Bernstein Research’s senior analyst Mark C. Newman said that the competitive dynamic in the memory chip industry is not as good as we thought due to Samsung’s aggressive and opportunistic behavior. This is analyst speak for Samsung is engaging in a supply and price war with the other big names in the memory chip marking business – SK hynix and Micron.

“Rather than sit back and enjoy elevated profit margins with a 40 percent market share in DRAMs, Samsung is intent on stretching their share to closer to 50 percent,” he said.

Newman said the company is gaining significant market share in the NAND sector.

“Although Samsung cares about profits, their actions have been opportunistic and more aggressive than we predicted at the expense of laggards particularly Micron Technology in DRAMs and SK hynix in NANDs,” he said.

SK hynix is expected to suffer. “In NAND, we see Samsung continuing to stretch their lead in 3D NAND, which will put continued pressure on the rest of the field. SK hynix is one of the two obvious losers.”

Newman said that Samsung’s antics have destroyed the “level of trust” among competitors, perhaps “permanently,” as demand has dropped drastically with PC sales growth down to high single digits in 2015 with this year shaping up to be the same.

“Sales of smartphones, the main savior to memory demand growth have also weakened considerably to single digit growth this year and servers with datacenters are not strong enough to absorb the excess, particularly in DRAM,” Newman said.

He is worried that Samsung could create an oversupply in the industry.

“The oversupply issue is if anything only getting worse, with higher than normal inventories now an even bigger worry. Although we were right about the shrink slowing, thus reducing supply growth, the flip side of this trend is that capital spending and R&D costs are soaring thus putting a dent in memory cost declines,” he said.

China’s potential entry into the market and new technologies will provide further worries “over the longer term.”

“Today’s oversupply situation would become infinitely worse if and when China’s XMC ramps up big amounts of capacity. New memory technologies such as 3D X-point, ReRAM and MRAM stand on the sidelines and threaten to cannibalize part of the mainstream memory market,” he said.

Courtesy-Fud

Revealed back during the 2015 Flash Memory Summit in August last year, the now available Samsung PM1633a enterprise SSD series is based on a standard 2.5-inch form factor and features a 12Gbps Serial Attached SCSI (SAS) interface. It also uses Samsung new controller as well as Samsung’s own 3rd generation 256Gb 48-layer TLC V-NAND.

As noted, the Samsung PM1633a lineup is based on Samsung’s 256Gb V-NAND flash chips. The 256Gb dies are stacked in 16 layers to form a single 512GB package and by adding up a total of 32 NAND packages, you get the 15.36TB model. According to Samsung, the 3rd generation 256Gb V-NAND will provide both significant performance as well as reliability improvements compared to the PM1633 drive which used 2nd generation 32-layer 128Gb V-NAND flash.

The controller has also been upgraded to concurrently access large amounts of high-density NAND flash and the PM1633a 15.36TB model comes with no less than 16GB of cache.

When it comes to performance, the Samsung PM1633a provides sequential read and write performance of up to 1,200MB/s while random 4K performance is set at up to 200,000 IOPS for read and up to 32,000 IOPS for write. The new Samsung PM1633a enterprise SSD also offers high high reliability date with 1DWPD (drive writes per day), adding up to 15.36TB that can be written every day without failure, which is quite important in the enterprise market.

While the 15.36TB model of the Samsung P1633a is already shipping to select enterprise customers, Samsung is also promising a wide range of capacities, including 480GB, 960GB, 1.92TB, 3.84TB and 7.68TB. According to Samsung, enterprise managers can now fit twice as many drives in a standard 19-inch 2U rack compared to a 3.5-inch storage drive.

Unfortunately, Samsung did not reveal any details regarding the price but we doubt that such high capacity and performance will have a low price tag.

Courtesy-Fud

The new Toshiba SG5 SSD series will be available in 128GB, 256GB, 512GB and 1TB capacities as well as a couple of different form-factors, standard 2.5-inch and two different M.2 form-factors.

As noted, the Toshiba SG5 SSD series is based on 15nm TLC NAND with yet to be details controller and will offer sequential performance of up to 545MB/s for read and up to 388MB/s for write.

The 2.5-inch version of the Toshiba SG5 SSD series will be available in all aforementioned capacities, the M.2 2280-S2 (single side) form-factor version will be available in 128GB, 256GB and 512GB capacities and the M.2 2280-D2 (double side) version will only come in 1TB capacity.

The rest of the features are pretty standard for a consumer-grade SSD so you are looking at a power consumption 4.5W to 5.6W under load and 0.65W in idle and it includes Toshiba’s QSBC (Quadruple Swing-By Code) error correction technology.

Unfortunately, Toshiba did not unveil any details regarding the actual price of the new SG5 series SSDs but did say that it should be available sometime during this quarter.

Courtesy-Fud

What makes it interesting is that it has a built-in keypad that allows it to be PIN protected when inserted into any device and can be set to ‘self-destruct’ after 10 incorrect log-in attempts. Better still, it comes with an aluminium cover to prevent the self-destruct accidentally being triggered in your bag.

Compatible with USB up to 3.1, it offers speeds of up to 135MBps read and 40MBps write. It is also designed to be OS independent, and includes up to 256-bit AES protection without any drivers on the host device.

“We are excited to add DataTraveler 2000 to our existing line-up of fast and encrypted USB flash drives for organisations and SMBs,” said Valentina Vitolo, flash business manager at Kingston. “It is the perfect option to deploy in the workforce where a uniform encrypted data storage solution that works on many different operating systems is in use.”

The device will be available later in the quarter. Prices are to be announced, but capacities will range from 16GB to 64GB.

Next up is the KC400, the latest addition to the SSDNow range powered by an eight-channel Phison controller and quad-core internal processor. It will be available is capacities from 128GB to 1TB with speeds of 550/540MBps read/write on the 256GB drive.

The MobileLite range of WiFi-enabled SD card readers has been expanded with the addition of the Wireless G3 and Wireless Pro. The G3 offers a 5600mAh onboard battery to charge mobile devices via the mobile app, and makes it even easier to transfer to and from mobile devices.

Both offer wireless 802.11ac connectivity, while the Pro edition adds an extra little something in the form of a 64GB flash storage option. Both have USB 3.0 and SD card slots, with an adapter for microSD. There’s also an Ethernet port so you can use it as a hotel room hotspot.

Last up, following on from the success of the HyperX CloudII headset, Kingston has released a special edition for Xbox One users which has garnered the moniker of ‘official’. It adds an inline volume control and comes in a hard-shell case.

This year’s offerings are less focused on the traditional Kingston flash product lines, and once again don’t increase capacities.

Courtesy-TheInq

Revenues for the last part of the year will be adversely affected by an about one per cent drop in wafer ASPs and capacity at its plants will slide to 81-83 per cent in the fourth quarter from 89% in the third.

UMC’s had already lowered capacity in the third quarter. At the beginning of the year it was running at 94 percent.

The company’s revenues decreased 7.1 per cent to $1.07 billion in the third quarter, with gross margin slipping below 20 per cent.

UMC net profits were down 62.9 per cent on quarter, as both operating and non-operating income eroded. This is bad news because in the first three quarters of 2015, UMC’s net profits increased 35.8 per cent from a year earlier.

However UMC is continuing to invest in new capital and will spend $1.8 billion.

CEO Po-Wen Yen said that the continuing IC inventory adjustment will dampen fourth quarter wafer shipments, but UMC continues on the path towards long-term growth.

“Throughout 2015, UMC engineers and Fab12A have worked tirelessly to bring several new 28nm product tape-outs into volume production. “UMC is working to bring a timely conversion of new 28nm requirements into production, which will strengthen our business.”
Courtesy-http://www.thegurureview.net/computing-category/will-umc-chip-shipments-drop-in-the-fall.html

Intel plans to invest up to $5.5 billion over the coming years to use its Dalan, China, facility to expand its NAND manufacturing capacity. Initial 3D NAND production is expected to commence in second-half 2016 in Dalan.

Barrons has said that with pricing pressure already present in DRAM, Intel’s move puts Micron in a state of uncertainty.

This is a little odd given that Intel and Micron are chums, but Barron’s Rajvindra Gill said that the move will reduce Chipzilla’s dependence on Micron.

More than half of output is expected to use 3D NAND in the next two to three years and Intel’s focus on the technology reduces its reliance on Micron as a supplier while transforming it into a competitor, Gill said.

Micron be the last one standing when the mergers and acquisitions the industry is seeing and be an industry also ran.

Intel’s focus on the non-volatile memory market could put the pricing and supply/demand environment under pressure.

Micron has already had difficulties setting up 3D NAND versus its peers and now has another significant challenger entering the market, Gill said.

Intel’s move to NAND places a major Micron customer at risk. While Intel noted that its relationship with Micron remains strong and that it will continue to focus on 3D Xpoint, we believe the IM Flash Agreement could be at risk.

With Intel producing more NAND on its own, it could look to lower its reliance on the joint venture.

Intel has a right to sell its portion of the joint venture to Micron. If Intel elects to do so, a closing date would be set within two years. Sales to IM Flash sales to Intel were $101 million in the third quarter, or 8 per cent of trade NAND revenue.
Courtesy-http://www.thegurureview.net/computing-category/is-intel-trying-to-destroy-micron.html