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Is Samsung Readying A 10nm SoC?

August 22, 2016 by  
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Of course, it is that time of the year. Apple, Qualcomm, MediaTek and now Samsung will have 10nm SoCs ready for  phones in early 2017. Of course Samsung wants to use its own 10nm SoC in the Galaxy S8 that is expected in late February 2017, but probably with a mix of 10nm Snapdragon too.

Samsung’s next generation Exynos’ name is very uninspired. You don’t call your much better chip just the Exynos 8895, but that might not be the final name.

The Korean giant went from Exynos 7420 for Galaxy S5 and first 14nm for Android followed a year after with Exynos 8890 still 14nm but witha  custom Exynos M1 “Mongoose” plus Cortex-A53eight core combination.

The new SoC is rumored to come with a 4GHz clock. The same leak suggests that the Snapdragon 830 can reach 3.6 GHz which would be quite an increase from the 2.15Ghz that the company gets with the Snapdragon 820. Samsung’s Exynos 8890 stops at 2.6GHz with one or two cores running while it drops to 2.3 GHz when three of four cores from the main cluster run. Calls us sceptics for this 4GHz number as it sounds like quite a leap from the previous generation.

Let us remind ourselves that the clock speed is quite irrelevant as it doesn’t mean anything, and is almost as irrelevant as an Antutu score. It tells you the maximal clock of a SoC but you really want to know the performance per watt or how much TFlops you can expect in the best case. A clock speed without knowing the architecture is insufficient to make any analysis. We’ve seen in the past that 4GHz processors were slower than 2.5GHz processors.

The fact that Samsung continued to use Snapdragon 820 for its latest greatest Galaxy Note 7 means that the company still needs Qualcomm and we don’t think this is going to change anytime soon. Qualcomm traditionally has a better quality modem tailored well for USA, China, Japan and even the complex Europe or the rest of the world.

Courtesy-Fud

AMD Goes 16 Core Snowy Owl

July 22, 2016 by  
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Naples is a 32 Zen core Opteron with 64 threads. The 16 core Zen version with a BGA socket is codenamed Snowy Owl. AMD thinks that Snowy Owl will be a great match for the communication and network markets that needs a high performance 64-bit X86 CPU.

Snowy Owl has 16 cores and 32 threads, all based on 14nm FinFET Zen transistors. The processor supports up to 32MB of shared L3 cache. We also mentioned a processor cluster codenamed Zeppelin. This seems to be the key to the Zen architecture as more Zeppelin clusters are creating more core Opterons.

Each Zeppelin has eight Zen cores and each Zen core has 512KB dedicated L2 cache memory. Four Zen cores share 8MB of L3 memory making the total L3 cache size  16MB.  Zeppelin (ZP) comes with PCIe Gen 3, SATA 3, 10GbE, sever controller Hub, AMD secure processor as well as the DDR4 Memory controller. AMD is using a super-fast coherent interconnect to create more than one Zeppelin core.

One Zeppelin cluster would make an 8 core, 16 thread CPU with 4MB L2 and 16MB L3 cache and in our case product codenamed Snowy owl has 16 cores, 32 threads 8MB of L2 (512KB x 16) and 32MB L3 (4x8MB).

The Snowy Owl with 16 cores uses a SP4 Multi Chip Module (MCM) BGA socket, while the Naples uses MCM based SP3. These two are not pin compatible but 16 and 8 core Zen based Opterons will fit in the same socket.

Snowy Owl has four independent memory channels and up to 64 lanes of PCIe Gen3. When it comes to storage, it supports up to 16 SATA or NVME storage channels and 8x10GbE for some super-fast networking solutions.

As you see, there will be plenty of Zen based Opteron possibilities and most of them will start showing up by mid-2017.  The TDP Range for Snowy Owl is sub 100W and capable of sinking the TDP down to 35W. Yes, we do mean that there may well be a quad core Zen Opteron too.

Courtesy-Fud

ARM Shows Off 10nm Chip 

June 10, 2016 by  
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ARM’s collaboration with TSMC has finally born some fruit with the tapeout of a 10nm test chip to show off the company’s readiness for the new manufacturing process.

The new test chip contains ARM’s yet-to-be-announced “Artemis” CPU core which is named after a goddess who will turn you into deer and tear you apart with wild dogs if you ever see her. [The NDA must have been pretty tough on this chip.ed]

In fact things have been ticking along on this project for ages. ARM discloses that tapeout actually took place back in December last year and is expecting silicon to come back from the foundry in the following weeks.

ARM actually implemented a full four-core Artemis cluster on the test chip which should show vendors what is possible for their production designs. The test chip has a current generation Mali GPU implementation with 1 shader core to show vendors what they will get when they use ARM’s POP IP in conjunction with its GPU IP. There is also a range of other IP blocks and I/O interfaces that are used to validation of the new manufacturing process.

TSMC’s 10FF manufacturing process is supposed to increase density with scaling’s of up to 2.1x compared to the previous 16nm manufacturing node. It also brings about 11-12 per cent higher performance at each process’ respective nominal voltage, or a 30 per cent reduction in power.

ARM siad that comparing a current Cortex A72 design on 16FF+ and an Artemis core on 10FF on the new CPU and process can halve the dynamic power consumption. Currently clock frequencies on the new design are still behind the older more mature process and IP, but ARM expects this to improve as it optimizes its POP and the process stabilizes.

Courtesy-Fud

AMD Goes After Intel’s Skylake With Bristol Ridge

June 9, 2016 by  
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AMD has revealed the firm’s seventh-generation system-on-a-chip accelerated processing units (APUs).

Bristol Ridge and Stoney Ridge sound a little like locations in a Somerset version of Game of Thrones, but they both feature AMD’s Excavator x86 processor cores and Radeon R7 graphics, which AMD sees powering e-sports gaming on laptops.

Bristol Ridge is the more powerful of the two coming in 35W and 15W versions of AMD FX, A12 and A10 processors, offering up to 3.7GHz of processing power. The former two processors are paired with up to eight Graphics Core Next (GCN) cores in the R7 to provide a decent pool of graphics processing power.

Stoney Bridge offers less in the way of processor power, topping out at 3.5GHz, and versions include 15W A9, A6 and E2 processor configurations coupled with lower powered graphics accelerators.

AMD claimed that the new APUs offer a 50 per cent hike in performance over the previous generation Carrizo APUs. However, this rise is over APUs from the early part of Carrizo’s lifecycle, so performance gains over the most recent Carrizo APUs are likely to be 10 to 20 per cent.

AMD also said that its silicon is faster than rival chips from Intel, including the i3-6100U found in several ultraportable laptops.

Many of these tests are subjective and depend on how a hardware manufacture configures and sets up the APUs in a laptop or tablet, but AMD does have its graphics tech to draw on, such as the GCN architecture, which could give it the edge over Intel’s chips when it comes to pushing pixels.

The APUs will be aimed primarily at slim laptops that need low-power consumption chips, much like Intel’s Skylake line.

Bristol Ridge is currently available to end users only in the form of HP’s latest Envy laptop. But now that AMD has debuted the full range of the seventh-generation APUs we can expect to see them in other ultraportable machines before too long.

Courtesy-TheInq

 

Is nVidia Taking Qualcomm To Court?

April 21, 2016 by  
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Nvidia has dragged Qualcomm into court for allegedly crushing a $352 million chipset deal.

Nvidia claims it was forced to wind down its cellular mobile broadband chipset business, including its Icera unit just four years after buying it, because of Qualcomm’s anti-trust antics.

Qualcomm’s alleged tactics led to “unexplained delays in customer orders, reductions in demand volumes and contracts never being entered into, even after a customer or mobile network cooperating with a prospective customer has agreed or expressed a strong intention to purchase” Nvidia’s chipsets, the company moaned.

The claim for cash comes as European Union regulators step up antitrust investigations into Qualcomm sales tactics that officials said thwarted other designers of mobile-phone chip technology. This could result in fines or an EU order forcing a company to change its behaviour.

The EU thinks Qualcomm may have charged below-cost fees for chips used in mobile Internet modems known as dongles from 2009 to 2011 to thwart smaller competitor Icera. Regulators are separately probing what they say are exclusivity payments Qualcomm paid to a phone and tablet manufacturer for using its designs.

Qualcomm is “confident” it would prevail in both the EU investigation and the lawsuit.

Nvidia is seeking a declaration from the judge that Qualcomm’s conduct was an abuse of a dominant position, compensation, and an account of the profits it says Qualcomm gained from unlawful conduct, according to the court filings.

Courtesy-Fud

AMD’s Vegas GPU Details Spotted

April 11, 2016 by  
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Details of AMD’s Vega GPU were leaked and then taken down from AMD R&D Manager’s LinkedIn profile page over Easter.

Hexus spotted Yu Zheng, an R&D Manager at AMD Shanghai had listed the work on Project Greenland as a work experience highlight on his LinkedIn profile page. Greenland is described as “A leading chip of the first graphics IP v9.0 generation, it has full capacity of 4096 shader processor along with whole new SOC v15 architecture.”

The Graphics IP v9.0 designation is thought to signify a Vega GPU in the making. Zheng mentions this is an SOC, but then Hawaii and Fiji chips were described the same. Fiji is part of the graphics IP v8.0 family, as will be Polaris.

Vega following after Polaris, and designated as a ‘HMB2′ GPU by AMD, it looks like Vega based graphics cards will be the successors to the HBM equipped Fiji range such as the Radeon Fury and Nano. Fiju can manage 4096 stream processors,  but with an upgrade to HBM2, 14nm process and other optimisation it is estimated that a Greenland/Vega GPU based graphics cards will offer 20 to 30 per cent better performance.

So with Greenland/Vega sporting HBM2 memory Hexus thinks that Polaris packing graphics cards will therefore feature GDDR5/X memory.

Courtesy-Fud

Russia Banking On Home Grown CPUs

May 28, 2015 by  
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A Russian firm announced its intention to build its own homegrown CPUs as part of a cunning plan to keep the Americans from spying on the glorious Empire of Tsar Putin and oil oligarchs.

Moscow Centre of SPARC Technologies (MCST) has announced it’s now taking orders for its Russian-made microprocessors from domestic computer and server manufacturers.

Dubbed the Elbrus-4C, it was fully designed and developed in MCST’s Moscow labs. It’s claimed to be the most high-tech processor ever built in Russia. They claim it is comparable with Intel’s Core i3 and Intel Core i5 processors, although they do not say what generation as one spec we found claimed it could manage a blistering 1.3 GHz which is slightly less than an average mobile phone.

MCST unveiled a new PC, the Elbrus ARM-401 which is powered by the Elbrus-4C chip and runs its own Linux-based Elbrus operating system. MCST claimed it can run Windows and Linux distributions. Yhe company has built a data centre server rack, the Elbrus-4.4, which is powered by four Elbrus-4C microprocessors and supports up to 384GB of RAM.

MCST said the Elbrus-4.4 is suitable for web servers, database servers, storage systems, servers, remote desktops and high-performance clusters.

Sergei Viljanen, editor in chief of the Russian-language PCWorld website said that the chip was at least five years behind the west.

“Russian processor technology is still about five years behind the west. Intel’s chips come with a 14nm design, whereas the Elbrus is 65 nm, which means they have a much higher energy consumption.”

MCST’s Elbrus-4C chips are powered by a 4-core processors, and come with an interface for hard drives and other peripherals. The company finalized development of Elbrus-4C in April 2014, and began mass production last autumn.

Source

Intel Opens Up Core M

November 17, 2014 by  
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Intel has extended its Core M range of fanless mobile chips by adding four models to the three initial Core M processors launched at the IFA trade show in September.

Like those first fanless models, Intel’s new Core M processors are dual-core chips that support Hyperthreading in up to four threads and have thermal design power (TDP) ratings of 4.5W.

They’re faster than the initial Core M chips, with base clock speeds ranging from 800MHz to 1.2GHz and Turbo Boost speeds from 2GHz to 2.9GHz.

The firm’s initial Core M chips were also rated at 4.5W TDP but topped out at 1.1GHz and 2.6GHz under Turbo Boost.

These additional fanless mobile chips are configurable by system designers, in that OEMs can scale the chip speeds and power consumption up or down depending on the purpose and configuration of the device.

A compact tablet or notebook can conserve power by limiting processor speed, while a larger device can offer higher speed at the cost of higher power draw and heat.

Thus, these new Core M chips can be configured from 600MHz base clock speed and 3.5W TDP to 1.4GHz base clock speed and 6W TDP in the fastest model.

Intel has also boosted the integrated graphics processors in these latest Core M chips, offering GPU base clock speeds ranging from 300MHz to 900MHz, whereas the initial models supported 100MHz to 850MHz.

The detailed specifications of all of Intel’s Core M mobile processors are available on the firm’s website.

Intel said that these new fanless Core M processors will start hitting the market early next year.

Source

TSMC’s FinFet Coming In 2015?

October 27, 2014 by  
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TSMC has announced that it will begin volume production of 16nm FinFET products in the second half of 2015, in late Q2 or early Q3.

For consumers, this means products based on TSMC 16nm FinFET silicon should appear in late 2015 and early 2016. The first TSMC 16nm FinFET product was announced a few weeks ago.

TSMC executive CC Wei said sales of 16nm FinFET products should account for 7-9% of the foundry’s total revenue in Q4 2015. The company already has more than 60 clients lined up for the new process and it expects 16nm FinFET to be its fastest growing process ever.

Although TSMC is not talking about the actual clients, we already know the roster looks like the who’s who of tech, with Qualcomm, AMD, Nvidia and Apple on board.

This also means the 20nm node will have a limited shelf life. The first 20nm products are rolling out as we speak, but the transition is slow and if TSMC sticks to its schedule, 20nm will be its top node for roughly a year, giving it much less time on top than earlier 28nm and 40nm nodes.

The road to 10nm

TSMC’s 16nm FinFET, or 16FinFET, is just part of the story. The company hopes to tape out the first 10nm products in 2015, but there is no clear timeframe yet.

Volume production of 10nm products is slated for 2016, most likely late 2016. As transitions speed up, TSMC capex will go up. The company expects to invest more than $10bn in 2015, up from $9.6bn this year.

TSMC expects global smartphone shipments to reach 1.5bn units next year, up 19 percent year-on-year. Needless to say, TSMC silicon will power the majority of them.

Source

Intel Debuts A Slew Of Core M Chips

September 18, 2014 by  
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Intel’s new Core M chips — which bring PC-like performance to slim design tablets — will initially be in many Windows 8.1 tablets, but no Android devices are yet on the radar.

The chips will be in five to seven detachable tablets and hybrids by year end, and the number of devices could balloon to 20 next year, said Andy Cummins, mobile platform marketing manager at Intel.

Core M chips, announced at the IFA trade show in Berlin on Friday, are the first based on the new Broadwell architecture. The processors will pave the way for a new class of thin, large-screen tablets with long battery life, and also crank up performance to run full PC applications, Intel executives said in interviews.

“It’s about getting PC-type performance in this small design,” Cummins said. “[Core M] is much more optimized for thin, fanless systems.”

Tablets with Core M could be priced as low as US$699, but the initial batch of detachable tablets introduced at IFA are priced much higher. Lenovo’s 11.6-inch ThinkPad Helix 2 starts at $999, Dell’s 13.3-inch Latitude 13 7000 starts at $1,199, and Hewlett-Packard’s 13.3-inch Envy X2 starts at $1,049.99. The products are expected to ship in September or October.

Core M was also shown in paper-thin prototype tablets running Windows and Android at the Computex trade show in June. PC makers have not expressed interest in building Android tablets with Core M, but the OS can be adapted for the chips, Cummins said.

The dual-core chips draw as little as 4.5 watts, making it the lowest-power Core processor ever made by Intel. The clock speeds start at 800MHz when running in tablet mode, and scales up to 2.6GHz when running PC applications.

The power and performance characteristics make Core M relevant primarily for tablets. The chips are not designed for use in full-fledged PCs, Cummins said.

“If you are interested in the highest-performing parts, Core M probably isn’t the exact right choice. But if you are interested in that mix of tablet form factor, detachable/superthin form factor, this is where the Core M comes into play,” Cummins said.

For full-fledged laptops, users could opt for the upcoming fifth-generation Core processor, also based on Broadwell, Cummins said. Those chips are faster and will draw 15 watts of power or more, and be in laptops and desktops early next year.

New features in Core M curbed power consumption, and Intel is claiming performance gains compared to chips based on the older Haswell architecture. Tablets could offer around two more hours of battery life with Core M.

Source

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