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Do Chip Makers Have Cold Feet?
It is starting to look like chip makers are having cold feet about moving to the next technology for chipmaking. Fabricating chips on larger silicon wafers is the latest cycle in a transition, but according to the Wall Street Journal chipmakers are mothballing their plans.
Companies have to make massive upfront outlays for plants and equipment and they are refusing, because the latest change could boost the cost of a single high-volume factory to as much as $10 billion from around $4 billion. Some companies have been reining in their investments, raising fears the equipment needed to produce the new chips might be delayed for a year or more.
ASML, a maker of key machines used to define features on chips, recently said it had “paused” development of gear designed to work with the larger wafers. Intel said it has slowed some payments to the Netherlands-based company under a deal to help develop the technology.
Gary Dickerson, chief executive of Applied Materials said that the move to larger wafers “has definitely been pushed out from a timing standpoint”
Marvell’s Future Brightens
Marvell reported a more-than-expected 112 percent rise in profit, helped by strong demand from storage and networking companies, and said it expected its mobile business to pick up in the current quarter.
Marvell forecast first-quarter revenue between $870 and $910 million, which is above what the cocaine nose jobs of Wall Street predicted. Chief Executive Sehat Sutardja said that in his company’s first quarter, he was expecting some revenue and unit growth for our 4G LTE mobile platform from multiple customers. Marvell said results were not so hot in the mobile business in the fourth quarter as some customers delayed product launches.
The company, which also makes communications and processor products used in mobile phones, said net income doubled to $106.6 million, or 21 cents per share, in the quarter ended February 1 from $50.2 million, or 9 cents per share, a year earlier.
Revenue rose to $931.7 million, beating analysts’ estimate of $901.1 million.
Marvell’s biggest customer is Western Digital which reported better-than-expected quarterly results in January, citing strength in its gaming and notebook business.
Chip Makers Going After Cars
October 14, 2013 by admin
Filed under Around The Net
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Chip makers including Broadcom and Renesas Electronics are putting more focus on in-car entertainment with faster processors and networks for wireless HD movies and navigation, aiming to keep drivers informed and passengers entertained.
With PC sales slipping and the mobile device market proving highly competitive, chip makers are looking for greener pastures in other sectors like in-car entertainment and information.
From Renesas comes the R-Car M2 automotive SoC (System-on-a-Chip), which has enough power to handle simultaneous high-definition navigation, video and voice-controlled browsing.
The SoC is meant for use in mid-range systems. It features two ARM Cortex A-15 cores running at up to 1.5GHz and Renesas’ own SH-4A processor plus the PowerVR SGX544MP2 from Imagination Technologies for 3D graphics. This combination helps the M2 exceed the previous R-Car H1 with more than three times the CPU capacity and approximately six times better graphics performance.
Car makers that want to put a more advanced entertainment system in their upcoming models should go for the eight core R-Car H2 SoC, which was announced earlier this year. It is based on ARM’s big.LITTLE architecture, and uses four Cortex-A15 cores and another four Cortex-A7 cores.
The H2 will be able to handle four streams of 1080p video, including Blu-Ray at 60 frames per second, according to Renesas. Mass production is scheduled for the middle of next year, while the M2 won’t arrive in larger volumes until June 2015.
Broadcom on the other hand is seeking to drive better networking on the road. The company’s latest line of wireless chipsets for in-car connectivity uses the fast 802.11ac Wi-Fi wireless standard, which offers enough bandwidth for multiple displays and screen resolution of up to 1080p. Use of the 5GHz band for video allows it to coexist with Bluetooth hands-free calls on 2.4GHz, according Broadcom.
Broadcom has also implemented Wi-Fi Direct and Miracast. Wi-Fi Direct lets products such as smartphones, cameras and in this case in-car computers connect to one another without joining a traditional hotspot network, while Miracast lets users stream videos and share photos between smartphones, tablets and displays.
The BCM89335 Wi-Fi and Bluetooth Smart Ready combo chip and the BCM89071 Bluetooth and Bluetooth Smart Ready chip are now shipping in small volumes.
Marvell Loses In Court
A federal judge denied Marvell’s request to declare a mistrial in a patent infringement case in which a jury awarded $1.17 billion in damages to Carnegie Mellon University.
Carnegie Mellon sued Marvell in March 2009 over patents issued in 2001 and 2002 related to how accurately hard disk-drive circuits read data from high-speed magnetic disks. The suit involved nine Marvell circuits which incorporated the patents, and that the infringement let the Bermuda outfit blog billions of chips with its tech on board.
The damages award in December 2012 was one of the largest by a US jury in a patent infringement case. Marvell asked the judge to declare a mistrial and it claimed that Carnegie Mellon’s lawyer made improper, misleading and prejudicial comments during closing arguments that “inflamed” the jury.
US District Judge Nora Barry Fischer in Pittsburgh federal court disagreed and said that Marvell was trying to do what it could not do at trial convince the court to throw out this case and have another crack at it. Marvel has said that it will appeal so this case will run and run.
Marvell Outs New WiFi Chip
Marvell has shed some light on its new Avastar 88W8897 802.11ac low power WiFi chip. In addition to up to 867Mbps of WiFi transfer throughput, the new chip also integrates Bluetooth 4.0, near field communications (NFC) as well as Wi-Fi certified Miracast and integrated location engine. Aimed at notebooks, ultrabooks, tablets, gaming consoles and smart TVs, the new Avastar 88W8897 is expected to show up in various devices around this time next year.
The implementation of 802.11ac standard and Bluetooth 4.0 in the same chip is not something that we have not seen so far, but with NFC, it is certainly becomes a quite interesting chip. As noted, the new Avastar 88W8897 will feature 867Mbps of transfer throughput which is not as fast as we are other chip manufacturers but still faster than 802.11n. Marvell reckons that 802.11ac is still young but should become a big thing as of next year.
Marvell also claims that the Avastar 88W8897 SoC offers the highest level of integration available enabling a rest of bill of materials footprint reduction of 40 to 50 percent and cost reduction of 75 percent when combined to previous wireless solutions. The Wi-Fi certified Miracast, expected to be certified later this year, 802.11ac transfer speeds and Marvell’s dynamic rapid channel switching (DRCS) technology will allow users to stream video from a smaller device like tablet to a larger display while simultaneously surfing the net without losing the connection in 2.4GHz. The last, but not least, is the integrated location engine that enables accurate indoor positioning by implementing 802.11v time of flight protocol inside the hardware.
AMD Ships One Million Llano Processors
It appears that AMD has successfully managed to ship one million Llano chips in the second quarter, which is weeks ahead of the official launch.
AMD released the news during its earnings conference call. Where interim CEO Thomas Seifert said demand for Llano was strong. “We expect Llano ramp to outpace the Brazos ramp,” he noted.
If you look back at AMD’s Brazos launch, they managed to ship around one million units ahead of its scheduled launch, in the fourth quarter of 2010. Conversely, introducing Llano will be a bit more challenging, because AMD is planning to offer many varieties of mobile and desktop SKUs; including affordable dual- and triple-core processors. Therefore, Llano is expected to outpace Brazos very soon. AMD also made mention in their earnings call that total APU shipments for the quarter hit seven million. That said, so 6 million of them were Brazos processors.
It is believed that AMD Llano chip will take 50 percent of their total CPU shipments by the end of the year. In the first quarter of 2012, the Llano is expected to garner over 60 percent of their shipments.
AMD A75 Motherboards Economically Priced
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It appears that AMD’s A75 motherboards have finally started to hit the streets. Furthermore, we were truly shocked to see these MB’s economically priced for about $60.00.
Do not get too over excited in reference to the pricing because this gets you a decent A75 micro-ATX motherboard with up to four USB 3.0 ports and six SATA 6Gbps ports matched with a FM1 socket. It’s also worth pointing out that you will not get these same features like USB 3.0 and SATA 6Gbps on a comparable Intel platform in the same price range; you’d pay more.
We noticed that online retailer Newegg.com has an AMD motherboard selling for $59.99 after the rebate; otherwise it will cost $72.99. We expect the more serious computer geeks to opt for more muscle in regards to their motherboards; so they can whet their appetite for a good A75 for about $150.00.
Intel Z68 Chipset Coming
Sources in the tech industry are claiming that the Z68 chipset from Intel is scheduled to debut on May 8th.
The Z68 is specifically designed for high-end Sandy Bridge processors since it is equipped with additional features that are apparently absent on current P67 and H67 boards.
The Z68 is said to have improved overclocking performance, in addition to support for RST SSD caching and a slew of extra enhancements geared towards the high-end markets.
Intel Outs New Processors
Intel is not letting their Sandy Bridge design go to waste. They will soon release a series of Xeon server chips based on the 32nm Sandy Bridge core.The new chips have a maximum capacity of 10 cores, with hyper-threading and they are expected to deliver a 40 percent performance increase over the previous Xeon 7500 series.
Intel’s Next CPU Faster Than Sandy Bridge
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We hear that Intel is already in discussion with its partners about the 22nm Ivy Bridge CPU, and the talks cover the chips performance. The 22nm processor supposedly offers more performance with a similar thermal design.
Intel is informing its buddies to expect a 20 percent performance increase over Sandy Bridge, which is about the same gain that Sandy Bridge had over Nehalem based CPUs. Keep in mind this is an optical shrink of the existing 32nm Sandy Bridge architecture. Intel traditionally takes a very safe process when it moves from one manufacturing process to another. The 22nm Ivy Bridge comes with the new architecture and will debut in time to take on Bulldozer and Llano from AMD.