 by admin
Filed under Around The Net
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According to Jon Peddie Research (JPR), shipments of discrete graphics cards were down in the first quarter of the year. This is in line with seasonal trends, as the market cools down after the holiday season.
The sequential drop was 6.7 percent, which was still better than the overall desktop PC market, which slumped 9 percent. However, on a year-to-year basis add-in-board (AIB) shipments were down 0.8 percent. PC sales were down 1.1 percent.
Nvidia still controls two thirds of the market
Total AIB shipments in Q1 were just 14 million units. AMD and Nvidia both saw their shipments decrease 6.6 percent, so their market share did not change much.
Nvidia controls an estimated 65 percent of the market, up from 64.2 percent last year. AMD’s market share in Q1 was 35 percent, down from 35.6 percent a year ago.
The overall volume remains weak and in the long run things could get even worse, as on-die integrated graphics have already taken a big toll on sales of entry level discrete cards. As integrated GPUs become even faster, they are likely to cannibalize the low end market even further.
JPR points out that the AIB market peaked in 1999, with 114 million units shipped. Last year saw only 65 million units and the stagnant trend is likely to continue this year.
It’s not all bad news for AIBs
Although the slump in discrete GPU shipments is hurting AMD and NV hardware partners, JPR offers a rather encouraging outlook.
It points out that graphics cards are one of the most powerful, essential and exciting components in the PC market today. PC gaming is hardly dead, in fact it is going through what can only be described as a small renaissance. PCs will offer 4K/UHD gaming years ahead of consoles and the Steam Machine concept is looking good, too.
The compute market is another driver, as JPR points out:
“The technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. It would be little exaggeration to say that the AIB resembles the 800-pound gorilla in the room.”
The AIB market is quite a bit less colourful and eventful than it was back in the day, but at least AIBs still have a lot on their hands and they are trying to tap new markets.
Can MediTek Win With Amazon?
According to the Taiwan Economic Daily, the chipmaker will supply SoCs for upcoming Amazon tablets. Details are sketchy and it is unclear whether MediaTek has landed an order for all Kindle Fire SKUs or just one of them. The paper claims MediaTek will start shipping the chips later this year, but we have no way of confirming or denying the report.
The chip in question appears to be the MT8135. It is a mid-range big.LITTLE part announced last year and it features two Cortex A15 and two Cortex A7 CPU cores. The GPU comes from Imagination and it’s the relatively fresh PowerVR G6200. The GPU is capable of churning out 83.2 GFLOPS at 650MHz, depending on the configuration of course.
It sounds like a decent all-round SoC, with a substantially faster GPU than previous MediaTek offerings in the same segment, which were powered by venerable SGX 54x and Mali 400/450 GPUs.
Information is limited and we can’t say for sure whether or not MediaTek actually landed the deal, or whether the deal includes more than a single Kindle Fire SKU. If true, it is a big coup for the Taiwan-based chipmaker, as Amazon ships up to two million Kindle tablets each quarter.
It would also help MediaTek’s ambitious tablet plans. The company hopes to double shipments of tablet-centric SoC products this year.