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Broadcom Aquired?
It is starting to look Broadcom will get bought out by its rival Avago as deep throats within both outfits think a deal is close.
Avago is in advanced buyout talks to acquire Broadcom, which manufacturers chips for both the smartphone and broadband industries. The two companies are more or less the same size, but at the moment Broadcom is the weaker partner
It has been the subject of previous speculation regarding acquisitions. The company is among the largest maker of chips for mobile systems such as smartphones, tablets and wearables, Internet of things (IoT) devices and automotive technology products.
Such capabilities could give Avago greater traction in fast-growing markets like IoT and mobile devices.
Broadcom announced last year that it was closing its baseband cellular chip business after being unable to gain inroads against such competitors as Qualcomm. The company had $8.4 billion in revenue last year.
It seems everyone wants a lot more consolidation in the chip industry. Intel reportedly resumed buyout talks to acquire Altera earlier this month, with the parties eyeing a potential price that could reach $13 billion. Micron was tipped as a potential buyer of rival SanDisk.
An April report cited a note from Bernstein analyst Mark Newman. According to this report, Newman pointed to SanDisk’s current valuation as making it a prime takeover target for rival NAND chip maker Micron, as well as other players in the market.
Broadcom Going Smart Devices
Broadcom has come out with a new “smart” chip which it hopes will be at the cutting edge of wearable PCs, such as smartwatches, heart and blood-pressure monitor.
Dubbed Wireless Internet Connectivity for Embedded Devices (WICED) smart chip, Broadcom’s designs are supposed to support wireless charging for devices that are too small to connect via a power cord. The devices run an ARM Cortex M3 applications processor that reduces size and cost for OEMs and supports A4WP wireless charging and enhanced data security modes in addition to secure over-the-air firmware updates.
This is an integrated ARM CM3 microcontroller unit with radio frequency and Embedded Bluetooth Smart Stack, all on a single chip. Brian Bedrosian, Broadcom senior director of Embedded Wireless and Wireless Connectivity said that his outfit wanted to push the boundaries on what wearables are capable of with our new smart chip. Broadcom competes in the marketplace with companies such as Taiwan Semiconductor, Marvell and Xilinx.
The Broadcom WICED Smart chip is currently sampling with evaluation boards and SDKs. It is expected to become available sometime in 2014.
Do Chip Makers Have Cold Feet?
It is starting to look like chip makers are having cold feet about moving to the next technology for chipmaking. Fabricating chips on larger silicon wafers is the latest cycle in a transition, but according to the Wall Street Journal chipmakers are mothballing their plans.
Companies have to make massive upfront outlays for plants and equipment and they are refusing, because the latest change could boost the cost of a single high-volume factory to as much as $10 billion from around $4 billion. Some companies have been reining in their investments, raising fears the equipment needed to produce the new chips might be delayed for a year or more.
ASML, a maker of key machines used to define features on chips, recently said it had “paused” development of gear designed to work with the larger wafers. Intel said it has slowed some payments to the Netherlands-based company under a deal to help develop the technology.
Gary Dickerson, chief executive of Applied Materials said that the move to larger wafers “has definitely been pushed out from a timing standpoint”
Dell Goes A4WP
Dell has become the first major PC OEM to join the Alliance for Wireless Power (A4WP) group, joining over 80 existing members Broadcom, Gill Electronics, IDT, Intel, Qualcomm and Samsung.
Dell’s membership means it could soon be developing mobile devices that do not require a wired power adapter to charge.
The A4WP aims to standardise wireless power transfer using near-field magnetic resonance technology called “rezence”, which seeks to liberate mobile devices from wired chargers, charging multiple devices simultaneously without the need to dock the devices.
“Power levels and charging speed will meet the expectations of today’s ‘always on, always connected’ user,” the A4WP said. “Users can simply ‘drop and go’ their devices onto a charging surface without the hassle of accurate positioning or alignment.”
Along with the news that Dell will jump on board to unshackle users from the curse of wired chargers, A4WP is also introducing a secondary, higher-powered project focusing on wirelessly charging electronic products from 20 to 50 watts, like ultrabooks, laptops, and mid-powered appliances.
“Dell’s addition to the Alliance signifies the importance of defining a wireless power standard that spans these higher power levels thus expanding the range of electronics beyond smartphones,” the group added.
A4WP said it believes the development of magnetic resonance technology will improve the customer experience when it comes to charging and will bring the capability into more homes and businesses over the next few years.
It also said that its development of wireless charging technology will help benefit both industry and consumers as the specification powers broadly adopted wireless technologies such as Bluetooth Smart, “which simplifies development and manufacturing”.
Chip Makers Going After Cars
October 14, 2013 by admin
Filed under Around The Net
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Chip makers including Broadcom and Renesas Electronics are putting more focus on in-car entertainment with faster processors and networks for wireless HD movies and navigation, aiming to keep drivers informed and passengers entertained.
With PC sales slipping and the mobile device market proving highly competitive, chip makers are looking for greener pastures in other sectors like in-car entertainment and information.
From Renesas comes the R-Car M2 automotive SoC (System-on-a-Chip), which has enough power to handle simultaneous high-definition navigation, video and voice-controlled browsing.
The SoC is meant for use in mid-range systems. It features two ARM Cortex A-15 cores running at up to 1.5GHz and Renesas’ own SH-4A processor plus the PowerVR SGX544MP2 from Imagination Technologies for 3D graphics. This combination helps the M2 exceed the previous R-Car H1 with more than three times the CPU capacity and approximately six times better graphics performance.
Car makers that want to put a more advanced entertainment system in their upcoming models should go for the eight core R-Car H2 SoC, which was announced earlier this year. It is based on ARM’s big.LITTLE architecture, and uses four Cortex-A15 cores and another four Cortex-A7 cores.
The H2 will be able to handle four streams of 1080p video, including Blu-Ray at 60 frames per second, according to Renesas. Mass production is scheduled for the middle of next year, while the M2 won’t arrive in larger volumes until June 2015.
Broadcom on the other hand is seeking to drive better networking on the road. The company’s latest line of wireless chipsets for in-car connectivity uses the fast 802.11ac Wi-Fi wireless standard, which offers enough bandwidth for multiple displays and screen resolution of up to 1080p. Use of the 5GHz band for video allows it to coexist with Bluetooth hands-free calls on 2.4GHz, according Broadcom.
Broadcom has also implemented Wi-Fi Direct and Miracast. Wi-Fi Direct lets products such as smartphones, cameras and in this case in-car computers connect to one another without joining a traditional hotspot network, while Miracast lets users stream videos and share photos between smartphones, tablets and displays.
The BCM89335 Wi-Fi and Bluetooth Smart Ready combo chip and the BCM89071 Bluetooth and Bluetooth Smart Ready chip are now shipping in small volumes.
Broadcom Goes UltraHD
January 16, 2013 by admin
Filed under Consumer Electronics
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As TV manufacturers show off UltraHD TVs at CES, communications chip maker Broadcom is introducing the guts of future gateways that will be able to deliver video for those sets into viewers’ homes.
Broadcom’s BCM7445 silicon platform, announced just hours before the show opened on Tuesday morning, will be able to process incoming video from cable, carrier and satellite services that has four times the resolution of typical 1080p video offered today, according to the company.
Like the eye-catching but expensive TVs on the show floor in Las Vegas, the BCM7445 is just one of the first of many steps to consumers watching UltraHD shows at home. New content, displays and delivery technologies will all be required for the new resolution, which is also known as 4K.
Broadcom expects its chip to be in volume production by the middle of next year, in time for mainstream UltraHD TVs that will probably hit the market for the late 2014 holiday season, said Joe Del Rio, associate product line manager at Broadcom. However, service providers, which will probably be the distributors of most of the gateways built with the BCM7445, may take longer to start sending UltraHD video to their subscribers, Del Rio said.