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Intel And Oracle Team Up Again

June 24, 2014 by  
Filed under Computing

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Oracle has added systems to its enterprise-class x86 server line featuring elastic computing capabilities that dynamically adapt their configurations in response to workloads.

The Oracle Sun Server X4-4 and Sun Server X4-8 are four-socket and eight-socket systems designed for data centre workloads such as virtualisation, Oracle databases and scale-up enterprise applications.

However, the two servers are fitted with a unique variant of Intel’s Xeon E7 v2 processor family that combines the capabilities of three different Xeon processors into one.

Oracle said it worked with Intel to create this chip, the Xeon E7-8895 v2, which can dynamically switch its core count, clock frequency and power consumption without the need for a system level reboot.

This chip is the heart of the elastic computing capability of the Sun Server X4-4 and Sun Server X4-8, enabling them to adapt to the requirements of different workloads based on its runtime configuration.

It might be configured for transaction processing at a high clock speed for one hour, then switched to higher core counts for the next hour for higher throughput computing, according to Oracle.

“Through close collaboration with Intel, we are the first to announce servers based on the new Xeon E7-8895 v2 processors and the first with unique capabilities that allow customers to dynamically address different workloads in real time,” said Ali Alasti, senior vice president for hardware development at Oracle.

Enhancements have also been made to the system firmware and to Oracle’s Solaris, and Oracle Linux operating systems to support the elastic computing features.

Oracle also said the new systems have a modular design that allows the processors to be upgraded to future Xeon chips, while all the disks are hot-swappable, plus there is hot-pluggable I/O support for industry-standard low-profile PCI Express cards via a dual PCIe card carrier.

The servers also feature a “glueless” architecture that removes the need for a node controller. As node controllers typically change from one processor generation to the next because of modifications to inter-processor communication and coherency protocols, the elimination enables Oracle to offer a future-proof chassis that will support future processor releases from Intel, the firm said.

The Sun Server X4-8 is touted by Oracle as ideal for running its Oracle Database, which has just been updated with an in-memory processing option. It supports 120 processor cores with up to 6TB of memory in its 5U rack-mount chassis, plus up to 9.6TB of hard drive or 3.2TB of solid state drive (SSD) storage.

Meanwhile, the Sun Server X4-4 is said to be well suited for applications requiring large memory footprint virtual machines and running real-time analytics software.

It can be configured with two or four of the Xeon E7-8895 v2 processors, with up to 3TB of memory and 4.8TB of PCIe flash plus 2.4TB of SSDs or 7.2TB of hard drives.

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Will Intel Drop Itanium?

February 25, 2013 by  
Filed under Computing

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Intel has scaled back plans for its next Itanium chip, prompting observers the question Intel’s commitment to the chip.Intel said the next version of Itanium, codenamed Kittson, will be a 32nm part. It will not migrate to a more advanced process. The new chips will use the same socket as the existing Itanium 9300 and 9500 chips.

Analyst Nathan Brookwood said the move is Intel’s idea of an exit strategy.

“It may very well be that Itanium’s time has come and gone,” he said.

Gartner analyst Martin Reynolds told Computerworld that Itanium might see a new process in the future, if it proves successful enough to make the investment worthwhile. However, he does not expect any more major updates to the architecture.

Itanium launched in 2001 and it quickly became a running joke in the industry. It never achieved the volumes expected by Intel and AMD seized the opportunity to take on Intel with 64-bit Opterons. However, Itanium soldiered on for years, although many vendors stopped developing software for the chip.

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