Company co-CEO Mark Liu said that while the fourth quarter could be a bit rough as customers start their inventory adjustments, TSMC’s sales for the quarter will still outperform those for the third quarter.

Talking to Digitimes Lui said that smartphone demand was affected negatively by macroeconomic factors in the first half of 2016. But apparently smartphone chip clients are ordering again in the second half of the year.

TSMC previously estimated its 2016 revenues would grow 5-10 per cent. The foundry expects to meet the high end of the growth guidance, Liu said. In his speech at the CEO Forum of SEMICON Taiwan 2016. Liu claimed that the foundry industry growth is being driven by the markets for smartphones, HPC, automotive and IoT.

Apps like Pokemon G will require more silicon chips used in mobile devices that will be another growth driver in the future, Liu said.

Courtesy-Fud

Fundamental research leading towards faster wireless networks, secure low-power technologies for the Internet of Things, and even 3D displays will be the focus of Intel’s collaboration with the French Alternative Energies and Atomic Energy Commission (CEA).

Intel and the CEA already work together in the field of high-performance computing, and a new agreement signed Thursday will see Intel fund work at the CEA’s Laboratory for Electronics and Information Technology (LETI) over the next five years, according to Rajeeb Hazra, vice president of Intel’s data center group.

The CEA was founded in 1945 to develop civil and military uses of nuclear power. Its work with Intel began soon after it ceased its atmospheric and underground nuclear weapons test programs, as it turned to computer modeling to continue its weapons research, CEA managing director Daniel Verwaerde said Thursday.

That effort continues, but the organization’s research interests today are more wide-ranging, encompassing materials science, climate, health, renewable energy, security and electronics.

These last two areas will be at the heart of the new research collaboration, which will see scientists at LETI exchanging information with those at Intel.

Both parties dodged questions about who will have the commercial rights to the fruits of their research, but each said it had protected its rights. The deal took a year to negotiate.

“It’s a balanced agreement,” said Stéphane Siebert, director of CEA Technology, the division of which LETI is a part.

Who owns what from the five-year research collaboration may become a thorny issue, for French taxpayers and Intel shareholders alike, as it will be many years before it becomes clear which technologies or patents are important.

Hazra emphasized the extent to which Intel is dependent on researchers outside the U.S. The company has over 50 laboratories in Europe, four of them specifically pursuing so-called exa-scale computing, systems capable of billions of billions of calculations per second.

Source-http://www.thegurureview.net/mobile-category/intel-look-to-atomic-energy-for-mobile-technologys-future.html

Digitimes’ deep throats claimed TSMC is expected to achieve certification on its 10nm process in the fourth quarter of 2016, and deliver product samples to the customer for validation in the first quarter of 2017.

This means that TSMC could begin small-volume production for Apple’s A11 chips as early as the second quarter of 2017 and building the chips will likely start to generate revenues at TSMC in the third quarter. The A11-series processor will power the iPhone models slated for launch in the second half of 2017.

TSMC is expected to get two-thirds of the overall A11 chip orders from Apple.

The company is officially refusing to comment on Digitimes’ story, but it does fit into what we have already been told about Jobs’ Mob’s plans for next year.

Mya Le Thai, a PhD candidate at the university, explained in a paper published this week that she and her colleagues used nanowires, a material that is several thousand times thinner than a human hair, extremely conductive and has a surface area large enough to support the storage and transfer of electrons.

Nanowires are extremely fragile and don’t usually hold up well to repeated discharging and recharging, or cycling. They expand and grow brittle in a typical lithium-ion battery, but Le Thai’s team fixed this by coating a gold nanowire in a manganese dioxide shell and then placing it in a Plexiglas-like gel to improve its reliability. All by accident.

The breakthrough could lead to laptop, smartphone and tablet batteries that last forever.

Reginald Penner, chairman of UCI’s chemistry department, said: “Mya was playing around and she coated this whole thing with a very thin gel layer and started to cycle it.

“She discovered that just by using this gel she could cycle it hundreds of thousands of times without losing any capacity. That was crazy, because these things typically die in dramatic fashion after 5,000 or 6,000 or 7,000 cycles at most.”

The battery-like structure was tested more than 200,000 times over a three-month span, and the researchers reported no loss of capacity or power.

“The coated electrode holds its shape much better, making it a more reliable option,” Thai said. “This research proves that a nanowire-based battery electrode can have a long lifetime and that we can make these kinds of batteries a reality.”

The breakthrough also paves the way for commercial batteries that could last a lifetime in appliances, cars and spacecraft.

British fuel-cell maker Intelligent Energy Holdings announced earlier this year that it is working on a smartphone battery that will need to be charged only once a week.

For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.

“Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”

“Our 7-nanometer technology development progress is on schedule as well. TSMC’s 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC’s 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.

These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”

In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.

Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.

In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.

“Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.

“We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”

In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.

During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.

So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

Courtesy-Fud

Bernstein Research’s senior analyst Mark C. Newman said that the competitive dynamic in the memory chip industry is not as good as we thought due to Samsung’s aggressive and opportunistic behavior. This is analyst speak for Samsung is engaging in a supply and price war with the other big names in the memory chip marking business – SK hynix and Micron.

“Rather than sit back and enjoy elevated profit margins with a 40 percent market share in DRAMs, Samsung is intent on stretching their share to closer to 50 percent,” he said.

Newman said the company is gaining significant market share in the NAND sector.

“Although Samsung cares about profits, their actions have been opportunistic and more aggressive than we predicted at the expense of laggards particularly Micron Technology in DRAMs and SK hynix in NANDs,” he said.

SK hynix is expected to suffer. “In NAND, we see Samsung continuing to stretch their lead in 3D NAND, which will put continued pressure on the rest of the field. SK hynix is one of the two obvious losers.”

Newman said that Samsung’s antics have destroyed the “level of trust” among competitors, perhaps “permanently,” as demand has dropped drastically with PC sales growth down to high single digits in 2015 with this year shaping up to be the same.

“Sales of smartphones, the main savior to memory demand growth have also weakened considerably to single digit growth this year and servers with datacenters are not strong enough to absorb the excess, particularly in DRAM,” Newman said.

He is worried that Samsung could create an oversupply in the industry.

“The oversupply issue is if anything only getting worse, with higher than normal inventories now an even bigger worry. Although we were right about the shrink slowing, thus reducing supply growth, the flip side of this trend is that capital spending and R&D costs are soaring thus putting a dent in memory cost declines,” he said.

China’s potential entry into the market and new technologies will provide further worries “over the longer term.”

“Today’s oversupply situation would become infinitely worse if and when China’s XMC ramps up big amounts of capacity. New memory technologies such as 3D X-point, ReRAM and MRAM stand on the sidelines and threaten to cannibalize part of the mainstream memory market,” he said.

Courtesy-Fud

While there have been cut-down Linux implementations before the increase in numbers of smart, connected devices has made something a little more specialized more important.

Zephyr is all about minimizing the power, space, and cost budgets of IoT hardware.
For example a cut down Linux needs 200KB of RAM and 1MB of flash, IoT end points, which will often be controlled by tiny microcontrollers.

Zephyr has a small footpoint “microkernel” and an even tinier “nanokernel.” All this enables it to be CPU architecture independent, run on as little as 10KB while being scalable.

It can still support a broad range of wireless and wired technologies and of course is entirely open saucy released under the Apache v2.0 License.

It works on Bluetooth, Bluetooth Low Energy, and IEEE 802.15.4 (6LoWPAN) at the moment and supports x86, ARM, and ARC architectures.

Courtesy-Fud

We ain’t surprised, but it is quite a shocking and naked fact when you consider it. The naming and resulting shaming happens in the HPE Cyber Risk Report 2016, which HPE said “identifies the top security threats plaguing enterprises”.

Enterprises, it seems, have myriad problems, of which Microsoft is just one.

“In 2015, we saw attackers infiltrate networks at an alarming rate, leading to some of the largest data breaches to date, but now is not the time to take the foot off the gas and put the enterprise on lockdown,” said Sue Barsamian, senior vice president and general manager for security products at HPE.

“We must learn from these incidents, understand and monitor the risk environment, and build security into the fabric of the organisation to better mitigate known and unknown threats, which will enable companies to fearlessly innovate and accelerate business growth.”

Microsoft earned its place in the enterprise nightmare probably because of its ubiquity. Applications, malware and vulnerabilities are a real problem, and it is Windows that provides the platform for this havoc.

“Software vulnerability exploitation continues to be a primary vector for attack, with mobile exploits gaining traction. Similar to 2014, the top 10 vulnerabilities exploited in 2015 were more than one-year-old, with 68 percent being three years old or more,” explained the report.

“In 2015, Microsoft Windows represented the most targeted software platform, with 42 percent of the top 20 discovered exploits directed at Microsoft platforms and applications.”

It is not all bad news for Redmond, as the Google-operated Android is also put forward as a professional pain in the butt. So is iOS, before Apple users get any ideas.

“Malware has evolved from being simply disruptive to a revenue-generating activity for attackers. While the overall number of newly discovered malware samples declined 3.6 percent year over year, the attack targets shifted notably in line with evolving enterprise trends and focused heavily on monetisation,” added the firm.

“As the number of connected mobile devices expands, malware is diversifying to target the most popular mobile operating platforms. The number of Android threats, malware and potentially unwanted applications have grown to more than 10,000 new threats discovered daily, reaching a total year-over-year increase of 153 percent.

“Apple iOS represented the greatest growth rate with a malware sample increase of more than 230 percent.”

Courtesy-TheInq

The Android fork, which adds conventional desktop features such as a taskbar, start menu and support for multiple windows, has been a huge hit, overshadowing the implementation of Android revealed in Google’s recent high-end tablet the Pixel C.

The initial build, as ever, is designed to fish for bugs and aid developers. A beta will follow in the coming weeks. The Alpha doesn’t contain Google Mobile Services apps such as the Play store and Gmail, but the finished version will. In the meantime, users can sideload the gApps package or go to the Amazon Web Store.

There may also be problems with some video codecs, but we’re told this is a licensing issue which will be resolved in the final version too. In the meantime, the first release is perfectly useable.

Compatibility with most Android apps is instant, but the user community can ‘upvote’ their favourites on the Remix OS site to flag what’s working best in each category.

The company has already released a small desktop machine of its own, called the Remix Mini, the world’s first fully functioning Android PC, priced at just $70 after a successful Kickstarter campaign. It has also developed a 2-in-1 ultrabook, the Remix Ultra, and has licensed Remix OS to several Far East tablet manufacturers.

In this new move, the company has teamed up with Android-x86, a group that has been working on an executable version of Android for computers since 2009, to launch a Remix OS installer which will allow existing hardware to become Remix OS powered, or as a partition on a dual-boot machine.

A third option is to store the OS on a USB stick, meaning that you can make any computer your own. This technique has already been popular through the Keepod programme which offers Android on a stick to countries without access to high-speed computers.

The advantages of Remix OS to the developing world are significant. Bench tests have shown that Remix OS works significantly faster than Windows, which will potentially breathe new life into older machines and make modern machines run at previously impossible speeds.

Remix OS was designed by three ex-Google engineers and includes access to the full Google Apps suite and the Google Play store.

David Ko, co-founder of Jide Technology, said: “Today’s public release of Remix OS, based on Android-x86, is something that we’ve been working towards since we founded Jide Technology in 2014.

“All of us are driven by the goal of making computing a more accessible experience, and this free, public release allows us to do this. We believe Remix OS is the natural evolution of Android and we’re proud to be at the forefront of this change.”

The public Alpha will be available to download from Jide and android-x86 from 12 January, and a beta update is expected swiftly afterwards. The INQUIRER has been using a Remix Mini for over a month now, and a full review of the operating system is coming soon.

Courtesy-TheInq

Apparently the fruity cargo cult Apple has already signed up to adopt the technology, which means that the rest of the world’s press will probably notice.

According to the Commercial Times TSMC will have 85,000-100,000 wafers fabricated with the foundry’s in-house developed InFo packaging technology in the second quarter of 2016.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan.

TSMC’s InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.

Source-http://www.thegurureview.net/computing-category/tsmc-goes-fan-out-wafers.html