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Can Sumsung Compete With Intel?

October 19, 2015 by  
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Samsung is not doing that well in smartphones. To be fair, no one is, but Samsung has the ability to become something much more interesting – it could replace AMD as Intel’s rival.

Actually AMD is pretty cheap right now and if it was not for the pesky arrangement that prevents AMD’s buyer getting its x86 technology then it would have been snapped up a while ago. But with, or without AMD, Samsung could still make a good fist of chipmaking if it put its mind to it. At the moment its chipmaking efforts are one of the better things on its balance sheet.

Its high-margin semiconductor business is more than making up for the shortfall in smartphones. Selling chips to rivals would be more lucrative if they were not spinning their own mobile business. The products it have are worth $11.7 billion this year, more than half the company’s total.

Growing demand for chips and thin-film displays is probably the main reason that Samsung now expects operating profit to have reached $6.3 billion. After applying Samsung’s 16 percent corporate tax rate, its chip division is likely to bring in net income of slightly less than $10 billion.

To put this figure into perspective Intel expects to earn $10.5 billion in this year. Samsung is also sitting on a $48 billion net cash pile. Samsung could see its handset and consumer electronics business as a sideline and just focus on bumping off Intel.

The two sides of such a war would be fascinating. Intel has its roots in the PC chip market which is still suffering while Samsung is based in the mobile chip market which is growing. Intel has had no luck crossing into the mobile market, but Samsung could start looking at server and PC chips.

AMD is still dying and unable to offer Intel any challenge but there is a large market for those PC users who do not want to buy Intel. What Samsung should have done is use its huge cash pile to buy its way into the PC market. It might have done so with the IBM tech which went to Lenovo. It is still not out of the running on that front. Lenovo might be happy to sell IBM tech to Samsung.

Another scenario is that it might try to buy an x86 licence from Intel. With AMD dying, Intel is sitting on a huge monopoly for PC technology. It is only a matter of time before an anti-trust suit appears. Intel might think it is worthwhile to get a reliable rival to stop those allegations taking place. Samsung would be a dangerous rival, but it would take a while before it got itself established. Intel might do well to consider it. Of course Samsung might buy AMD which could sweeten that deal for Intel.

Samsung could try adapting its mobile chip technology for the PC/server market – it has the money to do it. Then it has a huge job marketing itself as the new Intel.

Source-http://www.thegurureview.net/computing-category/can-samsung-compete-with-intel-in-the-x86-chip-space.html

AMD Increases FM2+ Lineup

September 22, 2015 by  
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AMD will expand its socket FM2+ chip lineup with three new parts – the A10-7890K and A8-7690K APUs, and the Athlon X4 880K CPU.

The new parts showed up on the compatibility list of socket FM2+ motherboards by BIOSTAR and it is not clear when they will be in the shops.

The architecture mentioned is “Kaveri,” but the silicon could be “Godavari” which is a Kaveri refresh.

The top of the range will be the A10-7890K, which has CPU clock speeds of 4.10 GHz out of the box. We do not know what the TurboCore frequency will be, but the current A10-7870K offers 3.90 GHz with 4.10 GHz TurboCore. The A8-7690K has a CPU clocks of 3.70 GHz. We are not sure what the iGPU clock speeds of the two chips.

The Athlon X4 880K is the most interesting. It has 4.00 GHz CPU clocks. The Athlon X4 FM2+ series lack integrated graphics that means that they are good for those who will buy discrete GPUs, on the FM2+ platform.

All three chips offer unlocked base-clock multipliers, enabling CPU overclocking.

Source-http://www.thegurureview.net/computing-category/amd-increases-fm2-lineup.html

Is Electricity In TSMC’s Future?

September 18, 2015 by  
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Contract chip-maker Taiwan Semiconductor Manufacturing Company (TSMC) is thinking of generating electricity in-house.

The cunning plan is to install electric generating equipment at its factories or even building its own power plant.

Apparently, the company’s electricity bill will go up by 50 per cent over the next ten years as it moves to more-advanced technologies.

Taiwan is already facing power shortage problems and TSMC is worried that its plans could be stuffed up.

TSMC has asked Taiwan’s Ministry of Economic Affairs (MOEA) and government-owned Taiwan Power Company (Taipower) about the feasibility of building its own power generators and related regulatory matters.

According to Digitimes companies can set up power generating equipment for use at their own factory sites, but the law has to be revised to allow TSMC to build its own power plant.

TSMC previously pointed out that it does not necessarily need nuclear power unless there is an alternative. We really hope that quote does not mean that TSMC is considering going nuclear.

Source-http://www.thegurureview.net/computing-category/is-electricity-in-tsmcs-future.html

Both AMD And nVidia Preparing For 14nm

September 4, 2015 by  
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AMD and Nvidia both appear to be certain to get their “14 nm” out next year.

According to TweakTown Nvidia is apparently dotting the “I” and working out where to put in the semi-colons for its Pascal GPU using TSMC’s 16nm FinFet node. AMD rumored has been wining and dining its old chums at GlobalFoundries to use its 14nm process for its Greenland GPU.

Although these sound like different technologies the “14nm and 16nm”  is difference how you measure a transistor. The outcome of both 14 and 16 should be a fairly same sized transistor with similar power features. TSMC calls its process 16nm FinFet, while Samsung and GloFo insist on calling it 14nm FinFet.

The dark satanic rumor mill suggests that the Greenland GPU, which has new Arctic Islands family micro-architecture, will have HBM2 memory. There will be up to 32GB of memory available for enthusiast and professional users. Consumer-oriented cards will have eight to 16GB of HBM2 memory. It will also have a new ISA (instruction set architecture).

It makes sense, AMD moved to HBM with its Fury line this year. Nvidia is expected to follow suit in 2016 with cards offering up to 32GB HBM2 as well.

Both Nvidia and AMD are drawn to FinFET which offers 90 percent more density than 28nm. Both will boost the transistors on offer with their next-generation GPUs, with 17 to 18 billion transistors currently being rumored.

Source- http://www.thegurureview.net/computing-category/are-both-amd-and-nvidia-readying-to-release-a-14nm-gpu.html

AMD’s Quantum Has Intel Inside

July 1, 2015 by  
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AMD’s Project Quantum PC system, with graphics powered by two of the new Fiji GPUs may have got the pundits moist but it has been discovered that the beast has Intel inside

KitGuru confirmed that the powerful tiny system, as shown at AMD’s own event, was based upon an Asrock Z97E-ITX/ac motherboard with an Intel Core i7-4790K ‘Devil’s Canyon’ processor.

Now AMD has made a statement to explain why it chose to employ a CPU from one of its competitor in what is a flagship pioneering gaming PC.

It told Tom’s Hardware that users wanted the Devil’s Canyon chip in the Project Quantum machine.

Customers “want to pick and choose the balance of components that they want,” and the machine shown off at the E3  was considered to be the height of tech sexiness right now.

AMD said Quantum PCs will feature both AMD and Intel CPUs to address the entire market, but did you see that nice Radeon Fury… think about that right now.

IT is going to be ages before we see the first Project Quantum PCs will be released and the CPU options might change. We would have thought that AMD might want to put its FinFET process ZEN CPUs in Project Quantum with up to 16 cores and 32 threads. We will not see that until next year.

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TSMC Moving To 16FF+ Soon

June 12, 2015 by  
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TSMC’s 16nm FinFET process has barely gotten off the ground, but the foundry is already talking about 16nm FinFET Plus, which is due to launch by the end of the year.

The improved 16nm FinFET Plus (16FF+) node is supposed to deliver more efficiency and performance, making TSMC’s node more competitive compared to Samsung’s 14nm node. That is the general idea, but TSMC’s first generation 16nm node has failed to impress in terms of design wins.

TSMC president CC Wei said the new 16FF+ node already has 20 tapeouts, ten of which achieved satisfactory yield performance. Wei said the company expects up to 50 tapeouts by the end of the year. TSMC expects 16FF+ to enter commercial production in the second half of the year.

16FF+ is not the only FinFET node coming from TSMC over the next year. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. In addition, 10nm FinFET is expected to enter risk production by the end of 2015, reports Digitimes.

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Can TSMC Beat Samsung?

June 11, 2015 by  
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TSMC has said that it is confident that it can beat Samsung Electronics in ramping up production on its 10nm lines.

Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016,.

But in a statement TSMC claimed it could the outfit said the way things are shaping up it could beat that time table. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor.

We expect to hear a bit more about TSMC’s plans at its Taiwan Technology Symposium 2015 on May 28. At the upcoming event, the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.

TSMC chairman Morris Chang remarked earlier in 2015 that TSMC expects to gain a majority of market share in the FinFET segment in 2016.

Intel is also expected to release its first chips made using 10nm process technology as early as in the middle of 2016.

Source

ARM Sets New mBed Standard

May 29, 2015 by  
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ARM has bought in a new assurance standard to work with embedded devices.

The ARM mbed Enabled program aims to increase the deployment rate of Internet of Things (IoT) products and supporting technologies by giving partners the ability to label them as interoperable mbed-based devices.

Arm said that the accreditation program will cover solutions entering a broad range of developer markets; from silicon and modules to OEM products and innovative cloud services. Accreditation will be free of charge.

ARM Zach Shelby, vice president of IoT business marketing, said that ARM mbed Enabled accreditation will assure the diverse IoT ecosystem that they are using technologies backed up by an expert community of innovators,.

“This will also instill confidence in end markets where interoperability, trust and security standardisation is required to unlock commercial potential.”

Since the ARM mbed IoT Device Platform was announced in October 2014, the mbed Partner ecosystem has continued to grow from the initial 24 launch partners. Today, 8 new partners are being announced including Advantech, Athos, Captiva, Espotel, Maxim Integrated, MegaChips, SmeshLink, and Tieto.

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Can MediaTek Take On Qualcomm?

March 11, 2015 by  
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While Qualcomm’s 20nm Snapdragon 810 SoC might be the star of upcoming flagship smartphones, it appears that MediaTek has its own horse for the race, the octa-core MT6795.

Spotted by GforGames site, in a GeekBench test results and running inside an unknown smartphone, MediaTek’s MT6795 managed to score 886 points in the single-core test and 4536 points in the multi-core test. These results were enough to put it neck to neck with the mighty Qualcomm Snapdragon 810 SoC tested in the LG G Flex 2, which scored 1144 points in the single-core and 4345 in the multi-core test. While it did outrun the MT6795 in the single-core test, the multi-core test was clearly not kind on the Snapdragon 810.

The unknown device was running on Android Lollipop OS and packed 3GB of RAM, which might gave the MT6795 an edge over the LG G Flex 2.

MediaTek’s octa-core MT6795 was announced last year and while we are yet to see some of the first design wins, recent rumors suggested that it could be powering Meizu’s MX5, HTC’s Desire A55 and some other high-end smartphones. The MediaTek MT6795 is a 64-bit octa-core SoC clocked at up to 2.2GHz, with four Cortex-A57 cores and four Cortex-A53 cores. It packs PowerVR G6200 graphics, supports LPDDR3 memory and can handle 2K displays at up to 120Hz.

As we are just a few days from Mobile World Congress (MWC) 2015 which will kick off in Barcelona on March 2nd, we are quite sure that we will see more info as well as more benchmarks as a single benchmark running on an unknown smartphone might not be the best representation of performance, it does show that MediaTek certainly has a good chip and can compete with Qualcomm and Samsung.

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AMD’s Carrizo Coming In The Second Quarter

February 5, 2015 by  
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.

Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.

This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.

There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.

Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.

Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.

Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.

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