Intel has suddenly made some interesting hardware less interesting to open sourcers by insisting that its i915 DRM kernel graphics driver for upcoming Skylake and Broxton hardware demands some binary-only firmware blobs.
According to Phoronix these first i915 DRM firmware blobs are for Skylake and Broxton for the GuC and DMC.
DMC is the Display Microcontroller used by Skylake (Gen9) within the display engine to save and restore its state when entering into low-power states and then resuming. It saves and restores display registers across low-power states separate of the kernel.
Intel said that the firmware blobs are required by the DRM driver rather than being an optional add-on.
The license of these firmware blobs also indicate that redistribution is only allowed in binary form without modification. Beyond that, “no reverse engineering, decompilation, or dis-assembly of this software is permitted.”
Basically this will kill off any desire for Open Source enthusiasts to touch Skylake, although we doubt Intel will be too worried – they are a very nice couple. In any event AMD apparently uses something similar to protect bits of its operation.
Still Intel is shipping these firmware files early so everyone knows they are there.
A new Intel roadmap suggests the first Broadwell LGA parts will launch in Q2, while Skylake-S parts will come in Q3.
The roadmap was published by PC Online and points to two Broadwell LGA launches this quarter – the Core i7-5775C and Core i5-5675C. These two parts will be joined by a total of four Skylake-S products in Q3, the Core i7-6700K, Core i7-6700, Core i5-6600K, Core i5-6600 and the Core i5-6500.
Both Skylake-S and Broadwell LGA will replace the current crop of Haswell parts, including Devil’s Canyon products. However, Broadwell LGA sits one tier above Skylake-S and Haswell-based products.
Starting in Q4, we should see more Broadwell LGA parts, but we don’t have any names yet. In the first quarter of 2016, we can also expect new Skylake-S parts.
Speaking of 2016, Intel plans to unleash the Broadwell-E in the first quarter of 2016. Little is known about Broadwell-E, but the new 14nm flagship is expected to sport eight cores. Clocks remain unknown, although the 14nm node promises substantial gains.
In a move that could produce even more automated suggestions and tips for LinkedIn users, the professional network has purchased California startup Refresh, the maker of an app that gathers news and insights about participants in meetings.
Launched three years ago, Refresh is designed to be a “digital briefing book” that can call up online information related to people that users are scheduled to meet. The information can be anything from blog posts, news articles or Facebook posts to personal notes or favorite sports teams.
The Refresh mobile and desktop app is aimed at helping people relate to one another more quickly, but it can also be used to refresh one’s memory when running into acquaintances unexpectedly.
The details of the deal were not disclosed. Refresh has stopped taking on new users and its app will shut down April 15.
“Refresh has surfaced insights associated with hundreds of millions of meetings, and has been central to countless connections and closed deals,” co-founder Bhavin Shah wrote on the Refresh blog in announcing the deal.
LinkedIn already has an app called Connected that was somewhat of a rival to Refresh. It can log the people users have met and offer updates and information about interests shared with “connections,” which are acquaintances in the LinkedIn lingo. It’s unclear whether Refresh features will be added to Connected or the LinkedIn website itself.
“Our team will focus its efforts on providing LinkedIn members with more insights to help them better do their jobs,” Shah wrote.
Intel announced that it is now shipping the Bay Trail system on a chip (SoC) successor codenamed Braswell to OEM partners.
Announced almost exactly a year ago at Intel’s Developer Forum in Beijing, Braswell is a more powerful version of Bay Trail running on the 14nm fab process, designed to power low-cost devices like Chromebooks and budget PCs.
The chip maker said that devices will hit the market sometime in late summer or autumn.
“We expect Braswell-based systems to be available in the market for the back to school 2015 selling season,” an Intel representative told The INQUIRER. “Specific dates and options will be announced by our OEM partners.”
That’s all Intel will give us for now, but we were told that full details regarding the upcoming chip will be revealed at IDF in Shenzhen next week.
Braswell was expected to arrive at the end of 2014 when it was originally unveiled last year.
Kirk Skaugen, general manager of Intel’s PC Client group, said that it will replace Bay Trail as part of the Atom line, and will feature in over 20 Chromebook designs.
“Last year, we had only four designs on Chrome. Today I can announce that we will have over 20 designs on Chrome,” said Skaugen at the time.
Intel recently announced another 14nm chip, the Atom x range, previously codenamed Cherry Trail, although this will be focused on tablets rather than the value PC market segment and Chromebooks like Braswell.
In terms of power, Braswell is likely to fit snuggly above the Atom x5 and x7 Cherry Trail SoCs and beneath the firm’s recently announced 5th-generation Core products, previously codenamed Broadwell.
Unveiled at Mobile World Congress earlier this year, Intel’s Atom x5 and x7 chips, previously codenamed Cherry Trail, are also updates to the previous Bay Trail Atom line-up, being the first Intel Atom SoCs on 14nm.
These higher-powered SoCs are designed to bring improved 3D performance to mainstream premium handheld devices running full versions of Windows and Android, such as 7in to 10.1in tablets and 2-in-1 hybrid laptops priced at around $119 to $499.
For example, Microsoft quietly announced on Tuesday that the upcoming Surface 3 tablet-laptop hybrid will be powered by an Intel Atom x7. The device is priced at $500.
Intel has launched Intel N3000 series systems on a chip (SoCs), which will kill off Bay Trail-M and Bay Trail-D SoCs on the desktop and mobile PCs.
CPU World also has spotted some other chips which have been revealed to the world.
Intel has also launched desktop and mobile Core i3 and Pentium microprocessors. New mobile models are Pentium 3825U, Core i3-5015U and i3-5020U. These ones are based on Broadwell 14nm.
Core i3-5015U and i3-5020U are dual-cores with Hyper-Threading technology, HD 5500 graphics and ultra low 15 Watt TDP. The processors run at 2.1 GHz and 2.2 GHz. This is 100 MHz higher than the i3-5005U and i3-5010U models, that were launched three months ago.
The i3-5015U and i3-5020U chips offer a 50 MHz higher graphics boost. Official prices of these SKUs are $275 and $281.
The Pentium 3825U incorporates a couple of enhancements on the older Pentium 3805U. It supports Hyper-Threading that allows it to process twice as many threads. It also has base and maximum graphics frequencies increased to 300 MHz and 850 MHz.
The 3805U and 3825U operate at 1.9 GHz and have 2 MB L2 cache. The 3825U processor is rated at 15 Watt TDP, and priced at $161.
IBM has high hopes the upgraded model will generate solid sales based not only on usual customer patterns but its design focus aimed at helping them cope with expanding mobile usage, analysis of data, upgrading security and doing more “cloud” remote computing.
Mainframes are still a major part of the Systems and Technology Group at IBM, which overall contributed 10.8 percent of IBM’s total 2014 revenues of $92.8 billion. But the z Systems and their predecessors also generate revenue from software, leasing and maintenance and thus have a greater financial impact on IBM’s overall picture.
The new mainframe’s claim to fame is to use simultaneous multi-threading (SMT) to execute two instruction streams (or threads) on a processor core which delivers more throughput for Linux on z Systems and IBM z Integrated Information Processor (zIIP) eligible workloads.
There is also a single Instruction Multiple Data (SIMD), a vector processing model providing instruction level parallelism, to speed workloads such as analytics and mathematical modeling. All this means COBOL 5.2 and PL/I 4.5 exploit SIMD and improved floating point enhancements to deliver improved performance over and above that provided by the faster processor.
Its on chip cryptographic and compression coprocessors receive a performance boost improving both general processors and Integrated Facility for Linux (IFL) cryptographic performance and allowing compression of more data, helping tosave disk space and reducing data transfer time.
There is also a redesigned cache architecture, using eDRAM technology to provide twice as much second level cache and substantially more third and fourth level caches compared to the zEC12. Bigger and faster caches help to avoid untimely swaps and memory waits while maximisng the throughput of concurrent workload Tom McPherson, vice president of z System development, said that the new model was not just about microprocessors, though this model has many eight-core chips in it. Since everything has to be cooled by a combination of water and air, semiconductor scaling is slowing down, so “you have to get the value by optimizing.
The first real numbers on how the z13 is selling won’t be public until comments are made in IBM’s first-quarter report, due out in mid-April, when a little more than three weeks’ worth of billings will flow into it.
The company’s fiscal fortunes have sagged, with mixed reviews from both analysts and the blogosphere. Much of that revolves around IBM’s lag in cloud services. IBM is positioning the mainframe as a prime cloud server, one of the systems that is actually what cloud computing goes to and runs on.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
Google said on its official blog that its Android for Work program will provide improved security and management features for corporations that want to give their employees Android smartphones. Smartphones supported by the new initiative will be able to keep an employee’s work and personal apps separate, and a special Android for Work app will allow businesses to oversee key tools such as email, calendar and contacts.
Google said it is partnering with more than two dozen companies including Blackberry Ltd, Citrix Systems Inc, Box Inc.
Google’s Android software is the world’s most popular mobile operating system, but many corporations, which have significant security and device management requirements, give their employees smartphones made by Blackberry or Apple Inc.
Apple is apparently having problems getting its partners to make 3-D transistors that go.
Drexel Hamilton’s chip analyst Rick Whittington [no really] made a comment that Intel might be getting ready to bail Apple out while he was having a chat about Micron. In passing, Whittington noted problems had by Taiwan Semiconductor and Samsung Electronics trying to produce 3-D transistors in any useful yield.
He noted that Intel has mastered 3-D transistors, and said that it would be very good for Intel if neither Samsung or TSM can do FinFET this next year; puts them in line to supply Apple’s internal foundry needs.
However he admitted that it was more that TSM/Samsung would operate FinFET under very low yield output and keep capacity tight.
Of course if Jobs’ Mob don’t want that they can always rush into the loving arms of Chipzilla – again. As happened with Saphire glass Apple has shown that it can dump a partner quickly if it does not move fast enough.
Intel is investing a further $550 million in Israel, more specifically in the upgrade of its Fab 28 in Kiryat Gat.
According to Israel21c, this will bring the total scope of Intel investments in Israel to over $6 billion since 2006. The Kiryat Gat facility is likely to be one of the first Intel 10nm fabs.
Israeli Ministry of Economy official Ziva Eger said the investment will help create thousands of jobs and reinforce the country’s standing as a world leader in technology.
“The agreement signed today between the Industrial Cooperation Authority and Intel is another expression of Intel’s contribution by way of its purchase of equipment, new technologies and Israeli products developed together with Intel,” said CEO of Intel Israel Maxine Fassberg.
Fab 28 currently churns out 22nm silicon for Intel. The fab was passed over for the 14nm upgrade. A source familiar with the matter told us that Israel competes with Ireland for every node upgrade.
“We lost 14nm to Ireland and won 10nm,” the source said.
Israel is currently in a better position to offer incentives and subsidies for such investments, as Ireland’s ‘business-friendly’ tax policies are being scrutinized by the European Union.
Intel is expected to launch the first 10nm CPU in 2016, followed by 7nm parts a couple of years later.