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Tech Firms Form OTrP To Support IoT Security
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A bunch of tech firms including ARM and Symantec have joined forces to create a security protocol designed to protect Internet of Things (IoT) devices.
The group, which also includes Intercede and Solacia, has created The Open Trust Protocol (OTrP) that is now available for download for prototyping and testing from the IETF website.
The OTrP is designed to bring system-level root trust to devices, using secure architecture and trusted code management, akin to how apps on smartphones and tablets that contain sensitive information are kept separate from the main OS.
This will allow IoT manufacturers to incorporate the technology into devices, ensuring that they are protected without having to give full access to a device OS.
Marc Canel, vice president of security systems at ARM, explained that the OTrP will put security and trust at the core of the IoT.
“In an internet-connected world it is imperative to establish trust between all devices and service providers,” he said.
“Operators need to trust devices their systems interact with and OTrP achieves this in a simple way. It brings e-commerce trust architectures together with a high-level protocol that can be easily integrated with any existing platform.”
Brian Witten, senior director of IoT security at Symantec, echoed this sentiment. “The IoT and smart mobile technologies are moving into a range of diverse applications and it is important to create an open protocol to ease and accelerate adoption of hardware-backed security that is designed to protect onboard encryption keys,” he said.
The next stage is for the OTrP to be further developed by a standards-defining organisation after feedback from the wider technology community, so that it can become a fully interoperable standard suitable for mass adoption.
Courtesy-TheInq
ARM Shows Off 10nm Chip
ARM’s collaboration with TSMC has finally born some fruit with the tapeout of a 10nm test chip to show off the company’s readiness for the new manufacturing process.
The new test chip contains ARM’s yet-to-be-announced “Artemis” CPU core which is named after a goddess who will turn you into deer and tear you apart with wild dogs if you ever see her. [The NDA must have been pretty tough on this chip.ed]
In fact things have been ticking along on this project for ages. ARM discloses that tapeout actually took place back in December last year and is expecting silicon to come back from the foundry in the following weeks.
ARM actually implemented a full four-core Artemis cluster on the test chip which should show vendors what is possible for their production designs. The test chip has a current generation Mali GPU implementation with 1 shader core to show vendors what they will get when they use ARM’s POP IP in conjunction with its GPU IP. There is also a range of other IP blocks and I/O interfaces that are used to validation of the new manufacturing process.
TSMC’s 10FF manufacturing process is supposed to increase density with scaling’s of up to 2.1x compared to the previous 16nm manufacturing node. It also brings about 11-12 per cent higher performance at each process’ respective nominal voltage, or a 30 per cent reduction in power.
ARM siad that comparing a current Cortex A72 design on 16FF+ and an Artemis core on 10FF on the new CPU and process can halve the dynamic power consumption. Currently clock frequencies on the new design are still behind the older more mature process and IP, but ARM expects this to improve as it optimizes its POP and the process stabilizes.
Courtesy-Fud
IPv6 Turns 20, Did You Notice?
IPv6 is 20 years old and the milestone has been celebrated with 10 percent adoption across the world for the first time.
The idea that IPv6 remains so far behind its saturated incumbent, IPv4, is horrifying given that three continents ran out of IPv4 addresses in 2015. Unfortunately, because the product isn’t ‘end of life’ most internet providers have been working on a ‘not broken, don’t fix it’ basis.
But 2016 looks to be the year when IPv6 makes its great leap to the mainstream, in Britain at least. BT, the UK’s biggest broadband provider, has already committed to switch on IPv6 support by the end of the year, and most premises will be IPv6-capable by April. Most companies use the same lines, but it will be up to each individual supplier to switch over. Plusnet, a part of BT, is a likely second.
IPv6 has a number of advantages over IPv4, most notably that it is virtually infinite, meaning that the capacity problems that the expanded network is facing shouldn’t come back to haunt us again. It will also pave the way for ever faster, more secure networks.
Some private corporate networks have already made the switch. Before Christmas we reported that the UK Ministry of Defence was already using the protocol, leaving thousands of unused IPv4 addresses lying idle in its wake.
IPv6 is also incredibly adaptable for the Internet of Things. Version 4.2 of the Bluetooth protocol includes IPv6 connectivity as standard, making it a lot easier for tiny nodes to make up a larger internet-connected grid.
Google’s latest figures suggest that more than 10 percent of users are running IPv6 connections at the weekend, while the number drops to eight percent on weekdays. This suggests that the majority of movement towards IPv6 is happening in the residential broadband market.
That said, it is imperative that businesses begin to make the leap. As Infoblox IPv6 evangelist Tom Coffeen told us last year, it could start to affect the speed at which you are able to trade.
“If someone surfs onto your site and its only available in IPv4, but they are using IPv6, there has to be some translation, which puts your site at a disadvantage. If I’ve not made my site available in IPv6, I’m no longer in control over where that translation occurs.”
In other words, if you don’t catch up, you will soon get left behind. It was ever thus.
Courtesy-TheInq
Will Qualcomm Unveil The Snapdragon 820 SoC
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Qualcomm is set to unveil its new Snapdragon 820 SoC on August 11 in LA and more details are being leaked than you would see at a Welsh leak recipe contest.
It appears that the new Snapdragon 820 will have the catchy title MSM8996 and it promises some significant performance improvements in key areas. We already know that it will not be catching fire, but it also has a 40 per cent GPU performance increase with its A530 GPU.
The device is also claimed to have a 30 per cent power improvement with 64b of shared virtual memory with the CPU.
Another big area of improvement is the Hydra CPU, which claims a 35 percent improvement compared to the Snapdragon 810.
The Snapdragon 820 will support 4k60 entertainment and high-speed data connectivity.
There are rumours that there will be a QFE3100 Envelope Tracking system this will not speed up mail in the criminally slow Italian Post Office, but should create a lower power and a thermal footprint. A dedicated low power sensor is integrated for always on use.
Another major upgrade compared to the older SoC is a switch from 20nm to 14nm FinFET manufacturing process. We are still expecting the Xiaomi Mi5 to be the first one to use it.
Acer Shifts Focus To IoT
Acer is still churning out PCs, but the Taiwanese vendor is far more bullish about the Internet of Things (IoT), a market the company doesn’t want to miss out on.
Acer held a news conference not for a new consumer product, but to promote an upcoming miniature PC that will be sold to developers.
The PC, called the aBeing One, will arrive in the third quarter, and is aimed at developers working in the IoT area. It’s designed to connect to smart home and wearable products, and act as a hub that can analyze incoming data from the devices.
The PC vendor has spoken to many IoT companies looking for an affordable hardware system they can develop on, said Robert Wang, a general manager with Acer.
“Fast-moving IoT developers keep running into this issue,” he said after Acer’s news conference. “Now they can buy from us.”
It’s a big change for the vendor, given that it once focused on selling consumer notebooks. However, with PC sales sagging and competition rife in the mobile devices area, the company has been shifting toward enterprise products.
That emphasis was apparent at this week’s Computex show in Taipei. Acer notebooks and tablets were still on display, but equal billing was given to itscloud computing business, which is starting to power IoT devices, not only from Acer, but also its clients.
In addition, Acer is hoping to pave the way for more third-party IoT devices. It has partnered with Canonical to install a version of Ubuntu on its aBeing product, so that the hardware can serve Ubuntu developers working on smart connected gadgets.
Qualcomm Gives Snapdragon More Umph
Qualcomm has released a new Trepn Profiler app for Android which will profile Snapdragon processors and tinker with them.
The Trepn Profiler app identifies apps that overwork the CPU or are eating too much data. The app will pinpoint which of the apps drain the battery faster.
All data that will be obtained by this app can provide information you need to know which program is slowing down your phone.
Most Android phone users will not give a damn, but developers will find it useful. Those who are interested in testing roms, custom kernels, and their own apps can use the data gathered by the Trepn Profiler.
Developers can measure optimisation and performance on Snapdragon-powered mobile devices. Data are real-time include network usage, battery power, GPU frequency load, and CPU cores’ load. Key features also include six fast-loading profiling presets, and an advanced mode to manually select data points and save for analysis.
The Advanced Mode allows profiling a single app or device, offline data analysis, and increasing of data collection interval. This special mode also allows longer profiling sessions, displaying two data point in one overlay, and viewing of profile data.
All up this should enable developers to come up with more Snapdragon friendly apps.
Toshiba And SanDisk Launch 3D Flash Chip
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Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.
The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.
Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.
24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.
“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.
“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”
Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.
Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.
The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.
All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.
Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.
Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.
This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.
The Toshiba and Sandisk BiCS chips are available for sampling from today.
Qualcomm Goes Ultrasonic
Qualcomm has unveiled what it claims is the world’s first ‘ultrasonic’ fingerprint scanner, in a bid to improve mobile security and further boost Android’s chances in the enterprise space.
The Qualcomm Snapdragon Sense ID 3D Fingerprint technology debuted during the chipmaker’s Mobile World Congress (MWC) press conference on Monday.
The firm claimed that the new feature will outperform the fingerprint scanners found on smartphones such as the iPhone 6 and Galaxy S6.
Qualcomm also claimed that, as well as “better protecting user data”, the 3D ultrasonic imaging technology is much more accurate than capacitive solutions currently available, and is not hindered by greasy or sweaty fingers.
Sense ID offers a more “innovative and elegant” design for manufacturers, the firm said, owing to its ability to scan fingerprints through any material, be it glass, metal or sapphire.
This means, in theory, that future fingerprint sensors could be included directly into a smartphone’s display.
Derek Aberle, Qualcomm president, said: “This is another industry first for Qualcomm and has the potential to revolutionise mobile security.
“It’s also another step towards the end of the password, and could mean that you’ll never have to type in a password on your smartphone again.”
No specific details or partners have yet been announced, but Qualcomm said that the Sense ID technology will arrive in devices in the second half of 2015, when the firm’s next-generation Snapdragon 820 processor is also tipped to debut.
The firm didn’t reveal many details about this chip, except that it will feature Kryo 64-bit CPU tech and a new machine learning feature dubbed Zeroth.
Qualcomm also revealed more details about LTE-U during Monday’s press conference, confirming plans to extend LTE to unused spectrum using technology integrated in its latest small-cell solutions and RF transceivers for mobile devices.
“We face many challenges as demand for data constantly grows, and we think the best way to fix this is by taking advantage of unused spectrum,” said Aberle.
Finally, the chipmaker released details about a new a partnership with Cyanogen, the open-source outfit responsible for the CyanogenMod operating system.
Qualcomm said that it will provide support for the best features and UI enhancements of CyanogenMod on Snapdragon processors, which will be available for the release of Qualcomm Reference Design in April.
The MWC announcements follow the launch of the ARM Cortex-based Snapdragon 620 and 618 chips last month, which promise to improve connectivity and user experience on high-end smartphones and tablets.
Aberle said that these chips will begin to show up in devices in mid to late 2015.
HP Has Two More Tablets In Route
HP is about to put out two tablets later this year.
The names are expected to be the HP Pro Slate 10 EE G1 and HP Pro Tablet 10 EE G1 and they were found on the world wide wibble by Notebook Italia,.
Both tablets are powered by an Intel quad-core Bay Trail Atom Z3735F processor. Accompanying the processor package is 2GB of RAM, as well as 32GB of internal storage. Both the Pro Slate and Pro Tablet come with 10.1-inch displays, as well as 802.11n Wi-Fi, Bluetooth, and NFC.
The Pro Slate sticks with Android, while the Pro Tablet opts for Windows 8.1. The tablets mean they will each come with a stylus, but it would appear that the stylus is just a stand in for your finger, rather than doing anything useful.
Pro Slate will set you back $400.00 and Pro Tablet cost $499.
HP has yet to officially announce either device.
Will Intel Assist Apple?
Apple is apparently having problems getting its partners to make 3-D transistors that go.
Drexel Hamilton’s chip analyst Rick Whittington [no really] made a comment that Intel might be getting ready to bail Apple out while he was having a chat about Micron. In passing, Whittington noted problems had by Taiwan Semiconductor and Samsung Electronics trying to produce 3-D transistors in any useful yield.
He noted that Intel has mastered 3-D transistors, and said that it would be very good for Intel if neither Samsung or TSM can do FinFET this next year; puts them in line to supply Apple’s internal foundry needs.
However he admitted that it was more that TSM/Samsung would operate FinFET under very low yield output and keep capacity tight.
Of course if Jobs’ Mob don’t want that they can always rush into the loving arms of Chipzilla – again. As happened with Saphire glass Apple has shown that it can dump a partner quickly if it does not move fast enough.